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Socket SP3
General Info
Designer	AMD
Introduction	May 16, 2017 (announced) June 20, 2017 (launched)
Market	Server
Microarchitecture	Zen, Zen 2, Zen 3
TDP	120 W 120,000 mW 0.161 hp 0.12 kW , 155 W 155,000 mW 0.208 hp 0.155 kW , 180 W 180,000 mW 0.241 hp 0.18 kW
Package
Name	SP3, FCLGA-4094
Type	FC-OLGA
Contacts	4094
Dimension	75.40 mm 7.54 cm 2.969 in × 58.50 mm 5.85 cm 2.303 in × 6.26 mm 0.246 in
Pitch	0.87 mm 0.0343 in × 1.00 mm 0.0394 in
Socket
Name	SP3, LGA-4094
Type	SM-LGA
Succession
Socket G34 Socket SP5
Contemporary
Socket TR4 Socket sTRX4 Socket sWRX8

Socket SP3 is a microprocessor socket designed by AMD for the first three generations of their EPYC family of high performance server processors. It supports eight channels of DDR4 memory and eight 16-lane PCIe I/O links. Socket SP3 succeeded Socket G34 and was superseded by Socket SP5.

Three other sockets were derived from, and are mechanically identical to Socket SP3 but differ electrically: Socket TR4 a.k.a. Socket SP3r2 for first and second generation, and Socket sTRX4 for third generation Ryzen Threadripper high end desktop processors. These infrastructures support only four memory channels and UDIMMs instead of RDIMMs. Processors for these sockets are not compatible with Socket SP3 or vice versa. Socket sWRX8 is designated for Ryzen Threadripper workstation processors which support eight memory channels and both UDIMM and RDIMM types.

For mainstream desktop processors AMD developed Socket AM4. Contemporary mobile and embedded processors use the BGA packages FT5, FP5, FP6, and SP4.

Overview

Socket SP3 is a zero insertion force, screw actuated, surface-mount land grid array socket for use with a 4094-contact, 1.00 mm × 0.87 mm interstitial pitch, organic land grid array CPU package.

It supports eight channels of 72-bit DDR4 memory with up to 2 DIMMs per channel, eight 16-lane PCIe Gen 3/4 I/O links, three or four of which are repurposed as inter-socket links on dual socket systems, four USB 3.1 Gen 1 ports, and up to 32 SATA Gen 3 ports.

This compares to four DDR3 channels and five HyperTransport links on its predecessor Socket G34, while the newer Socket SP5 supports 12 channels of DDR5 memory, eight PCIe Gen 5 links, and four USB 3.2 Gen 1 ports. (SP4 and SP4r2 are ball grid array packages of EPYC 3000 embedded processors.)

The following AMD processor families use Socket SP3:

	CPU Family	Microarch.	Process	Products
Type 0	Family 17h Models 00h–0Fh	Zen	14 nm	EPYC 7001 "Naples" (Model 01h), EPYC Embedded 7001
Type 1	Family 17h Models 30h–3Fh	Zen 2	7 nm	EPYC 7002 "Rome" (Model 31h), EPYC Embedded 7002
Type 2	Family 19h Models 00h–0Fh	Zen 3	7 nm	EPYC 7003 "Milan" (Model 01h)

Codenames of AMD SP3 reference platforms (CRBs) are "Diesel", "Ethanol", "Daytona", and "Ethanol-X".

Specifications of a dual socket EPYC blade motherboard and collaterals including BOM, CAD file, CPLD programming data, Eagle layout, and schematic were published by the Open Compute Project under Project Olympus AMD EPYC, specifically the US1-EPYC implementation by Quanta.

Package Description

The SP3 CPU package is lidded, has a 58.50 mm × 75.40 mm organic substrate with flip chip die attachment, 4094 nickel and gold plated land pads, and weighs up to 140 g. It leaves AMD's OSAT partner in a shipping tray with a carrier frame pre-installed. The carrier frame is a part of the package loading mechanism and remains on the package in the socket.

The package substrate has six keying notches along the short edges preventing it from being inserted 180 degrees rotated into the carrier frame or socket, or in an incompatible socket with mismatching keying features. Four additional positions are reserved for future models. However all sockets SP3, TR4, sTRX4, and sWRX8, and all processors for these sockets have the same keying. It is worth noting that these processors are also electrically keyed by pin CORETYPE, SP3R1, and SP3R2, and SP3 motherboards are not supposed to power up the socket if a TR4 or sTRX4 processor is installed. To boot the processor compatible firmware is also required. A triangular symbol on both sides of the substrate marks the location of pin A1, with corresponding markings on the socket.

The lid a.k.a. integrated heat spreader of Type-0 processors has an internal support bar bisecting their four dies. SP3 packages place decoupling capacitors under the lid around the chiplet periphery on the top side, and in two windows in the pad grid on the bottom side.

All SP3 packages are multi-chip modules. Type-0 packages integrate four identical "Zeppelin" rev. ZP-B2 dies, each containing eight CPU cores and implementing one quarter of the processor's memory and I/O interfaces. AMD used the same dies in various revisions for first generation EPYC server and embedded processors, and the first two generations of Ryzen Threadripper and Ryzen desktop processors without iGPU; see CPU Family 17h. Customized, single-ended, 4:1 SerDes links routed on two package layers, 32 lanes wide in each direction, connect the dies. AMD chose not to route these signals on a 2.5D interposer or EMIB for reasons of product flexibility and reach. The SerDes run at FCLK so for instance a 1.33 GHz FCLK coupled to the bus clock of DDR4-2666 SDRAM gives a raw data rate of 5.33 GT/s per lane or 21.33 GB/s in each direction. The following diagram illustrates the routing of high speed signals between the dies and the package contacts. Four package layers were used for these signals: Layer A, B, or both for the GMI links, C & D for the xGMI and I/O links, and all four layers (one per channel) for the memory interfaces.

