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Cooper Lake - Microarchitectures - Intel
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Cooper Lake µarch
General Info
Arch TypeCPU
DesignerIntel
ManufacturerIntel
Introduction2019
Process14 nm
Pipeline
TypeSuperscalar
OoOEYes
SpeculativeYes
Reg RenamingYes
Stages14-19
Instructions
ISAx86-64
ExtensionsMOVBE, MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, POPCNT, AVX, AVX2, AES, PCLMUL, FSGSBASE, RDRND, FMA3, F16C, BMI, BMI2, VT-x, VT-d, TXT, TSX, RDSEED, ADCX, PREFETCHW, CLFLUSHOPT, XSAVE, SGX, MPX, AVX-512
Cache
L1I Cache32 KiB/core
8-way set associative
L1D Cache32 KiB/core
8-way set associative
L2 Cache1 MiB/core
16-way set associative
L3 Cache1.375 MiB/core
11-way set associative
Cores
Core NamesCooper Lake X,
Cooper Lake SP,
Cooper Lake AP
Succession
Contemporary
Coffee Lake

Cooper Lake (CPL) is Intel's successor to Cascade Lake, a 14 nm microarchitecture for enthusiasts and servers.

For desktop enthusiasts, Cascade Lake is branded Core i7, and Core i9 processors (under the Core X series). For scalable server class processors, Intel branded it as Xeon Bronze, Xeon Silver, Xeon Gold, and Xeon Platinum.


Codenames[edit]

Core Abbrev Target
Cooper Lake X CPL-X High-end desktops & enthusiasts market
Cooper Lake W CPL-W Enterprise/Business workstations
Cooper Lake SP CPL-SP Server Scalable Processors
Cooper Lake AP CPL-AP Server Advanced Processors

Brands[edit]

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Release Dates[edit]

Cooper Lake and Ice Lake roadmap.

Cooper Lake is expected to be released in the first half of 2020.

Process Technology[edit]

Cooper Lake is fabricated on Intel's 3rd generation enhanced 14nm++ process.

Architecture[edit]

Cooper Lake is based on the Whitley platform.

Key changes from Cascade Lake[edit]

Symbol version future.svg Preliminary Data! Information presented in this article deal with future products, data, features, and specifications that have yet to be finalized, announced, or released. Information may be incomplete and can change by final release.
  • SoC
    • Mainstream 56 cores (up from 28) (note that Cascade Lake AP already offered up to 56 cores)
      • Socketed (from soldered and only sold as part of the S9200WK module)
    • 3-die multi-chip package (up from a single monolithic die)
  • Memory
    • Higher bandwidth (174.84 GiB/s, up from 119.209 GiB/s)
    • Octa-channel (up from hexa-channel)
    • Optane DC DIMMs
      • Apache Pass Barlow Pass
  • Platform
  • Packaging
    • 4189-contact flip-chip LGA (up from 3647 contacts)

This list is incomplete; you can help by expanding it.

New instructions[edit]

Cooper Lake introduced a number of new instructions:

See also[edit]