From WikiChip
Property:package height
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This quantity specifies the height of an integrated circuit package. For commonly soldered packages this is the distance from the top of the PCB to the top of the package after soldering. For socketed packages this is the distance from the seating plane to the top of the package, i.e. it includes the package substrate, chips, a lid or case, but not the length of pins if any.

Units:

  • 1 mm
  • 0.03937007874015748031 in, ″, "

See also[edit]

Pages using the property "package height"

Showing 25 pages using this property.

View (previous 25 | next 25) (20 | 50 | 100 | 250 | 500)

A
Am186CC-25KC\W - AMD#package_1 +3.2 mm
0.126 in
  +
Am186CC-25KI\W - AMD#package_1 +3.2 mm
0.126 in
  +
Am186CC-40KC\W - AMD#package_1 +3.2 mm
0.126 in
  +
Am186CC-40KI\W - AMD#package_1 +3.2 mm
0.126 in
  +
Am186CC-50KC\W - AMD#package_1 +3.2 mm
0.126 in
  +
Am186CH-25KC\W - AMD#package_1 +3.2 mm
0.126 in
  +
Am186CH-25KI\W - AMD#package_1 +3.2 mm
0.126 in
  +
Am186CH-40KC\W - AMD#package_1 +3.2 mm
0.126 in
  +
Am186CH-40KI\W - AMD#package_1 +3.2 mm
0.126 in
  +
Am186CH-50KC\W - AMD#package_1 +3.2 mm
0.126 in
  +
Am186CU-25KC\W - AMD#package_1 +3.2 mm
0.126 in
  +
Am186CU-25KI\W - AMD#package_1 +3.2 mm
0.126 in
  +
Am186CU-40KC\W - AMD#package_1 +3.2 mm
0.126 in
  +
Am186CU-40KI\W - AMD#package_1 +3.2 mm
0.126 in
  +
Am186CU-50KC\W - AMD#package_1 +3.2 mm
0.126 in
  +
Am186EDLV–20KC\W - AMD#package_1 +2.7 mm
0.106 in
  +
Am186EDLV–20VC\W - AMD#package_1 +1.35 mm
0.0531 in
  +
Am186EDLV–25KC\W - AMD#package_1 +2.7 mm
0.106 in
  +
Am186EDLV–25VC\W - AMD#package_1 +1.35 mm
0.0531 in
  +
Am186ED–20KC\W - AMD#package_1 +2.7 mm
0.106 in
  +
Am186ED–20KI\W - AMD#package_1 +2.7 mm
0.106 in
  +
Am186ED–20VC\W - AMD#package_1 +1.35 mm
0.0531 in
  +
Am186ED–25KC\W - AMD#package_1 +2.7 mm
0.106 in
  +
Am186ED–25KI\W - AMD#package_1 +2.7 mm
0.106 in
  +
Am186ED–25VC\W - AMD#package_1 +1.35 mm
0.0531 in
  +
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