Type-0 package top view, not to scale. CAKEs extend the Data Fabric transport layer off-chip by connecting to a CAKE in another die. Their PCS interface drives a GMI (same socket) or xGMI (different socket) physical link. Each die has two 16-lane multi-function I/O interfaces. Type A supports the PCIe, SATA, and XGBE protocols, Type B only PCIe. CAKE2/CAKE3 and the I/O controllers share a 16-lane PHY group. CS0 and CS1 are the Data Fabric's interface to the memory controllers, UMC0 and UMC1 respectively. Not shown are the Control Fabric interfaces which use TWIX (same socket) or WAFL (different socket) physical links, USB signals (USB0 group from die 0, USB1 from die 1), and low speed busses. For details and the on-chip topology see AMD Infinity Fabric.

Type-1/2 packages integrate one central I/O die and 2, 4, 6, or 8 identical Core Complex Dies which contain eight CPU cores each, populated in order CCD2/CCD4, CCD0/CCD6, and CCD1/CCD7. This silicon is "Starship" rev. SSP-B0 (CPU Family 17h) and "Genesis" GN-B1 (19h). AMD used the same chips, possibly different revisions, for second and third generation EPYC server and embedded processors, and Ryzen Threadripper HEDT and workstation processors.

Type-1/2 package top view, not to scale. Eight CCM blocks extend the Data Fabric on the IOD to the CCDs, each driving a GMI2 physical link routed on two package layers. SSP-B0 CCDs contain two CCXs with 16 MiB L3 cache each, the GMI2 port and its die bumps are located in the center to reduce memory latency from the L3 cache. GN-B1 CCDs contain one CCX with 32 MiB L3 cache, the GMI2 signals are routed to the chip edge. These are serial, single-ended links with 31 transmit (to IOD) and 39 receive lanes, one clock gating lane per direction, and a differential pair of clock lanes. GMI2 uses 10:1 SerDes running at FCLK, so for instance a 1.46 GHz FCLK (~ DDR4-2933) gives a raw data rate of 14.6 GT/s per lane or 71.2 GB/s per link from IOD to CCD. Not shown are eight TWIX ports extending the Control Fabric to the CCDs, these links run on four data and two clock lanes, as well as WAFL links, USB signals, and low speed busses. The "Rome" package actually has 20 layers (9-2-9) in total. For details and the IOD internal topology see AMD Infinity Fabric.

Socket SP3 supports eight 72-bit DDR4 memory channels A-H with up to 2 DIMMs per channel. The DIMMs are placed in order A-D and E-H parallel to the socket's broad sides. This also applies to Socket sTRX4 (where only the four channels A, D, E, and H are available), Socket sWRX8 (with a maximum of one DIMM per channel), as well as SP3 and sTRX4 motherboards supporting only one DIMM per channel as a trade-off between performance (as point-to-point connections improve signal integrity and permit higher data rates), board size and memory capacity.

Furthermore Socket SP3 supports eight 16-lane multi-function I/O interfaces P0-P3 and G0-G3. All of these interfaces can be configured as PCIe link, some alternatively as xGMI link or S-Link, and some lanes as SATA, SATA Express, or XGBE link.

S-Link is a cache coherent link to CCIX memory expanders introduced on Type-1 processors. As AMD switched to CXL, first available on Socket SP5, support for S-Link and CCIX/PCIe ESM mode (using 25 GT/s PHYs on Type-1/2 IODs) was canceled.

SATA Express combines PCIe and SATA controllers on the same two lanes with a GPIO pin for a device to indicate its controller type. XGBE links support the 10GBASE-KR, 1000BASE-KX, and SGMII (10/100/1000 Mbit/s) backplane Ethernet protocols. The SATAe and XGBE functions are implemented on Type-0 processors but not Type-1/2, and support for these interfaces on Socket SP3 was withdrawn.

On dual socket (2P) systems the cache coherent xGMI links connect the Data Fabrics of each processor. Type-0 processors use four links, each attached to one die on the package, creating a NUMA system with three memory distances and one or two hops between any two dies. Type-1/2 processors can use three or four xGMI links depending on bandwidth requirements, all connected to the central I/O die. xGMI links use 16 lanes, unused links release 16 lanes per socket for I/O. The integrated SMU dynamically adjusts the link width (number of active lanes) for power saving. The WAFL link, one or two lanes, connect the Control Fabrics on each processor, i.e. the PSP, SMUs and other IPs, primarily for temperature monitoring, power and frequency control. Four socket systems are not supported although the available resources do not seem to rule this out.

Type-0 processors support DDR4-2666 memory and PCIe Gen 3 (8 GT/s) on their I/O links. Type-1/2 processors support DDR4-3200 memory and PCIe Gen 4 (16 GT/s), with xGMI links reaching 18 GT/s. Optimized motherboards are required to realize these data rates. Accordingly Type-1 processors can only run at restricted rates on Type-0 boards, after a BIOS update providing compatible firmware. Type-2 processors are not supported on first generation EPYC boards. Conversely EPYC 7001 "Naples" processors are incompatible with dual socket boards implementing only three xGMI links.

Socket Description

Socket SP3, TR4, sTRX4, and sWRX8 are mechanically identical. They have a 79.9 mm × 120.3 mm footprint and consist of the following components, from top to bottom:

• Force Frame
• Rail Frame
• Socket Housing
• Stiffener Frame
• Insulators
• Backplate

Removable components are:

• Heatsink
• Carrier Frame
• External Cap
• PnP Cover Cap

The force frame, rail frame, and stiffener frame constitute the Socket Actuation Mechanism. The heatsink, the CPU in a carrier frame, the SAM, housing, and backplate are separately orderable parts. The latter three are motherboard components for OEMs. Socket SP3 suppliers are Foxconn Interconnect Technology (website) and Lotes Co. Ltd. (website).

LGA sockets use cantilever springs in the socket housing to make electrical contact with flat pads on the bottom of the CPU package. The SAM creates the Z-axis compression load between the CPU package and the housing soldered to the motherboard. Considerable force is required to deflect thousands of springs at once. According to AMD the SP3 SAM must exert a minimum force of 95 kg-f (932 N) to ensure proper mating of the package with the socket, a maximum of 125 kg-f (1226 N), so SP3 sockets are not actuated by a lever but three Torx screws linking their force frame and stiffener frame. The stiffener frame is attached to the backplate on the bottom side of the motherboard.

