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Core i7-8650U - Intel
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Core i7-8650U
kaby lake r (front).png
General Info
DesignerIntel
ManufacturerIntel
Model Numberi7-8650U
Part NumberFJ8067703281718
S-SpecSR3L8
MarketMobile
IntroductionAugust 21, 2017 (announced)
August 21, 2017 (launched)
Release Price$409.00
General Specs
FamilyCore i7
Seriesi7-8000
LockedYes
Frequency1,900 MHz
Turbo Frequency4,200 MHz (1 core)
Bus typeOPI
Bus rate4 GT/s
Clock multiplier19
Microarchitecture
ISAx86-64 (x86)
MicroarchitectureKaby Lake
PlatformKaby Lake
Core NameKaby Lake R
Core Family6
Core Model142
Core SteppingY0
Process14 nm
TechnologyCMOS
Die123 mm²
Word Size64 bit
Cores4
Threads8
Max CPUs1 (Uniprocessor)
Max Memory32 GiB
Electrical
Vcore0.55 V-1.52 V
TDP15 W
cTDP down10 W
cTDP down frequency800 MHz
cTDP up25 W
cTDP up frequency2,100 MHz
Tjunction0 °C – 100 °C
Tstorage-25 °C – 125 °C
Packaging
PackageFCBGA-1356 (BGA)
Dimension42 mm x 24 mm x 1.3 mm
Pitch0.65 mm
Ball Count1356
Ball CompSAC405
InterconnectBGA-1356

Core i7-8650U is a 64-bit quad-core performance x86 mobile microprocessor introduced by Intel in mid-2017. This processor, which is based on an enhanced version of the Kaby Lake microarchitecture, is manufactured on Intel's 2nd generation enhanced 14nm+ process. The i7-8650U operates at 1.9 GHz with a TDP of 15 W and Turbo Boost frequency of up to 4.2 GHz. This MPU supports up to 32 GiB of dual-channel DDR4-2400 memory and incorporates Intel's UHD Graphics 620 IGP operating at 300 MHz with a burst frequency of 1.15 GHz.

This model has a configurable TDP-down of 10 W at 800 MHz and a TDP-up of 25 W at 2.1 GHz.

Cache[edit]

Main article: Kaby Lake § Cache

[Edit/Modify Cache Info]

hierarchy icon.svg
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L1$256 KiB
0.25 MiB
262,144 B
2.441406e-4 GiB
L1I$128 KiB
0.125 MiB
131,072 B
1.220703e-4 GiB
4x32 KiB8-way set associative 
L1D$128 KiB
0.125 MiB
131,072 B
1.220703e-4 GiB
4x32 KiB8-way set associativewrite-back

L2$1 MiB
1,024 KiB
1,048,576 B
9.765625e-4 GiB
  4x256 KiB4-way set associativewrite-back

L3$8 MiB
8,192 KiB
8,388,608 B
0.00781 GiB
  4x2 MiB16-way set associativewrite-back

Memory controller[edit]

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeDDR4-2400, LPDDR3-2133
Supports ECCNo
Max Mem32 GiB
Controllers1
Channels2
Max Bandwidth35.76 GiB/s
Bandwidth
Single 17.88 GiB/s
Double 35.76 GiB/s

Expansions[edit]

[Edit/Modify Expansions Info]

ide icon.svg
Expansion Options
PCIeRevision: 3.0
Max Lanes: 12
Configuration: 1x4, 2x2, 1x2+2x1, 4x1


Graphics[edit]

[Edit/Modify IGP Info]

screen icon.svg
Integrated Graphics Information
GPUUHD Graphics 620
DesignerIntelDevice ID0x5917
Execution Units24Max Displays3
Max Memory32 GiB
32,768 MiB
33,554,432 KiB
34,359,738,368 B
Frequency300 MHz
0.3 GHz
300,000 KHz
Burst Frequency1,150 MHz
1.15 GHz
1,150,000 KHz
OutputDisplayPort, Embedded DisplayPort, HDMI, DVI

Max Resolution
HDMI4096x2304 @24 Hz
DP4096x2304 @60 Hz
eDP4096x2304 @60 Hz

Standards
DirectX12
OpenGL4.4
OpenCL2.0
DP1.2
eDP1.4
HDMI1.4a

Additional Features
Intel Quick Sync Video
Intel InTru 3D
Intel Clear Video
Intel Clear Video HD

Features[edit]

[Edit/Modify Supported Features]

Cog-icon-grey.svg
Supported x86 Extensions & Processor Features
MMXMMX Extension
EMMXExtended MMX Extension
SSEStreaming SIMD Extensions
SSE2Streaming SIMD Extensions 2
SSE3Streaming SIMD Extensions 3
SSSE3Supplemental SSE3
SSE4.1Streaming SIMD Extensions 4.1
SSE4.2Streaming SIMD Extensions 4.2
SSE4aStreaming SIMD Extensions 4a
AVXAdvanced Vector Extensions
AVX2Advanced Vector Extensions 2
ABMAdvanced Bit Manipulation
BMI1Bit Manipulation Instruction Set 1
BMI2Bit Manipulation Instruction Set 2
FMA33-Operand Fused-Multiply-Add
AESAES Encryption Instructions
RdRandHardware RNG
ADXMulti-Precision Add-Carry
CLMULCarry-less Multiplication Extension
F16C16-bit Floating Point Conversion
x86-1616-bit x86
x86-3232-bit x86
x86-6464-bit x86
RealReal Mode
ProtectedProtected Mode
SMMSystem Management Mode
FPUIntegrated x87 FPU
NXNo-eXecute
HTHyper-Threading
TBT 2.0Turbo Boost Technology 2.0
EISTEnhanced SpeedStep Technology
SSTSpeed Shift Technology
VT-xVT-x (Virtualization)
VT-dVT-d (I/O MMU virtualization)
EPTExtended Page Tables (SLAT)
MPXMemory Protection Extensions
SGXSoftware Guard Extensions
Secure KeySecure Key Technology
SMEPOS Guard Technology
Flex MemoryFlex Memory Access
ISRTSmart Response Technology
MWTMy WiFi Technology
IPTIdentity Protection Technology

