| Coffee Lake µarch | |
| Arch Type | CPU |
| Designer | Intel |
| Manufacturer | Intel |
| Introduction | 2018 |
| Process | 0.014 μm 14 nm
1.4e-5 mm |
| Succession | |
| ← | → |
| Kaby Lake | Cannonlake |
Coffee Lake (CFL) is a planned microarchitecture by Intel as a successor to Kaby Lake for high-power notebooks in second quarter of 2018. Coffee Lake appears to be a variant of Cannonlake (including all its features) manufactured on Intel's mature 14 nm process. Coffee Lake is said to introduce the first series mainstream hexa-core processors.
Contents
Codenames[edit]
| Core | Abbrev | Description | Graphics | Target |
|---|---|---|---|---|
| Coffee Lake U | CFL-U | Ultra-low power | GT2 | Light notebooks, portable All-in-Ones (AiOs), Minis, and conference room |
| Coffee Lake H | CFL-H | High-performance graphics | GT3e | Ultimate mobile performance, mobile workstations |
| Coffee Lake S | CFL-S | High-performance graphics | GT3e | Desktop performance to value, AiOs, and minis |
| Coffee Lake X | CFL-X | Extreme Performance | High performance desktops |
Technology[edit]
- Main article: Broadwell § Technology
Coffee Lake is is manufactured on Intel's 3rd generation 14 nm process called "14++". The process is the second enhanced version of the first which was used for the Broadwell microarchitecture (first enhanced version was first used for Kaby Lake). The various enhancements improve performance without increasing the capacitance (i.e., active power characteristics). 14++ allows for +23-24% higher drive current. Intel claims their 14++ process provides 26% more performance for 52% less power.
Architecture[edit]
Not much is known about Coffee Lake's architecture.
Key changes from Kaby Lake[edit]
- Chipset
- 200 Series chipset → 300 Series chipset (Cannonlake PCH)
- Integrated USB 3.1 (10 Gib/s)
- Up to 6 ports
- Integrated Intel wireless controller (IEEE 802.11ac)
- Integrated USB 3.1 (10 Gib/s)
- 200 Series chipset → 300 Series chipset (Cannonlake PCH)
- Over 15% in performance - it's currently unknown if this is done through up-binning or through IPC improvement or a combination of both.
All Coffee Lake Chips[edit]
| Coffee Lake Chips | |||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Main processor | IGP | Major Feature Diff | |||||||||||||||||||||
| Model | Launched | Price | Family | Platform | Core | C | T | L3$ | L4$ | TDP | Freq | Turbo | Max Mem | Name | Freq | Turbo | TBT | HT | AVX2 | TXT | TSX | vPro | VT-d |
| Uniprocessors | |||||||||||||||||||||||
| No Coffee Lake Chips have been released yet. | |||||||||||||||||||||||
| Count: 0 | |||||||||||||||||||||||
| codename | Coffee Lake + |
| designer | Intel + |
| first launched | 2018 + |
| full page name | intel/microarchitectures/coffee lake + |
| instance of | microarchitecture + |
| manufacturer | Intel + |
| microarchitecture type | CPU + |
| name | Coffee Lake + |
| process | 14 nm (0.014 μm, 1.4e-5 mm) + |