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  • ...ating over a large number of hash table entries to find the item needed is CPU intensive and mIRC might start to feel unresponsive.
    30 KB (5,149 words) - 01:46, 30 November 2018
  • * CPU Instructions
    18 KB (2,445 words) - 08:24, 9 November 2019
  • | [[Config register - MIPS|Config]] || 16 || rowspan="4" | CPU setup
    3 KB (384 words) - 10:11, 19 February 2018
  • === Dispatching example - CPU info === ;get some cool information about the CPU here
    27 KB (3,608 words) - 11:41, 25 October 2018
  • ...ly available [[microprocessor]]. The 4004 was a [[4-bit architecture|4-bit CPU]], designed for use in the [[Busicom]] 141-PF printing calculator<ref>[http
    5 KB (748 words) - 21:37, 21 November 2021
  • | image = Rockwell PPS4 11660 CPU.jpg ...It's full compatible with all the original {{rockwell|pps-4/10660|PPS-4}} CPU and all the other parts.
    2 KB (240 words) - 16:32, 13 December 2017
  • | arch = 4-bit ...ROM]] chip, a [[RAM]] chip, [[shift register]], and a [[4-bit architecture|4-bit]] [[microprocessor]]. The chipset was first produced first quarter of 1975.
    2 KB (266 words) - 00:54, 19 May 2016
  • ...10, its CPU was also a custom-designed [[transistor-transistor logic|TTL]] CPU. ...[[Voyager Flight Data System|Voyager's data computer]], which was a custom 4-bit CMOS microprocessor.
    11 KB (1,334 words) - 18:26, 10 May 2019
  • | caption = Intel D3002, CPU of the 3000 series | {{\|3002}} || CPU
    3 KB (308 words) - 05:03, 18 February 2020
  • ...iterations per chunk (bearing in mind that it may run on PCs of different CPU powers). Clearly you want to keep the iterations small enough that mIRC con
    13 KB (2,047 words) - 07:44, 23 February 2023
  • | arch = 4-bit word, 8-bit instruction, BCD-oriented ...re chipset was made of four individual chips, including the [[/4004|4004]] CPU which became the first commercial microprocessor. MCS-4 was completed by Ma
    4 KB (433 words) - 22:40, 27 June 2019
  • {{see also|intel/frequency_behavior|l1=Intel's CPU Frequency Behavior}}
    4 KB (460 words) - 15:03, 24 March 2019
  • ...em to function as a single computer on a chip. This usually includes the [[CPU]], [[program memory|program]] and [[data memory]], [[programmable I/O|progr
    2 KB (344 words) - 15:51, 21 March 2024
  • | arch = 4-bit words, 8-bit instruction The '''PPS-4''' (Parallel Processing System - 4-bit word) was a [[microprocessor family|family]] of {{arch|4}} [[microprocessor
    3 KB (359 words) - 17:26, 19 May 2016
  • ...1980 Catalog, "μCOM-4: 4-Bit Single Chip Microcomputer Family, μCOM-43SL CPU μPD557L", 104, 125-126 pp. *NEC Microcomputers, Inc., 1981 Catalog, "μCOM-4: 4-Bit Single Chip Microcomputer Family, μPD557L μCOM-43SL", 155, 177-178 pp.
    2 KB (244 words) - 06:13, 1 August 2018
  • | arch = 4-bit words, 8-bit instruction ...system (hence the "/1"). It's full compatible with all the original PPS-4 CPU and all the other parts.
    2 KB (219 words) - 01:00, 19 May 2016
  • ...power came from its simplicity, being an [[in-order]] dual-issue pipelined CPU. All Bonnell-based processors were manufactured on Intel's [[45 nm process] Silverthorne chips have an incredibly simple design featuring only the CPU itself on-die. The [[southbridge]] and [[northbridge]] are integrated on a
    17 KB (2,292 words) - 09:32, 16 July 2019
  • | caption = The F3850 [[CPU]] component | {{\|3850}} || [[CPU]]
    2 KB (172 words) - 17:18, 12 December 2016
  • The CPU 6309 by HITACHI has secret features which is not written in with instructions of the Hitachi 6301 CPU. Read the manual of the 6301
    31 KB (2,938 words) - 14:54, 17 March 2016
  • | caption = CPU, {{\|8008-1}} higher speed variant ...[Intel]]. Introduced on April, [[1972]], the MCS-8 featured the {{\|8008}} CPU.
    3 KB (382 words) - 17:58, 19 May 2016
  • | caption = {{\|8080}}, the CPU of the MCS-80 system ...y [[Intel]]. Introduced on April, 1974, the MCS-80 featured the {{\|8080}} CPU, the forefather of all modern [[x86]]-based microprocessors.
    4 KB (406 words) - 16:10, 26 January 2019
  • | process 1 name = P1268 (CPU) / P1269 (SoC)
    10 KB (1,090 words) - 19:14, 8 July 2021
  • | process 1 name = P1272 (CPU) / P1273 (SoC) ...or performance and high frequency (e.g., high-switching circuitry in the [[CPU]]) whereas short cells are optimized for density (e.g., GPU shader arrays).
    17 KB (2,243 words) - 19:32, 25 May 2023
  • | colspan="2" | P1266 (CPU) / P1266.8 (SoC) / P1269 (SoC) || colspan="2" | CS-300 || colspan="2" | ||
    5 KB (602 words) - 05:51, 20 July 2018
  • |atype=CPU ...tel turned to higher integration, moving [[integrated graphics|Graphics]], CPU core, Video Acceleration, [[Display Controller]], and [[Memory Controller]]
    38 KB (5,468 words) - 20:29, 23 May 2019
  • | atype = CPU <tr><th colspan="8">CPU</th><th colspan="3">IGP</th></tr>
    7 KB (872 words) - 19:42, 30 November 2017
  • | atype = CPU
    9 KB (1,160 words) - 09:35, 25 September 2019
  • | atype = CPU
    5 KB (568 words) - 19:40, 30 November 2017
  • |atype=CPU
    7 KB (956 words) - 23:05, 23 March 2020
  • <tr><th colspan="8">CPU</th><th colspan="3">IGP</th></tr> ...ated the [[integrated graphics]] on this same die as the newly architected CPU, allowing for higher performance and lower power than previous generation.