The force frame a.k.a. load plate is a largely flat piece stamped out of 2.0 mm thick stainless steel sheets. It has a window allowing the top of the CPU package lid to protrude for contact with the heatsink. When actuated it applies a load to the flanges on the sides of the lid. The force frame is attached to the stiffener frame by a hinge. It permits vertical motion when the socket is actuated, integrates a torsional spring to keep the frame open while the user inserts or removes the CPU, and a stop feature limiting the opening angle to some 105 degrees. The force frame is actuated by three captive screws with a Torx T20 head and M3.5×0.6 or larger thread. They mate with self-clinching PEM nuts on the stiffener frame.

These screws must be tightened in a particular order to avoid damage to the contact springs, the order is marked on the force frame. The lone screw opposite the hinge first, followed by the two screws next to it, with a maximum torque of 16.1 ± 1.2 kgf-cm (14.0 ± 1.0 lbf-in, 1.58 ± 0.1 N⋅m) according to AMD. Ryzen Threadripper boxed processors come with a small preset torque limiting screwdriver for this purpose. Some sources recommend two passes to engage the threads, then tighten the screws. To remove the processor the screws should be opened in reverse order.

The rail frame together with the carrier frame constitute the package loading mechanism. Its main purpose is to minimize the risk of contact spring damage due to handling errors or accidents when loading the package into the housing. The rail frame is a stainless steel frame overmolded with black polycarbonate plastic and attached to the stiffener frame with a second hinge similar to the force frame. The steel frame forms a closed loop for stability and extends into a pair of finger lift tabs marked with blue color. The carrier frame slides into the rail frame along rails molded into both parts. They also have locking features which secure the carrier frame in the final position. When the rail frame is closed, latching features engage with undercut steps on the housing to ensure the package remains properly seated during actuation.

The carrier frame is made from colored polycarbonate material. EPYC 7001 series processors use blue, 7002 series green, 7003 series grey, and Threadripper processors (for Socket TR4, sTRX4, and sWRX8) orange carriers. The carrier frame has a window for the package lid and a handle to pick up, insert, and remove the carrier without touching and contaminating the contact pads on the package. The handle bears the name of the supplier, commonly Lotes, and has a hole to provide access for one of the actuation screws. The opposite side of the frame is marked with a date and revision code. The carrier frame has six latches and is designed to snap onto the top side of the package substrate while the CPU package is sitting in the shipping tray. Keying features match two keying notches in the package to prevent it from being inserted 180 degrees rotated. Four alignment pegs on the carrier frame engage with alignment holes in the socket housing when the rail frame is closed.

The carrier frame is not supposed to be removed and not sold to consumers. Owners of a processor under warranty with a broken frame should contact the vendor or AMD customer service. Third parties may sell carrier frames salvaged from defective CPUs. If a replacement can or should be 3D-printed is unclear. It is evidently possible, with some care, to insert the package into the housing without the carrier.

The external cap is made from a transparent polycarbonate material. It has the same outer dimensions as the carrier frame, and the same rail and locking features to slide into the rail frame. The external cap ships with the SAM and protects the contact springs when no processor is installed in the socket. A label on its top side reminds users to remove the cap before inserting the processor. On the reverse side the external cap has a cavity fitting the cover cap, so the SAM with external cap can be installed over the housing with cover cap.

The cover cap is made from black liquid crystal polymer (LCP). It has the same alignment pegs as the carrier frame and latching features engaging with undercut steps on the housing, separate from those for the rail frame. The position of the pegs is asymmetric so the cap cannot be installed 180 degrees rotated. The cover cap ships with the socket housing and facilitates pick-and-place with a vacuum nozzle during board assembly. Its top protrusion has vent holes, bears the name of the socket and supplier, and serves as an alignment feature against the SAM with external cap.

The socket housing is a black LCP casing with two windows where decoupling capacitors can be placed on the top side of the motherboard. Its outline is asymmetric, preventing the SAM from being installed 180 degrees rotated. The walls have undercut steps on the outside for the rail frame and cover cap latches, cavities accomodating the carrier frame latches and keying features, finger access cut-outs in the middle of the long edges, and four alignment holes to receive the alignment pegs on the carrier frame. A chamfered corner marks the location of pin A1. The contact springs extend into a J-lead at the bottom of the housing with 0.6 mm diameter solder balls attached for surface mounting. Standoffs limit the distance to the PCB.

The stiffener frame a.k.a. base plate is a flat, 1.7 mm thick stainless steel plate with a window fitting the socket housing, and seven self-clinching, flush integrated nuts to fasten the force frame and a heatsink. The position of the four heatsink nuts (PEM nut standoffs) is asymmetric so the heatsink can only be installed in one orientation. They have a M3.5×0.6 internal thread, and height 6.0 mm including the stiffener frame thickness or 6.18 mm from the top of the PCB. The top of the CPU package lid is 8.959 mm from the top of the PCB when the socket is actuated.

The SAM must be attached to a backplate on the bottom side of the motherboard or directly mounted to the chassis. This is facilitated by four M3.5×0.6 captive nuts on the stiffener frame with a Torx T20 head, a head diameter of 6.0 mm and maximum head height of 2.3 mm, to be tightened in a diagonal pattern with a maximum torque of 16.1 ± 1.2 kgf-cm (14.0 ± 1.0 lbf-in, 1.58 ± 0.1 N⋅m).

The backplate is a flat, 2.5 mm thick stainless steel plate with four self-clinching studs with a M3.5×0.6 external thread. Its dimensions are symmetric so it can be installed 180 degrees rotated, and like the housing it has a window for bottom side components. The studs protrude upwards through holes in the PCB and mate with the captive nuts on the stiffener frame. Backplates with stud heights between 4.0 and 5.6 mm are available to account for different PCB thicknesses.

Two sheets made from insulating material, 0.18 mm thick and about as large as the respective metal part separate the stiffener frame and backplate from the motherboard.

Socket SP3 processors require a heatsink. Heatsinks weighing up to 450 g can be mounted to the PEM nuts on the stiffener frame, heavier heatsinks require additional support such as direct chassis attachment. The allowable spring force exerted by the heatsink on the package lid is 75 ± 15 lb-f (334 ± 67 N). Thermal interface material should be applied between the lid and heatsink. The four captive spring screws on the heatsink should be tightened in a diagonal pattern with the same maximum torque of 16.1 ± 1.2 kgf-cm (14.0 ± 1.0 lbf-in, 1.58 ± 0.1 N⋅m) as the actuation screws.

