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Package FP6 - AMD
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Package FP6
General Info
DesignerAMD
IntroductionMarch 16, 2020 (launched)
MarketMobile, Embedded
MicroarchitectureZen 2
TDP55 W
Package
NameBGA-1140
TypeOrganic Micro Ball Grid Array
Contacts1140
Dimension25 mm × 35 mm
Pitch0.65 mm

FP6 is a BGA-1140 package for AMD mobile and embedded microprocessors with an integrated north bridge, graphics processor, and controller hub targeting the notebook and embedded market. Its counterpart for desktop processors is the PGA-1331 package for Socket AM4. FP6 is the successor to the FP5 package.

All processors in the FP6 package, codename "Renoir" and "Grey Hawk", are members of AMD's Family 17h with CPU cores based on the Zen 2 microarchitecture, and contain a monolithic chip fabricated on a 7 nm SOI process.

Features[edit]

  • 1140-pin lidless micro ball grid array package, 0.65 mm pitch, 25 × 35 × 1.38 mm
  • 2 × 64/72 bit DDR4 SDRAM interface up to 1600 MHz, PC4-25600 (DDR4-3200), 51.2 GB/s
    • Up to 2 DIMMs (1 per channel), ECC supported, up to 64 GiB total
  • Or 4 × 32 bit LPDDR4x SDRAM interface up to 2133 MHz, LPDDR4X-4266, 68.3 GB/s
    • Up to 32 GiB total
  • PCIe Gen 1.0, 2.0, 3.0 (8 GT/s)
    • Configurable x8 external graphics card link
    • Configurable x12 General Purpose Ports (x4, x2?, x1?, 2 × NVMe, SATA?)
    • Up to 9 links total
  • Up to four independent display controllers.
    • DisplayPort 1.4, eDP 1.3, HDMI 2.1
    • Resolution up to 4096 × 2160
  • Integrated Controller Hub
    • 2 × USB 1.1, 2.0, 3.1 (10 Gb/s), Type-C PHY, DisplayPort Alternate Mode, Power Delivery capable
    • 2 × USB 1.1, 2.0, 3.1 (10 Gb/s)
    • 4 × USB 1.1, 2.0
    • 2 × SATA 1.0, 2.0, 3.0 (6 Gb/s), SATA Express support
    • 1 × 4-wire or 2 × 2-wire UART, 4 × I2C, 2 × SMBus, LPC, SPI/eSPI, GPIO. SoundWire

Note some processor models support only a subset of these features. The chip may implement additional features which are undocumented or unavailable in the FP6 package.

Processors using package FP6[edit]

  • AMD Ryzen 4000 Mobile Processors
  • AMD Ryzen Embedded V2000 Series
 List of all FP6-based Processors
ModelPriceProcessLaunchedµarchFamilyCoreCTFreqTurboTDP
Count: 0

Package Diagram[edit]

BGA-1140 FP6 Renoir diag.svg

Approximate dimensions of the "Renoir" package. All dimensions in millimeters.

References[edit]

See also[edit]

Facts about "Package FP6 - AMD"
designerAMD +
first launchedMarch 16, 2020 +
instance ofpackage +
market segmentMobile + and Embedded +
microarchitectureZen 2 +
namePackage FP6 +
tdp55 W (55,000 mW, 0.0738 hp, 0.055 kW) +