    20 KB (2,661 words) - 00:45, 11 October 2017
  • <tr><th colspan="8">CPU</th><th colspan="3">IGP</th></tr>
    25 KB (3,201 words) - 03:13, 22 September 2018
  • All models are a single-chip solution, meaning both the [[CPU]] [[die]] and the [[chipset]] die are packaged together on the same substra All models are a single-chip solution, meaning both the [[CPU]] [[die]] and the [[chipset]] die are packaged together on the same substra
    13 KB (1,784 words) - 08:04, 6 April 2019
  • |atype=CPU ...l]] [[instance of::microprocessor]] [[microarchitecture::Broadwell]] [[max cpu count::1]]
    14 KB (1,891 words) - 14:37, 6 January 2022
  • |atype=CPU ==== CPU changes ====
    27 KB (3,750 words) - 06:57, 18 November 2023
  • | atype = CPU * 4 CPU cores
    5 KB (689 words) - 13:44, 2 May 2020
  • |atype=CPU ...diagram from Intel. The master design incorporates the [[quad-core|four]] CPU [[physical cores|cores]], the [[GPU]] with 12 execution units, the 8 MiB sh
    84 KB (13,075 words) - 00:54, 29 December 2020
  • | atype = CPU ...l]] [[instance of::microprocessor]] [[microarchitecture::Westmere ]] [[max cpu count::1]]
    10 KB (1,258 words) - 21:07, 9 March 2018
  • | atype = CPU
    4 KB (459 words) - 21:44, 26 December 2023
  • | atype = CPU
    3 KB (325 words) - 21:34, 22 February 2020
  • |atype=CPU **** Limits motherboard trace design to 7 inches max from the CPU to chipset (down from 8)
    79 KB (11,922 words) - 06:46, 11 November 2022
  • |atype=CPU ...her via Intel's standard [[DMI 3.0]] bus interface which utilizes 4 of the CPU's 20 [[PCIe]] 3.0 lanes (having a transfer rate of 8 GT/s per lane). Only {
    38 KB (5,431 words) - 10:41, 8 April 2024
  • |atype=CPU * 2 CPU cores + 40 GPU EUs
    7 KB (887 words) - 12:53, 5 August 2019
  • |atype=CPU ...in-and-light market. The microprocessor consists of five major components: CPU cores, LLC, {{intel|ring interconnect}}, {{intel|system agent}}, and {{\\|G
    23 KB (3,613 words) - 12:31, 20 June 2021
  • |atype=CPU
    3 KB (406 words) - 10:46, 19 July 2023
  • {{see also|intel/frequency_behavior|l1=Intel's CPU Frequency Behavior}}
    4 KB (564 words) - 14:29, 24 March 2019
  • | process 1 name = P1274 (CPU) / P1275 (SoC) ** CPU
    14 KB (1,903 words) - 06:52, 17 February 2023
  • == CPU Families == '''CPU:'''
    3 KB (261 words) - 16:48, 20 March 2024
  • File:Intel i486 DX33 CPU SX 419.jpg|A80486DX-33, S-Spec SX419
    3 KB (321 words) - 02:59, 18 December 2017
  • | image = CPU Intel 80486DX-50.JPG File:Intel i486 DX 50 CPU.jpg|A80486DX-50, S-Spec SX710
    3 KB (265 words) - 16:13, 13 December 2017
  • | image = Ic-photo-Intel--SB80486DX2-50--(486-CPU).JPG
    3 KB (345 words) - 16:13, 13 December 2017
  • File:Intel i486 DX2 66 CPU SX750.jpg|A80486DX2-66, S-Spec SX750 File:Intel i486 DX2 66 CPU SX955.jpg|A80486DX2-66, S-Spec SX955
    4 KB (372 words) - 06:28, 15 February 2024
  • | image = Ic-photo-Intel--FC80486DX4-75--(486-CPU).png
    3 KB (354 words) - 16:13, 13 December 2017
  • Ic-photo-Intel--A80486DX4100-(486DX4-CPU).png|A80486DX4100, S-Spec SK096
    4 KB (414 words) - 16:13, 13 December 2017
  • File:Ic-photo-Intel--SB80486SX-33--(486-CPU).JPG|SB80486SX-33
    4 KB (345 words) - 16:14, 13 December 2017
  • | image = Ic-photo-AMD--Am486DX-40-(A80486DX-40)-(486-CPU).jpg File:AMD Am486 DX 40 CPU E.jpg
    3 KB (270 words) - 15:18, 13 December 2017
  • This is the fastest regular 486-type CPU that has also been available as a native 5 Volt part.
    1 KB (209 words) - 21:53, 7 February 2024
  • File:AMD Am486 DX2 66 CPU E6.jpg| File:AMD Am486 DX2 66 CPU D.jpg
    3 KB (286 words) - 15:18, 13 December 2017
  • | image = Ic-photo-AMD--A80486DX4-100NV8T-(486-CPU).png File:AMD Am486 DX4 100 NV8T CPU.jpg|
    3 KB (348 words) - 15:19, 13 December 2017
  • * [[:File:CPU Thermal Management (Am486, Am5x86, K5) (August 1995).pdf|CPU Thermal Management]]; Publication #18448 Revision D/0; August 1995.
