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Package SP1 - AMD
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SP1
General Info
DesignerAMD
IntroductionJanuary 2014 (announced)
January 2016 (launched)
MarketServer, Embedded
MicroarchitectureCortex-A57
TDP32 W
Package
NameBGA-1021
TypeOrganic Micro Ball Grid Array
Contacts1021
Dimension27 mm × 27 mm
Pitch0.65-? mm

SP1 was a BGA-1021 package for AMD server microprocessors codenamed Seattle with 8 ARM Cortex-A57 CPU cores.


Features[edit]

  • 1021-pin lidless micro ball grid array package, 0.65 mm pitch minimum, 27 × 27 mm, organic substrate
  • 2 × 64/72 bit DDR3 SDRAM interface up to 800 MHz, PC3-12800 (DDR3-1600), 25.6 GB/s or
  • 2 × 64/72 bit DDR4 SDRAM interface up to 933 MHz, PC4-14900 (DDR4-1866), 29.9 GB/s
    • Up to 4 UDIMMs, RDIMMs, or SODIMMs (2 per channel), ECC supported
    • Up to 128 GB total with RDIMMs
  • PCIe Gen 1.0, 2.0, 3.0 (8 GT/s)
    • 8 lanes configurable 1x8, 2x4, 1x4 + 2x2
  • Integrated Controller Hub
    • 14 × SATA 1.0, 2.0, 3.0 (6 Gb/s)
    • 2 × 10 Gigabit Ethernet
    • 1 GbE system management port
    • SPI, UART, I2C, GPIO

Processors using SP1[edit]

  • AMD Opteron A1100 Series
 List of all SP1-based Processors
ModelPriceProcessLaunchedµarchFamilyCoreCTFreqTurboTDP
A112028 nm
0.028 μm
2.8e-5 mm
January 2016Cortex-A57OpteronSeattle41.7 GHz
1,700 MHz
1,700,000 kHz
25 W
25,000 mW
0.0335 hp
0.025 kW
A115028 nm
0.028 μm
2.8e-5 mm
January 2016Cortex-A57OpteronSeattle81.7 GHz
1,700 MHz
1,700,000 kHz
32 W
32,000 mW
0.0429 hp
0.032 kW
A117028 nm
0.028 μm
2.8e-5 mm
January 2016Cortex-A57OpteronSeattle82 GHz
2,000 MHz
2,000,000 kHz
32 W
32,000 mW
0.0429 hp
0.032 kW
Count: 3

Package Diagram[edit]

BGA-1021 31667 diag.svg

Approximate dimensions of the Seattle package, Part No. 31667. All dimensions in millimeters.

Pin Map[edit]

No data available.

References[edit]

  • "Product Brief: AMD Opteron™ A1100 SOC Series", PID 158465-B, 2016
  • "Hot Chips 26: The AMD Opteron™ A1100 Processor Codenamed "Seattle"", August 11, 2014
  • "Introducing the AMD Opteron™ A1100 for the Datacenter", January 2016
Facts about "Package SP1 - AMD"
designerAMD +
first announcedJanuary 2014 +
first launchedJanuary 2016 +
instance ofpackage +
market segmentServer + and Embedded +
microarchitectureCortex-A57 +
nameSP1 +
tdp32 W (32,000 mW, 0.0429 hp, 0.032 kW) +