From WikiChip
Property:package pitch
732
U

This quantity specifies the orthogonal distance between electrical contacts (pins, balls, pads) on an integrated circuit package. Different pitches may be specified for the length and width dimension. BGA packages tend to arrange contacts in more complex patterns and may have multiple pitches. Presently only the minimum pitch is expected.

Units:

  • 1 mm
  • 0.03937007874015748031 in, ″, "

See also[edit]

Pages using the property "package pitch"

Showing 25 pages using this property.

View (previous 25 | next 25) (20 | 50 | 100 | 250 | 500)

A
Am186CC-25KC\W - AMD#package_1 +0.65 mm
0.0256 in
  +
Am186CC-25KI\W - AMD#package_1 +0.65 mm
0.0256 in
  +
Am186CC-40KC\W - AMD#package_1 +0.65 mm
0.0256 in
  +
Am186CC-40KI\W - AMD#package_1 +0.65 mm
0.0256 in
  +
Am186CC-50KC\W - AMD#package_1 +0.65 mm
0.0256 in
  +
Am186CH-25KC\W - AMD#package_1 +0.65 mm
0.0256 in
  +
Am186CH-25KI\W - AMD#package_1 +0.65 mm
0.0256 in
  +
Am186CH-40KC\W - AMD#package_1 +0.65 mm
0.0256 in
  +
Am186CH-40KI\W - AMD#package_1 +0.65 mm
0.0256 in
  +
Am186CH-50KC\W - AMD#package_1 +0.65 mm
0.0256 in
  +
Am186CU-25KC\W - AMD#package_1 +0.65 mm
0.0256 in
  +
Am186CU-25KI\W - AMD#package_1 +0.65 mm
0.0256 in
  +
Am186CU-40KC\W - AMD#package_1 +0.65 mm
0.0256 in
  +
Am186CU-40KI\W - AMD#package_1 +0.65 mm
0.0256 in
  +
Am186CU-50KC\W - AMD#package_1 +0.65 mm
0.0256 in
  +
Am186EDLV–20KC\W - AMD#package_1 +0.65 mm
0.0256 in
  +
Am186EDLV–20VC\W - AMD#package_1 +0.5 mm
0.0197 in
  +
Am186EDLV–25KC\W - AMD#package_1 +0.65 mm
0.0256 in
  +
Am186EDLV–25VC\W - AMD#package_1 +0.5 mm
0.0197 in
  +
Am186ED–20KC\W - AMD#package_1 +0.65 mm
0.0256 in
  +
Am186ED–20KI\W - AMD#package_1 +0.65 mm
0.0256 in
  +
Am186ED–20VC\W - AMD#package_1 +0.5 mm
0.0197 in
  +
Am186ED–25KC\W - AMD#package_1 +0.65 mm
0.0256 in
  +
Am186ED–25KI\W - AMD#package_1 +0.65 mm
0.0256 in
  +
Am186ED–25VC\W - AMD#package_1 +0.5 mm
0.0197 in
  +
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