    7 KB (1,043 words) - 16:50, 14 June 2020
  • | image = Ic-photo-AMD--Am5x86-P75-(Am486DX5-133W16BGC)-(486-CPU).jpg File:Ic-photo-AMD--Am5x86-P75-(Am486DX5-133W16BGC)-(486-CPU).jpg|1997, Week 46
    3 KB (358 words) - 15:19, 13 December 2017
  • File:Ic-photo-AMD--AM486DX5-133V16BHC--(Am5x86-P75)--(486-CPU).JPG
    3 KB (342 words) - 15:19, 13 December 2017
  • File:Ic-photo-AMD--AMD-X5-133ADW-(Am5x86-P75)-(586-CPU).png|From 1996 Week 10
    3 KB (336 words) - 15:19, 13 December 2017
  • | image = Ic-photo-AMD--N80L286-16 S-(286-CPU).png
    3 KB (281 words) - 15:18, 13 December 2017
  • | image = Ic-photo-AMD--R80286-10 S-(286-CPU).png
    3 KB (296 words) - 15:18, 13 December 2017
  • * CPU shutdown mode; System shutdown mode
    3 KB (339 words) - 15:18, 13 December 2017
  • * CPU shutdown mode; System shutdown mode
    3 KB (339 words) - 15:18, 13 December 2017
  • | image = Ic-photo-AMD--N80C186-(186-CPU).png
    3 KB (280 words) - 04:32, 22 October 2019
  • | image = Ic-photo-AMD--N80C186-16-(186-CPU).png
    3 KB (286 words) - 15:17, 13 December 2017
  • | image = Ic-photo-AMD--R80186-6 B4-(186-CPU).png
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  • |?max cpu count
    4 KB (482 words) - 05:08, 18 February 2020
  • ...e 1025 model is the same as the 1024 model with an additional IBM Power PC CPU core incorporated as well for general-purpose tasks. These two models appea
    2 KB (254 words) - 03:53, 25 June 2016
  • *** 2x SRD {{arch|32}} CPU *** 2x RD {{arch|32}} CPU
    3 KB (367 words) - 15:16, 13 December 2017
  • *** 2x SRD {{arch|32}} CPU *** 2x RD {{arch|32}} CPU
    3 KB (280 words) - 15:16, 13 December 2017
  • *** 2x SRD {{arch|32}} CPU *** 2x RD {{arch|32}} CPU
    3 KB (280 words) - 15:16, 13 December 2017
  • *** 2x SRD {{arch|32}} CPU *** 2x RD {{arch|32}} CPU
    3 KB (280 words) - 15:16, 13 December 2017
  • *** 2x SRD {{arch|32}} CPU *** 2x RD {{arch|32}} CPU
    3 KB (344 words) - 15:16, 13 December 2017
  • *** 2x SRD {{arch|32}} CPU *** 2x RD {{arch|32}} CPU
    3 KB (256 words) - 15:16, 13 December 2017
  • *** 2x SRD {{arch|32}} CPU *** 2x RD {{arch|32}} CPU
    3 KB (256 words) - 15:16, 13 December 2017
  • | arch = 32-bit vector/matrix math processor + RISC cpu ...as a family of matrix and vector math processors with an on-die [[RISC]] [[CPU]]s introduced by [[Intrinsity]]. The chips were developed using Intrinsity'
    4 KB (464 words) - 17:41, 3 July 2016
  • ...erating at 1.5 GHz. The processor incorporates a high-performance [[MIPS]] CPU along with a powerful matrix and vector math unit.
    3 KB (317 words) - 16:30, 13 December 2017
  • ...operating at 2 GHz. The processor incorporates a high-performance [[MIPS]] CPU along with a powerful matrix and vector math unit.
    3 KB (318 words) - 16:30, 13 December 2017
  • ...operating at 1 GHz. The processor incorporates a high-performance [[MIPS]] CPU along with a powerful matrix and vector math unit. This mode was a low-powe
    3 KB (334 words) - 16:31, 13 December 2017
  • ...operating at 3 GHz. The processor incorporates a high-performance [[MIPS]] CPU along with a powerful matrix and vector math unit.
    3 KB (306 words) - 16:31, 13 December 2017
  • File:Ic-photo-AMD--AMD-SSA 5-75ABR-(AMD5k86-P75-CPU).png
    3 KB (313 words) - 16:08, 13 December 2017
  • File:Ic-photo-AMD--AMD-K5-PR100ABQ-(K5-CPU).jpg
    3 KB (308 words) - 16:07, 13 December 2017
  • File:Ic-photo-AMD--AMD-K6-166ALR-(K6-CPU).jpg|166ALR, Week 35, 1997 File:Ic-photo-AMD--AMD-K6-166ALR-(K6-CPU).png|166ALR, Week 35, 1997
    3 KB (343 words) - 16:09, 13 December 2017
  • |atype=CPU The Coffee Lake system on a chip consists of a five major components: CPU [[physical core|cores]], [[last level cache|LLC]], Ring interconnect, {{int
    30 KB (4,192 words) - 13:48, 10 December 2023
  • | image = Ic-photo-AMD--AMD-K6-2 333AFR-(K6-2-CPU).png
    3 KB (387 words) - 16:08, 13 December 2017
  • | image = Ic-photo-AMD--AMD-K6-2 500AFX-(K6-2-CPU).png
    3 KB (353 words) - 16:08, 13 December 2017
  • | image = Ic-photo-AMD--AMD-K6-2 380ACK--(K6-2 CPU).jpg
    3 KB (347 words) - 16:08, 13 December 2017
  • ...ame pinout and bus interface, a single system can be used by replacing the CPU between tests. Section 3 lists the hardware components for the systems and
    11 KB (1,244 words) - 06:26, 8 July 2020
  • | image = CPU AMD Duron 800.jpg
    4 KB (438 words) - 16:07, 13 December 2017
  • | image = Ic-photo-AMD--D900AUT1B-(K7-Duron-CPU).png
    4 KB (437 words) - 16:07, 13 December 2017
  • ...] core (+L1$), an L1.5 cache, L2 cache, a [[floating-point unit]] (FPU), a CPU Cache-Crossbar (CCX) arbiter, and three [[network on chip]] (NoC) routers.
