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FT3
General Info
Designer	AMD
Introduction	May 2013 (launched)
Market	Mobile, Embedded
Microarchitecture	Jaguar
TDP	25 W 25,000 mW 0.0335 hp 0.025 kW
Package
Name	BGA-769
Type	Organic Micro Ball Grid Array
Contacts	769
Dimension	24.5 mm 2.45 cm 0.965 in × 24.5 mm 2.45 cm 0.965 in
Pitch	0.65 mm 0.0256 in

FT3 is a BGA-769 package for low power AMD mobile and embedded microprocessors with an integrated north bridge, graphics processor, and controller hub. Its counterpart for desktop processors is the PGA-721 package for Socket AM1. FT3 succeeded the FT1 package and was superseded by the FT3b package.

All processors for package FT3, codename "Kabini", "Temash", and "Kyoto", are members of AMD's Family 16h with CPU cores based on the Jaguar microarchitecture, and are fabricated on a 28 nm SOI process.

Features

• 769-pin lidless micro ball grid array package, 0.65-1.1 mm multi-pitch, 24.5 × 24.5 mm, organic substrate

• 64/72 bit DDR3 SDRAM interface up to 800 MHz, PC3-12800 (DDR3-1600), 12.8 GB/s
  • Up to 2 SR/DR UDIMMs or SODIMMs, ECC supported
  • JEDEC 1.5V, 1.35V, 1.25V
  • AMD Memory Controller PowerCap

• PCIe Gen 1.0 and 2.0 (5 GT/s)
  • One x4 external graphics card link
  • Configurable x4 General Purpose Ports (1x4, 2x2, 1x2 + 2x1, 4x1)

• Two independent display controllers
  • Two single link digital display interfaces
  • DisplayPort 1.2 up to 4096 × 2160 at 30 Hz, 30 bpp
  • Single link DVI up to 1920 × 1200 at 60 Hz, 24 bpp
  • LVDS interface
  • HDMI, HDCP, eDP, DP++, 3D video, DP audio, Aux Channel
  • VGA/DAC interface up to 2048 × 1536 at 60 Hz
  • Miracast-certified, one wireless display up to 1920 × 1080, HDCP 2

• Integrated Controller Hub
  • 2 × USB 1.1, 2.0, 3.0 (5 Gb/s)
  • 8 × USB 1.1, 2.0
  • 2 × SATA 1.0, 2.0, 3.0 (6 Gb/s)
  • 2 × 1 Gigabit Ethernet, multiplexed with GPP
  • SD 3.0 interface, SMBus, LPC, HD audio, 4 × UART, Serial IRQ, SPI, GPIO

• Power Management
  • AMD AllDay power technology
  • ACPI P-states, processor power states C0, C1, CC6, PC6, sleep states S0, S3, S4, S5
  • PCIe power gating
  • PCIe speed power policy
  • AMD Turbo CORE technology 3.0 with per core power gating

• Thermal Controls
  • Sideband temperature control
  • Hardware thermal control
  • Local hardware thermal control
  • DRAM thermal protection
  • Fan control

Processors using FT3

• AMD A-Series "Kabini", "Temash"
• AMD E-Series "Kabini"
• AMD Opteron "Kyoto"
• AMD G-Series 1st Gen

	List of all FT3-based Processors
Model	Price	Process	Launched	µarch	Family	Core	C	T	Freq	Turbo	TDP
Count: 0

Package Diagram

Approximate dimensions of the Kabini package. All dimensions in millimeters.

FT3 package ball numbers.

Pin Map

References

• "Family 16h Models 00h-0Fh AMD A-Series Mobile Accelerated Processor Product Data Sheet", AMD Publ. #52169, Rev. 3.03, February 13, 2014
• "Family 16h Models 00h-0Fh AMD E-Series Mobile Processor Product Data Sheet", AMD Publ. #53509, Rev. 3.02, February 13, 2014
• "Family 16h Models 00h - 0Fh AMD Opteron™ Processor Product Data Sheet", AMD Publ. #53102, Rev. 3.02, February 13, 2014
• "AMD Embedded G-Series SOC (Family 16h Models 00h-0Fh) Product Data Sheet", AMD Publ. #52259, Rev. 3.04, February 13, 2014
• "BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 16h Models 00h-0Fh Processors", AMD Publ. #48751, Rev. 3.03, February 23, 2015
• "Product Brief: 1st and 2nd Generation AMD Embedded G-Series System-on-Chip (SOC)", PID 169776-A, 2015

See also

• Socket AM1
• Package FT1
• Package FT3b