Die Shot[edit]

See also: Kaby Lake § Die Shot

A die shot of Intel's Kaby Lake R Quad Core mobile processors:

  • 14 nm+ process
  • 11 metal layers
  • 123 mm² die size
  • 4 CPU cores + 24 GPU EUs


kaby lake r die shot.png


kaby lake r die shot (annotated).png
Facts about "Core i7-8650U - Intel"
Has subobject
"Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.
Core i7-8650U - Intel#package + and Core i7-8650U - Intel#pcie +
base frequency1,900 MHz (1.9 GHz, 1,900,000 kHz) +
bus rate4,000 MT/s (4 GT/s, 4,000,000 kT/s) +
bus typeOPI +
clock multiplier19 +
core count4 +
core family6 +
core model142 +
core nameKaby Lake R +
core steppingY0 +
core voltage (max)1.52 V (15.2 dV, 152 cV, 1,520 mV) +
core voltage (min)0.55 V (5.5 dV, 55 cV, 550 mV) +
designerIntel +
device id0x5917 +
die area123 mm² (0.191 in², 1.23 cm², 123,000,000 µm²) +
familyCore i7 +
first announcedAugust 21, 2017 +
first launchedAugust 21, 2017 +
full page nameintel/core i7/i7-8650u +
has advanced vector extensionstrue +
has advanced vector extensions 2true +
has ecc memory supportfalse +
has extended page tables supporttrue +
has featureAdvanced Vector Extensions +, Advanced Vector Extensions 2 +, Advanced Encryption Standard Instruction Set Extension +, Hyper-Threading Technology +, Turbo Boost Technology 2.0 +, Enhanced SpeedStep Technology +, Speed Shift Technology +, Intel VT-x +, Intel VT-d +, Secure Key Technology +, OS Guard +, Flex Memory Access +, Smart Response Technology +, My WiFi Technology + and Identity Protection Technology +
has intel enhanced speedstep technologytrue +
has intel flex memory access supporttrue +
has intel identity protection technology supporttrue +
has intel my wifi technology supporttrue +
has intel secure key technologytrue +
has intel smart response technology supporttrue +
has intel speed shift technologytrue +
has intel supervisor mode execution protectiontrue +
has intel turbo boost technology 2 0true +
has intel vt-d technologytrue +
has intel vt-x technologytrue +
has locked clock multipliertrue +
has second level address translation supporttrue +
has simultaneous multithreadingtrue +
has x86 advanced encryption standard instruction set extensiontrue +
instance ofmicroprocessor +
integrated gpuUHD Graphics 620 +
integrated gpu base frequency300 MHz (0.3 GHz, 300,000 KHz) +
integrated gpu designerIntel +
integrated gpu max frequency1,150 MHz (1.15 GHz, 1,150,000 KHz) +
integrated gpu max memory32,768 MiB (33,554,432 KiB, 34,359,738,368 B, 32 GiB) +
isax86-64 +
isa familyx86 +
l1$ size0.25 MiB (256 KiB, 262,144 B, 2.441406e-4 GiB) +
l1d$ description8-way set associative +
l1d$ size0.125 MiB (128 KiB, 131,072 B, 1.220703e-4 GiB) +
l1i$ description8-way set associative +
l1i$ size0.125 MiB (128 KiB, 131,072 B, 1.220703e-4 GiB) +
l2$ description4-way set associative +
l2$ size1 MiB (1,024 KiB, 1,048,576 B, 9.765625e-4 GiB) +
l3$ description16-way set associative +
l3$ size8 MiB (8,192 KiB, 8,388,608 B, 0.00781 GiB) +
ldate3000 +
main imageFile:kaby lake r (front).png +
manufacturerIntel +
market segmentMobile +
max cpu count1 +
max junction temperature373.15 K (100 °C, 212 °F, 671.67 °R) +
max memory32,768 MiB (33,554,432 KiB, 34,359,738,368 B, 32 GiB, 0.0313 TiB) +
max storage temperature398.15 K (125 °C, 257 °F, 716.67 °R) +
microarchitectureKaby Lake +
min junction temperature273.15 K (0 °C, 32 °F, 491.67 °R) +
min storage temperature248.15 K (-25 °C, -13 °F, 446.67 °R) +
model numberi7-8650U +
nameCore i7-8650U +
packageFCBGA-1356 +
part numberFJ8067703281718 +
platformKaby Lake +
process14 nm (0.014 μm, 1.4e-5 mm) +
release price$ 409.00 (€ 368.10, £ 331.29, ¥ 42,261.97) +
s-specSR3L8 +
seriesi7-8000 +
supported memory typeDDR4-2400 + and LPDDR3-2133 +
tdp15 W (15,000 mW, 0.0201 hp, 0.015 kW) +
tdp down10 W (10,000 mW, 0.0134 hp, 0.01 kW) +
tdp down frequency800 MHz (0.8 GHz, 800,000 kHz) +
tdp up25 W (25,000 mW, 0.0335 hp, 0.025 kW) +
tdp up frequency2,100 MHz (2.1 GHz, 2,100,000 kHz) +
technologyCMOS +
thread count8 +
turbo frequency (1 core)4,200 MHz (4.2 GHz, 4,200,000 kHz) +
word size64 bit (8 octets, 16 nibbles) +