    6 KB (731 words) - 15:41, 5 July 2018
  • | atype = CPU
    4 KB (578 words) - 18:57, 22 May 2019
  • |atype=CPU ...s by amd]] [[instance of::microprocessor]] [[microarchitecture::K7]] [[max cpu count::1]]
    6 KB (923 words) - 16:48, 3 March 2022
  • |atype=CPU
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  • | atype = CPU
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  • |atype=CPU
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  • |atype=CPU
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  • |atype=CPU [[File:ryzen threadripper.png|right|thumb|First 16-core HEDT market CPU]]
    79 KB (12,095 words) - 15:27, 9 June 2023
  • |atype=CPU Zen 2 organizes CPU cores in a core complex (CCX). A CCX comprises four cores sharing a 16 MiB,
    57 KB (8,701 words) - 22:11, 9 October 2022
  • | image = Ic-photo-AMD--AMD-K6-III 333AFK-(K6-CPU).jpg
    3 KB (362 words) - 16:09, 13 December 2017
  • ...tel]][[microprocessor family::Xeon E5]][[microarchitecture::Haswell]][[max cpu count::4]] |?max cpu count
    11 KB (1,395 words) - 08:36, 4 November 2020
  • {{see also|intel/frequency_behavior|l1=Intel's CPU Frequency Behavior}}
    5 KB (567 words) - 00:55, 29 April 2018
  • File:AMD Athlon 4 (cpu and wafer).gif
    2 KB (199 words) - 17:44, 17 November 2016
  • File:Ic-photo-AMD--AM9080ADC-(8080-CPU).png
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  • | image = Ic-photo-AMD--AM9080APCB-(8080-CPU).png
    2 KB (229 words) - 15:20, 13 December 2017
  • ...e are Intel's fifth generation integrated GPUs and first packaged GPU with CPU. <tr><th colspan="10">CPU</th><th colspan="3">IGP</th><th colspan="4">Features</th></tr>
    3 KB (378 words) - 03:16, 1 December 2016
  • <tr><th colspan="10">CPU</th><th colspan="3">IGP</th><th colspan="4">Features</th></tr>
    4 KB (537 words) - 01:12, 28 August 2017
  • |atype=CPU * Mair, Hugh T., et al. "4.3 A 20nm 2.5 GHz ultra-low-power tri-cluster CPU subsystem with adaptive power allocation for optimal mobile SoC performance
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  • The Helio X20 is designed is composed of 3 individual clusters of CPU cores depending on the level of performance required by the active applicat * Mair, Hugh T., et al. "4.3 A 20nm 2.5 GHz ultra-low-power tri-cluster CPU subsystem with adaptive power allocation for optimal mobile SoC performance
    6 KB (713 words) - 21:16, 2 May 2021
  • The Helio X20 is designed is composed of 3 individual clusters of CPU cores depending on the level of performance required by the active applicat
    6 KB (617 words) - 02:35, 14 December 2019
  • The Helio X20 is designed is composed of 3 individual clusters of CPU cores depending on the level of performance required by the active applicat
    5 KB (581 words) - 14:25, 12 September 2019
  • The Helio X23 is designed is composed of 3 individual clusters of CPU cores depending on the level of performance required by the active applicat
    5 KB (574 words) - 04:36, 23 June 2019
  • The Helio X27 is identical to {{\\|Helio X20}} with higher CPU clocks speed and higher GPU clock speed. Additionally this model also suppo The Helio X27 is designed is composed of 3 individual clusters of CPU cores depending on the level of performance required by the active applicat
    5 KB (600 words) - 08:55, 12 October 2023
  • The Helio X30 is designed is composed of 3 individual clusters of CPU cores depending on the level of performance required by the active applicat * Mair, Hugh, et al. "3.4 A 10nm FinFET 2.8 GHz tri-gear deca-core CPU complex with optimized power-delivery network for mobile SoC performance."
    4 KB (549 words) - 16:22, 29 December 2018
  • ...(MT6755M) is identical to the regular {{\\|MT6755}} except for the GPU and CPU lower clock speeds.
    5 KB (614 words) - 09:40, 12 February 2020
  • ...ical to the {{\\|Helio P10}} with higher clock speeds for both the GPU and CPU.
    4 KB (552 words) - 23:18, 3 November 2019
  • ...al to the {{\\|Helio P20}} apart from the higher clock speeds for both the CPU and GPU.