Feature Summary

• Lidded land grid array package, 75.40 mm × 58.50 mm
  • 4094 contacts in a 82 × 55 grid with 0.87 mm × 1.00 mm interstitial pitch
  • Organic substrate, flip chip die attachment

• 8 × 72 bit DDR4 SDRAM interface
  • Type-0 processors: Up to 1333 MHz, PC4-21333 (DDR4-2666), 170.67 GB/s total raw bandwidth
  • Type-1/2 processors: Up to 1600 MHz, PC4-25600 (DDR4-3200), 204.8 GB/s total raw bandwidth
  • Up to 2 DIMMs/channel, up to 16 DIMMs total
  • RDIMM, LRDIMM, 3DS DIMM, NVDIMM-N types
  • ECC supported
  • Memory capacity 256 GiB/channel (Type-0) or 512 GiB/channel (Type-1/2)

• Eight multi-function I/O interfaces P0-P3, G0-G3

Lane

15

14

13

12

11

10

9

8

7

6

5

4

3

2

1

0

xGMI

S-Link

PCIe

x16

x8

x8

x4

x4

x4

x4

x2

x2

x2

x2

x2

x2

x2

x2

x1

x1

x1

x1

x1

x1

x1

x1

x1

x1

x1

x1

x1

x1

x1

x1

SATAe

1

0

SATA

7

6

5

4

3

2

1

0

XGBE

3

2

1

0

Type-0 PHYs

PHY 4

PHY 3

PHY 2

PHY 1

PHY 0

Type-1/2 PHYs

PHY 3

PHY 2

PHY 1

PHY 0

• PCIe protocol supported on all interfaces
  • Type-0 processors: PCIe Gen 1, 2, 3 (8 GT/s)
  • Type-1/2 processors: PCIe Gen 1, 2, 3, 4 (16 GT/s)
  • 16 lanes, up to 8 ports per interface configurable x16, x8, x4, x2, x1 with power-of-two alignment (e.g. 1x4 + 4x1 + 1x8)
  • Max. 7 PCIe ports in each 8-lane subset (e.g. 0x8 + 8x1 is not possible)
  • Max. 7 PCIe ports per interface if any lane is configured as SATA port
  • Different PCIe generations supported on the ports in the same interface
  • Lane polarity inversion, per port lane reversal
  • Up to 128 PCIe lanes total on 1P systems
  • Up to 64 or 80 PCIe lanes total per socket on 2P systems

• xGMI protocol supported on G0-G3, used on 2P systems only
  • Type-0 processors: Four x16 links per socket required
  • Type-1/2: Three or four links depending on bandwidth requirements
  • Four links: G0 (socket 0) ↔ G2 (socket 1), G1 ↔ G3, G2 ↔ G0, G3 ↔ G1
  • Three links: G0 ↔ G2, G1 ↔ G3, G2 ↔ G0
  • Max. raw data rate 18 GT/s (Type-1/2)

• S-Link protocol on P0-P3
  • Not supported on Socket SP3

• SATA Gen 1, 2, 3 (6 Gb/s) protocol supported on the lower 8 lanes of P0, P1, G2, G3
  • P0: SATA00-07, P1: SATA10-17, G2: SATA20-27, G3: SATA30-37
  • Up to 32 SATA ports total on 1P systems
  • Up to 16 SATA ports total per socket on 2P systems

• XGBE protocols on lanes 4-7 of P0, P1, G2, G3
  • P0: XGBE00-03, P1: XGBE10-13, G2: XGBE20-23, G3: XGBE30-33
  • Not supported on Socket SP3

• Five (Type-0 processors) or four (Type-1/2) PHY groups on each interface
  • Lanes sharing a PHY group must use the same protocol (PCIe, SATA)
  • On Type-0 platforms lanes 0-3 must use the same protocol for compatibility with Type-1 processors

• Supplementary I/O interface
  • PCIe Gen 1, 2 (5 GT/s), 2 lanes
  • WAFL interface on 2P systems
    • Option 1: WAFL[0] (socket 0) ↔ WAFL[1] (socket 1), WAFL[1] (s0) ↔ WAFL[0] (s1)
    • Option 2 (Type-1/2 only): WAFL[0] (s0) ↔ WAFL[1] (s1), WAFL[1] (s0) and WAFL[0] (s1) not used
  • Type-0 processors: Unused lanes remain unconnected
  • Type-1/2: Unused lanes are available for I/O, e.g. to attach a BMC

• 4 × USB 1.1, 2.0, 3.1 Gen 1 (5 Gb/s) ports

• Low speed interfaces (some sharing pins):
  • 8-bit eMMC v5.0 (400 MB/s)
  • 2 × 4-wire or 4 × 2-wire UART modeled after the 16550
  • LPC, two clocks
  • 1/2/4-bit SPI/eSPI up to 100 MHz (SPI) and 66 MHz (eSPI)
  • 6 × I²C
  • 2 × SMBus
  • 4 × SGPIO
  • 2 × SATA DevSlp
  • 78 × GPIO
  • Sideband Interface a.k.a. APML (SB-RMI, SB-TSI)
  • 2 × Serial VID Interface (SVI2)
  • JTAG

Processors using Socket SP3

• Show processors for Socket SP3

Photos

• 

  FCLGA-4094, package front

• 

  FCLGA-4094, package back

• 

  Socket SP3, open

Package Diagrams

SP3 package. All dimensions in millimeters.

"Naples" package

"Rome" package

SP3 carrier frame (AMD ref. design, not Lotes). All dimensions in millimeters.

Socket Diagrams

Socket SP3 housing (AMD). The 4094 contact springs are not shown. All dimensions in millimeters.
Foxconn version.

Socket SP3 PCB layout. NPTH = Non-Plated Through Hole. All dimensions in millimeters.

Pin Map

Socket SP3 pinout, top view. This is a preview, click for a larger image and other views.

Pin Description

Socket SP3, sTRX4, and sWRX8 have the same pinout with some constraints as noted.

