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Socket AM2+ - AMD
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Socket AM2+
General Info
DesignerAMD
IntroductionNovember 19, 2007 (launched)
MarketDesktop
MicroarchitectureK10
TDP140 W
140,000 mW
0.188 hp
0.14 kW
Package
NameOPGA-940 (AM2)
TypeOrganic Micro Pin Grid Array
Contacts940
Dimension40.0 mm
4 cm
1.575 in
× 40.0 mm
4 cm
1.575 in
Pitch1.27 mm
0.05 in
Socket
NameSocket AM2+
TypePGA

Socket AM2+, also known as AM2r2, was the second socket for OPGA-940 and OPGA-938-packaged AMD microprocessors with an integrated DDR2 memory controller and the successor to Socket AM2. Socket AM2+ targets the desktop segment. Its contemporaries are Socket S1 for mobile processors and Socket F for the server and workstation market. For the small form factor desktop, mobile and embedded market AMD developed package ASB1. Socket AM2+ was superseded by Socket AM3.

The main improvements of Socket AM2+ over AM2 are support for HyperTransport generation 3.0 and separate core and northbridge power planes, a power saving feature. Socket AM2+ processors are compatible with the earlier Socket AM2, subject to the motherboard recognizing the CPU, limiting its HT link to generation 1.0 mode, and using a single power plane. The OPGA-940 package for Socket AM2+ has the same dimensions but is mechanically, due to keying, and electrically incompatible with Socket 939 for processors with a DDR memory controller, Socket 940 for first generation Opteron processors, and Socket AM3 and AM3+ for processors with a DDR3 memory controller.

Socket AM2 processors in the OPGA-940 package and Socket AM3 processors in the OPGA-938 package are compatible with Socket AM2+, subject to the motherboard recognizing the CPU and the limitations of Socket AM2+.

All processors for Socket AM2+ belong to AMD's Family 10h based on the K10 microarchitecture.

Features[edit]

  • 940-pin lidded micro pin grid array package, 1.27 mm pitch, 31 × 31 pins, 40 × 40 mm, organic substrate
  • 16 bit HyperTransport 3.0 interface up to 2.2 GHz, 4400 MT/s, 8.8 Gbyte/s in each direction
  • 2 × 64/72 bit DDR2 SDRAM interface (ganged or unganged) up to 533 MHz, PC-8500 (DDR2-1066), 17.0 Gbyte/s
    • Up to 4 UDIMMs (2 per channel), up to 4 Gbyte per UDIMM, SEC-DED ECC
    • JEDEC SSTL_1.8
  • P-States; ACPI C1, C1E, C2, C3, S1, S3, S5; dual power planes
  • Thermal diode, overtemperature protection

Chipsets[edit]

  • AMD 700 series
  • Nvidia nForce 700 series, GeForce 8000 series

Processors using Socket AM2+[edit]

  • AMD Phenom X4 "Agena", X3 "Toliman"
  • AMD Athlon X2 "Kuma"
  • AMD Athlon "Lima"
  • AMD Sempron "Sparta"
 List of all Socket AM2+-based Processors
ModelPriceProcessLaunchedµarchFamilyCoreCTFreqTurboTDP
Count: 0

Package Diagram[edit]

No data available. Presumably same dimensions as the OPGA-940 package for Socket AM2.

Socket Outline[edit]

No data available. Presumably same dimensions as Socket AM2.

Pin Map[edit]

Socket AM2+ pinmap.svg

Socket AM2/AM2+ Differences[edit]

Pin Socket AM2 Socket AM2+
AL4 RSVD ALERT_L
G5 RSVD CORE_TYPE
AE9 VSS KEY/VSS
H22 VSS KEY/VSS
F2 RSVD PLATFORM_TYPE
AK4 RSVD SA[0]
E2 VID[1] PVIEN/VID[1]
E3 VID[2] SVD/VID[2]
C1 VID[3] SVC/VID[3]
A4 VDD VDDNB
A6 VDD VDDNB
B5 VDD VDDNB
B7 VDD VDDNB
C6 VDD VDDNB
C8 VDD VDDNB
D7 VDD VDDNB
D9 VDD VDDNB
E10 VDD VDDNB
E8 VDD VDDNB
F11 VDD VDDNB
F9 VDD VDDNB
G10 VDD VDDNB
G12 VDD VDDNB
G4 RSVD VDDNB_FB_H
G3 RSVD VDDNB_FB_L