    4 KB (564 words) - 06:22, 30 March 2021
  • | atype = CPU <tr><th colspan="9">CPU</th><th colspan="3">Memory</th><th colspan="5">[[Hardware Accelerators]]</t
    7 KB (870 words) - 19:38, 23 June 2017
  • <tr><th colspan="7">CPU</th><th colspan="3">Memory</th><th colspan="5">[[Hardware Accelerators]]</t <tr><th colspan="7">CPU</th><th colspan="3">Memory</th><th colspan="5">[[Hardware Accelerators]]</t
    11 KB (1,489 words) - 09:25, 30 December 2020
  • <tr><th colspan="7">CPU</th><th colspan="3">Memory</th><th colspan="4">[[Hardware Accelerators]]</t <tr><th colspan="7">CPU</th><th colspan="3">Memory</th><th colspan="5">[[Hardware Accelerators]]</t
    6 KB (827 words) - 15:41, 29 December 2016
  • ==CPU Families==
    2 KB (269 words) - 18:40, 31 August 2021
  • ...solution - the [[chipset]] is packaged in the same physical casing as the CPU in a [[multi-chip package]] (MCP). Communication between the separate dies
    4 KB (594 words) - 06:30, 6 April 2019
  • ...ince they incorporate an on-package cache (OPC) in addition to the hub and CPU. Communication between the separate dies are done via a lightweight On-Pack
    6 KB (820 words) - 14:10, 29 February 2020
  • ...SKU || EUs || CPU Stepping<ref group=devID>The CPU Stepping is the actual CPU design stepping.</ref> || GT Stepping<ref group=devID>The GT Stepping refer * Enhanced "14nm+" process (while CPU cores base frequency was increased, GPU speed remains unchanged)
    29 KB (3,752 words) - 13:14, 19 April 2023
  • ...SKU || EUs || CPU Stepping<ref group=devID>The CPU Stepping is the actual CPU design stepping.</ref> || GT Stepping<ref group=devID>The GT Stepping refer ...iB/CPU core || ~2MiB/CPU core || ~2MiB/CPU core || ~2MiB/CPU core || ~2MiB/CPU core
    33 KB (4,255 words) - 17:41, 1 November 2018
  • |atype=CPU ! Compiler !! CPU !! Arch-Favorable
    14 KB (1,905 words) - 23:38, 22 May 2020
  • | atype = CPU
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  • | atype = CPU
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  • | atype = CPU
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  • | atype = CPU
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  • | atype = CPU
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  • |atype=CPU
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  • {{see also|intel/frequency_behavior|l1=Intel's CPU Frequency Behavior}}
    3 KB (517 words) - 10:12, 24 October 2018
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  • |atype=CPU
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  • |atype=CPU
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  • |atype=CPU ...y amd]] [[instance of::microprocessor]] [[microarchitecture::Zen 3]] [[max cpu count::1]]
    15 KB (1,978 words) - 22:13, 6 April 2023
  • | process 1 name = P1278 (CPU), P1279? (SoC)
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  • | atype = CPU
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  • ...hat is usually shared by all the functional units on the chip (e.g. [[core|CPU cores]], [[IGP]], and [[DSP]]) ...d [[L2$]] and the GPU has its own L1, L2, and L3 cache. Therefore from the CPU core perspective, the LLC is effectively an L3 cache whereas from the GPU p
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  • {{intel proc tech |year=2003 |name=P1262 (CPU)<br>P1263 (SoC, I/O) |mlayers=7 |node=90 nm {{intel proc tech |year=2005 |name=P1264 (CPU)<br>P1265 (SoC, I/O) |mlayers=8 |node=65 nm
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  • ...by intel]] [[instance of::microprocessor]] [[core name::Skylake SP]] [[max cpu count::2]] ...by intel]] [[instance of::microprocessor]] [[core name::Skylake SP]] [[max cpu count::4]]
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  • <tr><th>7xxx</th><td>High-performance server CPU/SOC (Zen 1 to Zen 3)</td></tr> <tr><th>9xxx</th><td>High-performance server CPU/SOC (Zen 4)</td></tr>
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  • {{#ask: [[Category:microprocessor models by amd]] [[core name::Rome]] [[max cpu count::1]] {{#ask: [[Category:microprocessor models by amd]] [[core name::Rome]] [[max cpu count::>>1]]
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  • EPYC 7003 processors identify as members of {{amd|CPUID#Family 25 (19h)|AMD CPU Family 19h, Model 01h}} (engineering samples as Model 00h). ...he "Milan" CCD contains a single {{amd|Zen 3|l=arch}} CCX comprising eight CPU cores (the number of usable cores varies by <abbr title="Store Keeping Unit
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  • | atype = CPU
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  • ...chip solution - the chipset is packaged in the same physical casing as the CPU in a [[multi-chip package]] (MCP) along with the [[eDRAM]]. Communication b
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  • * 4 CPU cores + 24 GPU EUs
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  • * 4 CPU cores + 24 GPU EUs
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  • * 4 CPU cores + 24 GPU EUs
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  • |atype=CPU
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  • ...solution - the [[chipset]] is packaged in the same physical casing as the CPU in a [[multi-chip package]] (MCP). Communication between the separate dies
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  • |atype=CPU
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  • ...s architecture is utilized by [[AMD]]'s recent microarchitectures for both CPU (i.e., {{amd|Zen|l=arch}}) and graphics (e.g., {{amd|Vega|l=arch}}), and an ...=arch}}, the block diagram of the SDF is shown on the right. The two {{amd|CPU Complex|CCX's}} are directly connected to the SDF plane using the '''Cache-
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  • |atype=CPU
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  • |atype=CPU
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  • This CPU supports 8 DIMMs of rates 1,333 MT/s - 3,200 MT/s (UDIMM/SODIMM).
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  • This CPU supports 8 DIMMs of rates 1,333 MT/s - 3,200 MT/s (UDIMM/SODIMM).
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  • |atype=CPU
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  • ...ince they incorporate an on-package cache (OPC) in addition to the hub and CPU. Communication between the separate dies are done via a lightweight On-Pack
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  • The 135 W of TDP for this microprocessor consists of 127 W for the CPU and 8 W for the fabric. {{see also|intel/frequency_behavior|l1=Intel's CPU Frequency Behavior}}
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  • The 135 W of TDP for this microprocessor consists of 127 W for the CPU and 8 W for the fabric. {{see also|intel/frequency_behavior|l1=Intel's CPU Frequency Behavior}}
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  • ...isabled if power or thermal limits are reached instead of downclocking the CPU core which also affects uncritical instructions. If AVX-512 features are no ...lly zeros the elements in the destination where the corresponding bit in a 4-bit mask is set. The indices and the mask are constants in an immediate byte. B
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  • |atype=CPU
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  • |atype=CPU ...imits motherboard trace design to 7 inches max from (down from 8) from the CPU to chipset
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  • | Top 98% || 4.9 GHz || -2 || 1.387 V || || 97% || 4.9 GHz || -2 || CPU Vcore: 1.385 V | Top 84% || 5.0 GHz || -2 || 1.400 V || || 88% || 5.0 GHz || -2 || CPU Vcore: 1.400 V
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  • * 4 CPU cores + 24 GPU EUs
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  • == CPU ==
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  • ...architecture which incorporated both the IMC, integrated graphics, and the CPU [[physical core|cores]] onto the same monolithic die. All models communicat
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  • ...by the main clock -- to generate regular timing pulses that interrupt the CPU for pre-emptive multitasking.