Signal	Type	Description
MA-MD_ACT_L	O-IOMEM_ABCD-S	DRAM Channel A-D Activation Command
MA-MD_ADD[13:0]	O-IOMEM_ABCD-S	DRAM Column/Row Address
MA-MD_ADD_17	O-IOMEM_ABCD-S	DRAM Column/Row Address 17
MA-MD_ALERT_L	I-IOMEM_ABCD-S	DRAM Alert (CRC error and Command/Address parity error)
MA-MD_BANK[1:0]	O-IOMEM_ABCD-S	DRAM Bank Address
MA-MD_BG[1:0]	O-IOMEM_ABCD-S	DRAM Bank Group
MA-MD_CAS_L_ADD[15]	O-IOMEM_ABCD-S	DRAM Column Address Strobe or Column/Row Address 15
MA-MD_CHECK[7:0]	B-IOMEM_ABCD-S	DRAM ECC Check Bits
MA-MD_C[2:0]	O-IOMEM_ABCD-S	DRAM Chip ID Signals
MA-MD_DATA[63:0]	B-IOMEM_ABCD-S	DRAM Data Bus
MA-MD_DQS_H/L[8:0]	B-IOMEM_ABCD-S	DRAM Differential Data Strobe
MA-MD_DQS_H[17:9]	B-IOMEM_ABCD-S	DRAM Differential Data Strobe for RDIMMs, DM[8:0] Data Mask output for UDIMMs
MA-MD_DQS_L[17:9]	B-IOMEM_ABCD-S	DRAM Differential Data Strobe for RDIMMs, not connected for UDIMMs
MA-MD_EVENT_L	I-IOMEM_ABCD-S	DRAM Thermal Event
MA-MD_PAROUT	O-IOMEM_ABCD-S	DRAM Command and Address Parity
MA-MD_RAS_L_ADD[16]	O-IOMEM_ABCD-S	DRAM Row Address Strobe or Column/Row Address 16
MA-MD_RESET_L	O-IOMEM_ABCD-S	DRAM Reset
MA-MD_WE_L_ADD[14]	O-IOMEM_ABCD-S	DRAM Write Enable or Column/Row Address 14
MA-MD_ZVSS	A	DRAM Interface Drive-Strength Auto-Compensation Resistor to VSS
MA0-MD0_CKE[1:0] MA1-MD1_CKE[1:0]	O-IOMEM_ABCD-S	DRAM Channel A-D DIMM 0-1 Clock Enable
MA0-MD0_CLK_H/L[1:0] MA1-MD1_CLK_H/L[1:0]	O-IOMEM_ABCD-D	DRAM Channel A-D DIMM 0-1 Differential Clock
MA0-MD0_CS_L[1:0] MA1-MD1_CS_L[1:0]	O-IOMEM_ABCD-S	DRAM Channel A-D DIMM 0-1 Chip Select
MA0-MD0_ODT[1:0] MA1-MD1_ODT[1:0]	O-IOMEM_ABCD-S	DRAM Channel A-D DIMM 0-1 Enable Pin for On Die Termination
ME-MH_ACT_L	O-IOMEM_EFGH-S	DRAM Channel E-H Activation Command
ME-MH_ADD[13:0]	O-IOMEM_EFGH-S	DRAM Column/Row Address
ME-MH_ADD_17	O-IOMEM_EFGH-S	DRAM Column/Row Address 17
ME-MH_ALERT_L	I-IOMEM_EFGH-S	DRAM Alert (CRC error and Command/Address parity error)
ME-MH_BANK[1:0]	O-IOMEM_EFGH-S	DRAM Bank Address
ME-MH_BG[1:0]	O-IOMEM_EFGH-S	DRAM Bank Group
ME-MH_CAS_L_ADD[15]	O-IOMEM_EFGH-S	DRAM Column Address Strobe or Column/Row Address 15
ME-MH_CHECK[7:0]	B-IOMEM_EFGH-S	DRAM ECC Check Bits
ME-MH_C[2:0]	O-IOMEM_EFGH-S	DRAM Chip ID Signals
ME-MH_DATA[63:0]	B-IOMEM_EFGH-S	DRAM Data Bus
ME-MH_DQS_H/L[8:0]	B-IOMEM_EFGH-S	DRAM Differential Data Strobe
ME-MH_DQS_H[17:9]	B-IOMEM_EFGH-S	DRAM Differential Data Strobe for RDIMMs, DM[8:0] Data Mask output for UDIMMs
ME-MH_DQS_L[17:9]	B-IOMEM_EFGH-S	DRAM Differential Data Strobe for RDIMMs, not connected for UDIMMs
ME-MH_EVENT_L	I-IOMEM_EFGH-S	DRAM Thermal Event
ME-MH_PAROUT	O-IOMEM_EFGH-S	DRAM Command and Address Parity
ME-MH_RAS_L_ADD[16]	O-IOMEM_EFGH-S	DRAM Row Address Strobe or Column/Row Address 16
ME-MH_RESET_L	O-IOMEM_EFGH-S	DRAM Reset
ME-MH_WE_L_ADD[14]	O-IOMEM_EFGH-S	DRAM Write Enable or Column/Row Address 14
ME-MH_ZVSS	A	DRAM Interface Drive-Strength Auto-Compensation Resistor to VSS
ME0-MH0_CKE[1:0] ME1-MH1_CKE[1:0]	O-IOMEM_EFGH-S	DRAM Channel E-H DIMM 0-1 Clock Enable
ME0-MH0_CLK_H/L[1:0] ME1-MH1_CLK_H/L[1:0]	O-IOMEM_ABCD-D	DRAM Channel E-H DIMM 0-1 Differential Clock
ME0-MH0_CS_L[1:0] ME1-MH1_CS_L[1:0]	O-IOMEM_EFGH-S	DRAM Channel E-H DIMM 0-1 Chip Select
ME0-MH0_ODT[1:0] ME1-MH1_ODT[1:0]	O-IOMEM_EFGH-S	DRAM Channel E-H DIMM 0-1 Enable Pin for On Die Termination
FORCE_SELFREFRESH	I-IO18S5-S	NVDIMM Force Self-Refresh
NV_SAVE_L	O-IO18S5-S	NVDIMM SAVE Signal
P0-P3_RXP/RXN[15:0]	I-PCIE-D	PCIe Interface P0-P3 Receive Data Differential Pairs
P0-P3_TXP/TXN[15:0]	O-PCIE-D	PCIe Transmit Data Differential Pairs
P0A/P1A/P2B/P3B_ZVSS	A	PCIe Drive-Strength Auto-Compensation Resistor to VSS for P0-P3
G0-G3_RXP/RXN[15:0]	I-XGMI-D or I-PCIE-D	xGMI or PCIe Interface G0-G3 Receive Data Differential Pairs
G0-G3_TXP/TXN[15:0]	O-XGMI-D or O-PCIE-D	xGMI or PCIe Transmit Data Differential Pairs
G0B/G1B/G2A/G3A_ZVSS	A	PCIe Drive-Strength Auto-Compensation Resistor to VSS for G0-G3
PCIE_RST(0-3)_L	O-IO33S5-S	Reset signal for PCIe devices. Type-0: from die 0-3, Type-1/2: from I/O die
WAFL_RXP/RXN[1:0]	I-WAFL-D	WAFL Receive Data Differential Pairs
WAFL_TXP/TXN[1:0]	O-WAFL-D	WAFL Transmit Data Differential Pairs
WAFL(0-3)_ZVSS	A	WAFL Drive-Strength Auto-Compensation Resistor to VSS; Type-0: die 0-3, Type-1/2: I/O die
SATA(0-3)(0-7)_RXP/RXN	I-SATA-D	SATA Receive Data Differential Pairs (alt. func. of P0, P1, G2, and G3 lane 0-7)
SATA(0-3)(0-7)_TXP/TXN	O-SATA-D	SATA Transmit Data Differential Pairs