Pin Description[edit]

Signal Description
ALERT_L Programmable pin that can indicate different events, including a SB-TSI interrupt
CLKIN_H/L 200 MHz Differential PLL Reference Clock
CORE_TYPE Indicates that the processor is capable of split core and northbridge voltage plane operation
CPU_PRESENT_L Processor is present
DBREQ_L, DBRDY Debug Request/Ready
HTREF0, HTREF1 HyperTransport Compensation Resistor to VSS, VLDT
L0_CADIN/OUT_H/L[15:0] HT Link 0 Differential Command/Address/Data Input/Output
L0_CLKIN/OUT_H/L[1:0] HT Link 0 Differential Clock Input/Output
L0_CTLIN_H/L[1:0] HT Link 0 Differential Control Input/Output
LDTSTOP_L HT Stop Control Input for power management and link width and frequency change
MA0/MA1/MB0/MB1_CLK_H/L[2:0] DRAM Differential Clock
MA0/MA1/MB0/MB1_CS_L[1:0] DRAM Chip Select
MA0/MA1/MB0/MB1_ODT[0] DRAM Enable Pin for On Die Termination
MA/MB_ADD[15:0] DRAM Column/Row Address
MA/MB_BANK[2:0] DRAM Bank Address
MA/MB_CAS_L DRAM Column Address Strobe
MA/MB_CHECK[7:0] DRAM ECC Bits
MA/MB_CKE[1:0] DRAM Clock Enable
MA/MB_DATA[63:0] DRAM Data Bus
MA/MB_DM[8:0] DRAM Data Mask
MA/MB_DQS_H/L[8:0] DRAM Differential Data Strobe
MA/MB_RAS_L DRAM Row Address Strobe
MA/MB_WE_L DRAM Write Enable
M_VREF DRAM Interface Voltage Reference
M_ZP, M_ZN Compensation Resistor to VSS, VDDIO
PLATFORM_TYPE ?
PROCHOT_L Processor in HTC-active state input/output
PSI_L Power Status Indicator (low power state) for VDD regulator
PVIEN/VID[1] Prior to PWROK assertion signals to the processor whether the platform supports PVI or SVI operation
PWROK Voltages and CLKIN have reached specified operation
RESET_L Processor Reset
RSVD Reserved
SA[0] Sideband interface (APML/SBI/SMBus) address selection
SIC, SID Sideband Temperature Sensor Interface Clock, Data
SVD/VID[2] Serial VID Interface Data
SVC/VID[3] Serial VID Interface Clock
TCK, TDI, TDO, TMS, TRST_L JTAG interface
TEST* Test signal
THERMDA, THERMDC Thermal Diode Anode, Cathode
THERMTRIP_L Thermal Sensor Trip output
VDD Core power supply
VDD_FB_H/L Differential feedback to VDD regulator
VDDA Filtered PLL supply voltage
VDDIO DRAM I/O ring power supply
VDDIO_FB_H/L Differential feedback to VDDIO regulator
VDDNB Northbridge power supply
VDDNB_FB_H/L Differential feedback to VDDNB regulator
VID[5:0] Voltage ID (PVI) for VDD regulator
VLDT_A/B HyperTransport I/O ring power supply
VSS Ground
VTT DRAM Termination voltage
VTT_SENSE VTT monitor pin

References[edit]

  • "Socket AM2 Design Specification", AMD Publ. #31875, Rev. 3.00, May 2008
  • "BIOS and Kernel Developer’s Guide (BKDG) For AMD Family 10h Processors", AMD Publ. #31116, Rev. 3.48, April 2010
  • "Family 10h AMD Phenom™ Processor Product Data Sheet", AMD Publ. #44109, Rev. 3.00, November 2007
  • "Revision Guide for AMD Family 10h Processors", AMD Publ. #41322, Rev. 3.92, March 2012

See also[edit]

Facts about "Socket AM2+ - AMD"
designerAMD +
first launchedNovember 19, 2007 +
instance ofpackage +
market segmentDesktop +
microarchitectureK10 +
nameSocket AM2+ +
packageOPGA-940 (AM2) +
package contacts940 +
package length40 mm (4 cm, 1.575 in) +
package pitch1.27 mm (0.05 in) +
package typeOrganic Micro Pin Grid Array +
package width40 mm (4 cm, 1.575 in) +
socketSocket AM2+ +
tdp140 W (140,000 mW, 0.188 hp, 0.14 kW) +