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  • ...es which incorporated an on-package cache (OPC) in addition to the hub and CPU. Communication between the separate dies are done via a lightweight On-Pack
    5 KB (751 words) - 09:52, 11 February 2019
  • ...change is semi-permanent and is associated with a motherboard and not the CPU. Activation is likely saved on the motherboard along with the [[BIOS]]. The ...tive [https://www.pcper.com/news/Processors/Intel-selling-scratch-software-CPU-upgrades noted] that for the Pentium part, it's only $15 to buy a Core i3 i
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  • | atype = CPU
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  • ...ng 50% less power and performing around 25 times faster than a traditional CPU for tasks such as photo recognition. The NPU is said to deliver 1.92 [[TFLO
    6 KB (824 words) - 17:25, 1 January 2022
  • ...event on September 12 2017, the ''A11 Bionic'' features six {{arch|64}} [[CPU]] [[physical core|cores]]. Fabricated on [[TSMC]]'s [[10 nm process]], the
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  • ...ollers]] and the CPUs and GPU. The bus maintains [[coherency]] between the CPU cores and the GPU. For the GPU, each of the 12 [[memory channel|channels]] ...essors such as typical [[CPU]]s and [[GPU]]s, when a core in the case of a CPU or a shader unit in the case of a GPU has a defect, it's common for manufac
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  • ...re point ''A'' and convert it to the much lower operating voltage of the [[CPU]] or [[GPU]] at point ''B'' which is something like 1.2 V. ...reaches 12 V. The graph below depicts the voltage that would be fed to the CPU/GPU at point ''B'' if the high-side switch was to remain closed for a suffi
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  • ...ters. Each cluster consists of a router, a directory control unit (DCU), 4 CPU [[physical core|cores]] and a shared cache. Attached to each SuperNode are
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  • ...ries of mainstream mobile and desktop APUs based on the {{amd|Zen|l=arch}} CPU and {{amd|Vega|l=arch}} GPU microarchitectures succeeding {{\\|Bristol Ridg
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  • ZettaScalers use a host CPU (typically a {{intel|Xeon E5}}) which is then used to offload work to the {
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  • * June 24: Fujitsu announces their {{fujitsu|Post-K|l=arch}} CPU prototype was complete
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  • |image=Ic-photo-Sun--STP1030BGA-143--(Ultra SPARC-CPU).jpg
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  • ...and their impact. It does this by updating the synaptic weights using the 4-bit microcode-programmed learning rules that are specifically associated with t ...or a silicon cochlea. The board communicates with a standard "super host" CPU which can be used to send commands to the board and to the management core
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  • |atype=CPU ...(four in total) over a {{intel|UPI}} link. With two dies per package, each CPU exposes 12 DDR4 memory channels and x40 PCIe Gen3 lanes.
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  • | atype = CPU
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  • ...ies of mainstream mobile and desktop APUs based on the {{amd|Zen+|l=arch}} CPU and {{amd|Vega|l=arch}} GPU microarchitectures succeeding {{\\|Raven Ridge}
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  • Note that this part is fully unlocked. That is, the CPU, the GPUs, and the HBM are overclockable.
    6 KB (851 words) - 14:20, 18 June 2018
  • ...eaving the 8 remaining lanes for other peripherals to communicate with the CPU directly.
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  • ...tandards such as Functional safety [[ISO-26262]] and [[ASIL]] level C. The CPU cluster is fully [[cache coherent]] and the coherency is extended to all th === CPU ===
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  • |atype=CPU
    2 KB (313 words) - 12:10, 12 December 2019
  • |atype=CPU ...nstructions testing more than 300 different kinds of software, testing the CPU, GPU, memory controller, and bus.
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  • |atype=CPU ...]] for the sole purpose of developing high-performance, low-power, complex CPU and System IPs. A large portion of the design team consists of many ex-[[AM
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  • |atype=CPU *** 16 B/cycle/CPU bandwidth
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  • |atype=CPU
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  • ...ers and edge devices. This [[multi-chip package|multi-chip processor]] has CPU cores based on the {{amd|Zen|Zen microarchitecture|l=arch}} and is fabricat
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  • ...ers and edge devices. This [[multi-chip package|multi-chip processor]] has CPU cores based on the {{amd|Zen|Zen microarchitecture|l=arch}} and is fabricat
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  • ...ers and edge devices. This [[multi-chip package|multi-chip processor]] has CPU cores based on the {{amd|Zen|Zen microarchitecture|l=arch}} and is fabricat
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  • ...ers and edge devices. This [[multi-chip package|multi-chip processor]] has CPU cores based on the {{amd|Zen|Zen microarchitecture|l=arch}} and is fabricat
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  • ...] in early [[2018]] for dense servers and edge devices. This processor has CPU cores based on the {{amd|Zen|Zen microarchitecture|l=arch}} and is fabricat
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  • ...] in early [[2018]] for dense servers and edge devices. This processor has CPU cores based on the {{amd|Zen|Zen microarchitecture|l=arch}} and is fabricat
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  • ...] in early [[2018]] for dense servers and edge devices. This processor has CPU cores based on the {{amd|Zen|Zen microarchitecture|l=arch}} and is fabricat
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  • ...] in early [[2018]] for dense servers and edge devices. This processor has CPU cores based on the {{amd|Zen|Zen microarchitecture|l=arch}} and is fabricat
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  • Supplementing the CPU cores is a seperate hardware convolution computation engine (HWCE) designed
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  • |atype=CPU ...stance of::microprocessor]] [[microarchitecture::Ice Lake (server)]] [[max cpu count::1]]
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  • ** 8-24 bit RGB, CPU (Intel/Motorola), BT656 ...
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  • ** 8-24 bit RGB, CPU (Intel/Motorola), BT656 ...
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  • ** 8-24 bit RGB, CPU (Intel/Motorola), BT656 ...
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  • ** 8-24 bit RGB, CPU (Intel/Motorola), BT656 ...