DEVSLP(0-1)	I-IO33S5-OD	SATA DEVSLP
SGPIO(0-3)_CLK	O-IO33S5-S	SGPIO Interface 0-3 CLK Output; Type-0: from die 0-3, Type-1/2: from I/O die
SGPIO(0-3)_DATAIN	I-IO33S5-S	Type-0: SGPIO DATA Input, Type-1/2: Reserved
SGPIO(0-3)_DATAOUT	O-IO33S5-S	SGPIO DATA Output
SGPIO(0-3)_LOAD	O-IO33S5-S	SGPIO LOAD Output
XGBE(0-3)(0-3)_RXP/RXN		XGBE Receive Data Differential Pairs (alt. func. of P0, P1, G2, G3 lane 4-7)
XGBE(0-3)(0-3)_TXP/TXN		XGBE Transmit Data Differential Pairs
MDIO(0-7)_SCL		MDIO Port 0-7 Clock (alt. func. of SGPIO interface)
MDIO(0-7)_SDA		MDIO Data
USB_0/1_HSD(0-3)P/N	B-IO33S5-D	USB Port 0-3 High Speed I/O Differential Pairs; Type-0: from die 0/1 (die 0 ports 0-1, die 1 ports 2-3), Type-1/2: from I/O die
USB_0/1_SS_(0-3)RXP/RXN	I-USB_S5-D	USB Port 0-3 Super Speed Receive Differential Pairs; Type-0: from die 0/1 (die 0 ports 0-1, die 1 ports 2-3), Type-1/2: from I/O die
USB_0/1_SS_(0-3)TXP/TXN	O-USB_S5-D	USB Port 0-3 Super Speed Transmit Differential Pairs
USB_OC(0-3)_L	I-IO33S5-S	USB Port 0-3 Over Current signal from USB connector; Type-0: to die 0, 0, 1, 1; Type-1/2: to I/O die
USB(0-3)_0/1_ZVSS	A	USB Port 0-3 Drive-Strength Auto-Compensation Resistor to VSS; Type-0: die 0/1, Type-1/2: I/O die
UART(0-1)_CTS_L	I-IO33-S	UART Clear To Send Input (alt. func. of UART(2-3)_RXD)
UART(0-1)_INTR	I-IO33-S	UART Interrupt Request
UART(0-1)_RTS_L	O-IO33-S	UART Request To Send Output (alt. func. of UART(2-3)_TXD)
UART(0-3)_RXD	I-IO33-S	UART Receive Data
UART(0-3)_TXD	O-IO33-S	UART Transmit Data
SPI_CLK	O-IO18-S	SPI Clock
SPI_DO	B-IO18-S	SPI Data Out or Data[0] for multi-I/O SPI/eSPI device
SPI_DI	B-IO18-S	SPI Data In or Data[1]
SPI_WP_L	B-IO18-S	SPI Write Protect or Data[2]
SPI_HOLD_L	B-IO18-S	SPI Hold Signal (asserted low to hold the SPI transaction) or Data[3]
PSP_ROM_CS_L SPI_TPM_CS_L	O-IO18-S	SPI Chip Select for PSP ROM or TPM
SPI_CS1/CS2_L	O-IO18-S	SPI Chip Select
ESPI_CLK	O-IO18-S	ESPI Clock (alt. func. of SPI_CLK)
ESPI_DAT(0-3)	B-IO33-S	ESPI Data[0], Data[1:0], Data[3:0] (alt. func. of SPI_DO/DI/WP_L/HOLD_L)
ESPI_CS_L	O-IO18-S	ESPI Chip Select (SPI_CS2_L)
ESPI_ALERT_L	I-IO18-S	ESPI Alert Input (LDRQ0_L); Requests service from eSPI master
ESPI_RESET_L	I-IO33-S	ESPI Reset Input (KBRST_L); PCIE_RST0_L suggested as reset output
LPC	ROM,	1=SPI ROM (default)
LAD(0-3)	B-IO33-S	LPC Command/Address/Data
LDRQ0_L	I-IO33-S	Encoded DMA/Bus Master Request 0
LFRAME_L	O-IO33-S	LPC Bus Frame
LPCCLK(0-1)	O-IO33-S	LPC 33 MHz Clock
LPC_CLKRUN_L	B-IO33-OD	LPC Clock Run Signal
LPC_PD_L	O-IO33S5-S	LPC Power Down
LPC_PME_L	I-IO33S5-S	LPC Power Management Event
LPC_RST_L	O-IO33S5-S	LPC Reset
LPC_SMI_L	I-IO33-S	LPC System Management Interrupt
SERIRQ	B-IO33-S	Serial IRQ for DMA
EMMC_CLK		eMMC Clock Output (0-200 MHz)
EMMC_CMD		eMMC Command/Response (LPC_PD_L)
EMMC_DAT(0-7)		eMMC Data (alt. func. of LAD0-LAD3, LPCCLK0, LPC_CLKRUN_L, LPCCLK1, SERIRQ)
EMMC_DS		eMMC HS400 Data Strobe Input (LFRAME_L)
EMMC_PWR_CTRL		(LPC_PME_L)
I2C(0-5)_SCL	B-DUAL-OD	I2C Port 0-5 Clock
I2C(0-5)_SDA	B-DUAL-OD	I2C Data
SCL0	B-IO33-OD	SMBus Port 0 Clock (alt. func. of I2C2)
SDA0	B-IO33-OD	SMBus Port 0 Data
SCL1	B-IO33S5-OD	SMBus Port 1 Clock (alt. func. of I2C3)
SDA1	B-IO33S5-OD	SMBus Port 1 Data
HP_SCL, HP_SDA		Hotplug SMBus (I2C0)
SFP_SCL, SFP_SDA		SFP Bus (I2C1)
SPD_SCL, SPD_SDA		SPD Bus (I2C2)
BMC_SCL, BMC_SDA		BMC SMBus (I2C3)
AGPIO*_(0-3)		Advanced GPIO pin for interrupt, wake, or I/O; Type-0: die 0-3, Type-1/2: I/O die
EGPIO*_(0-3)		Enhanced GPIO for I/O only; Type-0: die 0-3, Type-1/2: I/O die
EGPIO*		Enhanced GPIO for I/O only; Type-0: die 0, Type-1/2: I/O die
REFCLK100SSC_P/N	O-CLK-D or I-CLK-D	100 MHz CPU Reference Clock; Output from BSP, or input for AP; SSC option
GPP_CLK(0-3)BP/N	O-CLK-D	100 MHz Differential PCIe Reference Clock; Type-0: from die 0-3, Type-1/2: from I/O die
GPP_CLK(0-3)TP/N	O-CLK-D	100 MHz Differential PCIe Reference Clock; Type-0: from die 0-3, Type-1/2: from I/O die
X156M_H/L[3:0]	I-XGBECLK-D	Differential 156.25 MHz Reference CLK Input; Type-0: to die 0-3, Type-1/2: to I/O die
X32K_X1/X2	I-IO18S5-S	32768 Hz Clock XTAL or (X32K_X1 only) Clock Input, for the integrated RTC
X48M_X1/X2	I-IO18S5-S	48 MHz Clock XTAL or (X48M_X1 only) Clock Input, for the integrated clock generator
RTCCLK	O-IO18S5-S	32 kHz Real Time Clock Output, e.g. BSP to AP, or for a device requiring an RTC clock
KBRST_L	I-IO33-S	Keyboard Controller Reset Input (warm reset)