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  • ** 8-24 bit RGB, CPU (Intel/Motorola), BT656 ...
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  • ** 8-24 bit RGB, CPU (Intel/Motorola), BT656 ...
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  • ...g AMD's proprietary {{amd|Infinity Fabric}}. The die consists of two {{amd|CPU Complexes}}, two DDR4 channels, USB, low-power I/O, and a series of {{amd|i
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  • |atype=CPU
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  • |atype=CPU ! Name !! CPU Configuration !! GPU !! Dimensions !! Area
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  • This family covers two CPU generations. Models 00h-2Fh are first generation [[Athlon 64]] and [[Optero Having exhausted the 4-bit Base Family field, Family 0Fh introduced new CPUID semantics following the
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  • ...tel]] [[instance of::microprocessor]] [[core name::Cascade Lake SP]] [[max cpu count::1]] ...tel]] [[instance of::microprocessor]] [[core name::Cascade Lake SP]] [[max cpu count::2]]
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  • |atype=CPU ...AM is placed under the CPU die is to allow proper heat dissipation for the CPU die through an active cooling solution on top.
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  • |atype=CPU |core name 3=Granite Ridge (Gaming Desktop CPU)
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  • ...control transmission accross multiple [[Nvidia]] [[GPU]]s and supporting [[CPU]]s. ...g over the PCIe lanes. It's worth noting that NVLink was also designed for CPU-GPU communication with higher bandwidth than PCIe. Although it's unlikely t
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  • ...solution - the [[chipset]] is packaged in the same physical casing as the CPU in a [[multi-chip package]] (MCP). Communication between the separate dies
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  • ...chip solution - the chipset is packaged in the same physical casing as the CPU in a [[multi-chip package]] (MCP). Communication between the separate dies
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  • ...chip solution - the chipset is packaged in the same physical casing as the CPU in a [[multi-chip package]] (MCP). Communication between the separate dies
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  • ...chip solution - the chipset is packaged in the same physical casing as the CPU in a [[multi-chip package]] (MCP). Communication between the separate dies
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  • <tr><th>Processor</th><td>CPU</td><td>GPU</td><td>&nbsp;</td><th>Rack</th><td>Compute Racks</td><td>Stora ...ng rate to 25 GT/s, two Bricks allow for 100 GB/s of bandwidth between the CPU and GPU. In addition to everything else, there are x48 PCIe Gen 4 lanes for
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  • |atype=CPU ...erals tailored for their target market, a CCX, and a GPU. A CCX contains 8 CPU cores (fewer may be usable on some models) communicating through a shared L
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  • |atype=CPU '''Denver''' is a CPU microarchitecture from [[Nvidia]] introduced in 2014, capable of executing
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  • ...lly) PCIe slots and x4 M.2 NVMe/SATA SSD connectors, leveraging few of the CPU's SATA ports. One x8 PCIe link on the processor is reserved to attach the A Both the TRX40 and WRX80 offer 16 lanes (plus 8-lane CPU link) PCIe Gen 1, 2, 3, 4; 12 SATA Gen 1, 2, 3 ports, eight sharing pins wi
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  • ..., 1.00&nbsp;mm × 0.87&nbsp;mm interstitial pitch, organic land grid array CPU package. ! || CPU Family || Microarch. || Process || Products
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  • ..., 1.00&nbsp;mm × 0.87&nbsp;mm interstitial pitch, organic land grid array CPU package. ! || CPU Family || Microarch. || Process || Products
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  • ...CPU for the FPGA, providing the FPGA with a [[cache coherent]] link to the CPU. {{see also|intel/frequency_behavior|l1=Intel's CPU Frequency Behavior}}
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  • <tr><th>Processors</th><td>144<br>72 × 2 × CPU</td></tr> <tr><th>Processors</th><td>1 × CPU</td><td>2 × CPU</td></tr>
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  • |atype=CPU ==== CPU Complex ====
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  • ...it can be built right on top of memory or logic (e.g., NRAM on top of a [[CPU]] [[core]]) or even analog (in fact the type of device does not matter). It
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  • |atype=CPU * Paramesh Gopi, Gaurav Singh, Greg Favor. ''"X-Gene: 64-bit ARM CPU and SoC."'' Hot Chips 24 Symposium (HCS), 2012 IEEE. IEEE, 2012.
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  • EPYC 9004 processors identify as members of {{amd|CPUID#Family 25 (19h)|AMD CPU Family 19h, Model 11h}} (engineering samples as Model 10h). * 16 to 96 {{amd|Zen 4|l=arch}} [[x86]] CPU cores with 2-way [[SMT]]
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  • ...each. The SPU is designed to provide all basic functionalities a typical [[CPU]]. Because the SX-Aurora is not a typical offload engine but a self-hosted ...(SPU) has to have a reasonably high performance in order to act as a host CPU for all the serial workloads including handling all the required operating
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  • CPU(s): 16 On-line CPU(s) list: 0-15
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  • CPU(s): 96 On-line CPU(s) list: 0-95
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  • |atype=CPU Sunny Cove is Intel's microarchitecture for their [[big core|big CPU core]] which is incorporated into a number of client and server chips that
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  • |atype=CPU ...al. "23.3 A highly integrated smartphone SoC featuring a 2.5 GHz octa-core CPU with advanced high-performance and low-power techniques." Solid-State Circu
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  • ...al. "23.3 A highly integrated smartphone SoC featuring a 2.5 GHz octa-core CPU with advanced high-performance and low-power techniques." Solid-State Circu
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  • ...ics controller present on later processors. An FDI capable southbridge and CPU pair is not usable without the existence of the appropriate video connector
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  • <tr><th colspan="7">CPU</th><th colspan="3">Memory</th><th colspan="4">[[Hardware Accelerators]]</t
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  • ...s a [[logic]] design architecture whereby multiple processing units (e.g., CPU cores) are integrated onto a single monolithic integrated circuit or onto m
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  • ...]] series of ultra-low power embedded APUs based on the {{amd|Zen|l=arch}} CPU and {{amd|Vega|l=arch}} GPU microarchitectures serving as a successor {{\\|
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  • ...step]] CPU which conducts the final arbitration of the car actuators. This CPU determines if the two plans generated by the two FSD chips on the FSD compu ...until reaching a stop instruction which triggers an interrupt, letting the CPU post-process the results.
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  • |atype=CPU ...nd a '''Super IO Cluster''' ('''SICL'''). The SCCL compute dies contains 8 CPU Clusters (CCLs), memory controllers, and the L3 cache block. There are eigh
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  • ...ay SMP, three Hydra interfaces are used per CPU with one link between each CPU, creating an all-to-all connection.
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  • The 855+ is identical to the {{\\|855}} but features slightly higher GPU and CPU frequencies.
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  • This processor has 8 CPU cores and 32 MiB L3 cache. A single Core Complex Die (plus I/O die) can pro ...f up to DDR4-3200 memory<ref name="specs">[https://www.amd.com/en/products/cpu/amd-epyc-7232p "AMD EPYC™ 7232P"]. <i>AMD.com</i>. Retrieved October 2020
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  • ...t fully integrates a 5G modem ([[Balong 5000]]) in the same silicon as the CPU and the GPU. The Kirin 990 5G includes a limited version of the Balong 5000
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  • <tr><th>CPU</th><td>64 core AMD {{amd|Rome|l=core}} CPU @ 2.2 GHz</td></tr>
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    728 bytes (80 words) - 13:49, 4 July 2022
  • ...g to OEMs. They identify as members of {{amd|CPUID#Family 25 (19h)|AMD x86 CPU Family 19h, Model 08h}}. ...pack}} and {{amd|Socket AM4|AM4|l=pack}} processors: 16 lanes (plus 8-lane CPU link) PCIe Gen 1, 2, 3, 4; 12 SATA Gen 1, 2, 3 ports, eight sharing pins wi
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  • ...[[AMD]] series of entry-level mobile APUs based on the {{amd|Zen|l=arch}} CPU and {{amd|Vega|l=arch}} GPU microarchitectures, a cheaper derivative of {{\
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    2 KB (261 words) - 01:14, 21 January 2020
  • |atype=CPU ...ling up to 4K-lanes of logic each cycle at the same clock frequency as the CPU cores. 4K bytes operations are available every cycle and since the NCORE is
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  • ...ons on the register file. The PLE features an Arm {{armh|Cortex|Cortex-M}} CPU with a 16-lane Vector Engine which supports the vector and neural network e
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  • ...8||D||[[:File:CPU Thermal Management (Am486, Am5x86, K5) (August 1995).pdf|CPU Thermal Management]]||1995-08||Am486, Am5x86, K5 ...es/TechDocs/32077c_gx_lx_pwr.pdf AMD Geode™ GX and LX Processors Typical CPU Core Power Consumption Determination]||2006-04-13||
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  • |atype=CPU
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  • ...are compatible with Socket AM2, subject to the motherboard recognizing the CPU and the limitations of Socket AM2.
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  • ...le with the earlier Socket AM2, subject to the motherboard recognizing the CPU, limiting its HT link to generation 1.0 mode, and using a single power plan ...re compatible with Socket AM2+, subject to the motherboard recognizing the CPU and the limitations of Socket AM2+.
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  • ...ntel]] [[instance of::microprocessor]] [[core name::Cascade Lake R]] [[max cpu count::2]]
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  • ...e earlier Sockets AM2 and AM2+, subject to the motherboard recognizing the CPU and configuring its memory controller for DDR2 mode. These processors are l ...are compatible with Socket AM3, subject to the motherboard recognizing the CPU and the limitations of Socket AM3. The OPGA-940 package for Socket AM2/AM2+
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  • ...le with the earlier Socket AM3, subject to the motherboard recognizing the CPU and the limitations of Socket AM3. The OPGA-940 package for Socket AM3/AM3+ ...re compatible with Socket AM3+, subject to the motherboard recognizing the CPU. The OPGA-940 package for Socket AM2/AM2+ differs from the OPGA-940 package
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  • '''FT1''' was a CPU package for low power [[AMD]] microprocessors with integrated graphics targ ...are members of AMD's x86 CPU {{amd|CPUID#Family 20 (14h)|Family 14h}} with CPU cores based on the {{amd|Bobcat|l=arch}} microarchitecture, and were manufa
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  • * Pin AH32 (KEY) prevents CPU insertion into Socket 5.
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  • ...ors for Socket FM1, codename "Llano", are members of AMD's Family 12h with CPU cores based on the {{amd|K10|l=arch}} microarchitecture, and were fabricate
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  • ...2, codename "Trinity" and "Richland", are members of AMD's Family 15h with CPU cores based on the {{amd|Piledriver|l=arch}} microarchitecture, and were fa
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  • ...name "Kabini", "Temash", and "Kyoto", are members of AMD's Family 16h with CPU cores based on the {{amd|Jaguar|l=arch}} microarchitecture, and are fabrica
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  • ...e", "Crowned Eagle", and "Carrizo-L", are members of AMD's Family 16h with CPU cores based on the {{amd|Puma|l=arch}} microarchitecture, and are fabricate
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  • ...FT4 package, codename "Stoney Ridge", are members of AMD's Family 15h with CPU cores based on the {{amd|Excavator|l=arch}} microarchitecture, and are fabr
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  • ...Socket FS1, codename "Llano", are members of AMD's Family 12h with 2 or 4 CPU cores based on the [[amd/microarchitectures/k10|K10]] microarchitecture, an
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  • All processors in the FP3 package are members of AMD's Family 15h with CPU cores based on the {{amd|Steamroller|l=arch}} microarchitecture, and are fa
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  • ...ors codenamed {{amd|Seattle|l=core}} with 8 ARM {{armh|Cortex-A57|l=arch}} CPU cores.
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