PM_INTR_L	I-IO33-S	PM_INTR_L function for NVMe drive I2C subsystem and PCIe hot-plug subsystem
PWR_BTN_L	I-IO33S5	Power Button; Requests sleep state or causes wake event
PWR_GOOD	I-IO33S5-S	Power Good Input; Asserted when all voltages and clock inputs are within specification; From motherboard to BSP, or from BSP to AP
PWRGD_OUT	O-IO33S5-S	Power Good Output, from BSP to PWR_GOOD input of AP
PWROK	B-IO18-OD	Power OK; Asserted by the processor after all power planes are active, the system clock generators are powered up and run stably
RESET_L	B-IO18-OD	Bidirectional signal that resets the processor when asserted; Normally controlled by an internal state machine but can also be asserted by a second external source
RSMRST_L	I-IO18S5-S	Resume Reset from motherboard, resets all in-processor S5 and S0 logic; Asserted on power up, deasserted when S5 power supplies are within specification
SLP_S3/S5_L	O-IO33S5-S	S3/S5 Sleep State Power Plane Control Signals SLP_S3_L SLP_S5_L State High High S0 Low High S3 Low Low S4/S5
SYS_RESET_L	I-IO33S5-S	System Reset Input (reset button)
WAKE_L	B-IO33S5-S	PCIe WAKE_L signal, wake system out of sleep state
WOL(0-3)	I_IO33S5-OD	Wake-on-LAN function
NMI_SYNC_FLOOD_L	I-IO33-S	This pin signals a NMI or Sync Flood
ALERT_L	O-IO33-OD	Programmable pin that can indicate different events, including a SB-TSI interrupt
PROCHOT_L	I-IO33-OD	Asserted to force the processor into HTC-active state
SIC	I-DUAL-OD	Sideband Interface Clock
SID	B-DUAL-OD	Sideband Interface Data
THERMTRIP_L	B-IO33-OD	Temperature Trip Input/Output
BP(0-5)	B-IO18-S	Break Point Indicator; Used to trigger external test equipment such as oscilloscopes and logic analyzers
DBREQ_L	I-IO18S5-S	Debug Request input to JTAG controller
TCK	I-IO18S5-S	JTAG Clock
TDI	I-IO18S5-S	JTAG Data Input
TDO	O-IO18S5-S	JTAG Data Output
TMS	I-IO18S5-S	JTAG Mode Select
TRST_L	I-IO18S5-S	JTAG Reset
TEST*		Test Pins
XTRIG_L[7:4]	B-IO18-OD	XTRIG Debug Signals
SVC_CPU, SVC_SOC	O-IO18-S	Serial VID Interface Clock for VDDCR_CPU, VDDCR_SOC regulator
SVD_CPU, SVD_SOC	B-IO18-S	Serial VID Interface Data
SVT_CPU, SVT_SOC	I-IO18-S	Serial VID Interface Telemetry
VDDBT_RTC_G	S	Integrated Real Time Clock battery power supply, 1.5 V ±5% or 1.8 V ±5%
VDDCR_CPU	S	Supply voltage for the CPU core
VDDCR_CPU_SENSE	A	VDDCR_CPU voltage sense output, differential feedback with VSS_SENSE_A
VDDCR_SOC	S	Supply voltage for the Northbridge (integrated FCH, Ethernet, SATA, NBIO, SMU, DDR PHY logic)
VDDCR_SOC_SENSE	A	VDDCR_SOC voltage sense output, differential feedback with VSS_SENSE_B
VDDCR_SOC_S5	S	Always on 0.9 V ± 20 mV supply voltage for the FCH and USB PHYs
VDDCR_SOC_S5_SENSE	A	VDDCR_SOC_S5 voltage sense output, differential feedback with VSS_SENSE_B
VDDIO_MEM_S3_ABCD/EFGH	S	1.2 V (1.14 - 1.28 V) supply voltage for the DRAM PHYs, channels A-D / E-H
VDDIO_MEM_S3_ABCD_FB_H/L	A	VDDIO_MEM_S3_ABCD voltage differential feedback to VDDIO_MEM_S3_ABCD regulator
VDDIO_MEM_S3_EFGH_FB_H/L	A	VDDIO_MEM_S3_EFGH voltage differential feedback
VDD_18	S	1.8 V ±5% supply voltage for analog circuits
VDD_18_SENSE	A	VDD_18 voltage sense output, differential feedback with VSS_SENSE_A
VDD_18_S5	S	Always on 1.8 V ±5% supply voltage for analog circuits
VDD_18_S5_SENSE	A	VDD_18_S5 voltage sense output, differential feedback with VSS_SENSE_A
VDD_33	S	3.3 V ±5% supply voltage for GPIO
VDD_33_SENSE	A	VDD_33 voltage sense output, differential feedback with VSS_SENSE_B
VDD_33_S5	S	Always on 3.3 V ±5% supply voltage for GPIO
VDD_33_S5_SENSE	A	VDD_33_S5 voltage sense output, differential feedback with VSS_SENSE_B
VSS	S	Ground
VSS_SENSE_A	A	VSS sense output for VDDCR_CPU, VDD_18, VDD_18_S5 regulator
VSS_SENSE_B	A	VSS sense output for VDDCR_SOC, VDD_33, VDD_33_S5, VDDCR_SOC_S5 regulator
CORETYPE		Processor Core Type Indicator; NC = Not connected, VSS = connected to VSS on the package Processor CORETYPE SP3 Type-0 VSS SP3 Type-1/2 NC TR4/sTRX4/sWRX8 NC
SP3R1, SP3R2		Processor Family Revision Identifier (electrical keying); NC = Not connected, VSS = connected to VSS on the package Processor SP3R1 SP3R2 SP3 NC VSS TR4 NC NC sTRX4 VSS NC sWRX8 NC VSS
CPU_PRESENT_L		CPU Presence Indicator, connected to VSS on the package
SA[2:0]	I-IO18S5-S	Socket Identifier; 0 = connected to VSS, 1 = 10 kΩ PU to VDD_18_S5 Socket SA[2] SA[1] SA[0] SP3 BSP 0 0 0 SP3 AP (2P systems) 0 0 1 sTRX4/sWRX8 0 0 0
RSVD		Reserved

Pin Types

Voltage Domain Internal to SoC, derived from VDDIO_MEM_S3_*
I/O-xGMI/PCIE/SATA/WAFL-D	Input / Output, xGMI / PCIe / SATA / WAFL Domain, Differential
VDDCR_SOC_S5 Voltage Domain
I/O/B-USB_S5-D	Input / Output / Bidirectional, USB, Differential
I/O-CLK-D	Input / Output, CLK, Differential
Other Voltage Domains
I/O/B-IOMEM_ABCD-D/S	Input / Output / Bidirectional, VDDIO_MEM_S3_ABCD Voltage Domain, Differential / Single-Ended
I/O/B-IOMEM_EFGH-D/S	Input / Output / Bidirectional, VDDIO_MEM_S3_EFGH, Differential / Single-Ended
I/O/B-IO18-D/S/OD	Input / Output / Bidirectional, VDD_18, Differential / Single-Ended / Open Drain
I/O/B-IO18S-D/S/OD	Input / Output / Bidirectional, VDD_18_S5, Differential / Single-Ended / Open Drain
I/O/B-IO33-D/S/OD	Input / Output / Bidirectional, VDD_33, Differential / Single-Ended / Open Drain
I/O/B-IO33S5-D/S/OD	Input / Output / Bidirectional, VDD_33_S5, Differential / Single-Ended / Open Drain
I/B-DUAL-OD	Input / Bidirectional, VDD_18 or VDD_33, Open Drain
A	Analog
S	Supply Voltage

Bibliography

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• "Functional Data Sheet for sTRX4 and sWRX8 Processors", AMD Publ. #56515, Rev. 0.81, August 2019
• "Electrical Data Sheet for AMD Family 17h Models 00h–0Fh and 30h–3Fh and Family 19h Models 00h–0Fh Socket SP3 Processors", AMD Publ. #55441, Rev. 0.65, July 2020
• "Electrical Data Sheet for AMD Family 17h Models 30h–3Fh and Family 19h Model 08h sTRX4, sWRX8 Processors", AMD Publ. #55441cpw, Rev. 0.66, March 2021
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• Beck, Noah; White, Sean; Paraschou, Milam; Naffziger, Samuel (2018). ‘Zeppelin’: An SoC for multichip architectures. Proceedings of IEEE ISSCC 2018. pp. 40-42. doi:10.1109/ISSCC.2018.8310173
• Burd, Thomas et al. (2018). “Zeppelin”: An SoC for Multichip Architectures. IEEE JSSC. 54 (1): 133-143. doi:10.1109/JSSC.2018.2873584
• Singh, Teja et al. (2020). Zen 2: The AMD 7nm Energy-Efficient High-Performance x86-64 Microprocessor Core. Proceedings of IEEE ISSCC 2020. pp. 42-44. doi:10.1109/ISSCC19947.2020.9063113
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• Naffziger, Samuel. "AMD Chiplet Architecture for High-Performance Server and Desktop Products", IEEE ISSCC 2020, February 17, 2020
• "EPYC Tech Day", June 20, 2017
• 2nd Gen AMD EPYC launch event, August 7, 2019

See also

• Socket AM4
• Socket TR4
• Socket sTRX4
• Socket sWRX8
• Socket SP5