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Package FP5 - AMD
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Package FP5
General Info
DesignerAMD
IntroductionJanuary 8, 2018 (launched)
MarketMobile, Embedded
MicroarchitectureZen, Zen+
TDP45 W
45,000 mW
0.0603 hp
0.045 kW
Package
NameFP5
TypeOrganic Micro Ball Grid Array
Contacts1140
Dimension35 mm
3.5 cm
1.378 in
× 25 mm
2.5 cm
0.984 in
Pitch0.7 mm
0.0276 in

FP5 is a BGA-1140 package for AMD mobile and embedded microprocessors with an integrated north bridge, graphics processor, and controller hub targeting the notebook and embedded market. Its counterpart for desktop processors is the PGA-1331 package for Socket AM4. FP5 is the successor to the FP4 package and was superseded by the FP6 package.

All processors in the FP5 package, codename "Raven Ridge", "Great Horned Owl", "Banded Kestrel", "Picasso", and "Dali", are members of AMD's Family 17h with CPU cores based on the Zen and Zen+ microarchitecture, and are fabricated on 12 and 14 nm SOI processes.


Features[edit]

  • 1140-pin lidless micro ball grid array package, 0.7-1.0 mm multi-pitch, 35 × 25 mm, organic substrate
  • 2 × 64/72 bit DDR4 SDRAM interface up to 1600 MHz, PC4-25600 (DDR4-3200), 51.2 GB/s
    • Up to 2 SR/DR UDIMMs or SODIMMs (1 per channel), ECC supported
    • Up to 32 GiB total
  • PCIe Gen 1.0, 2.0, 3.0 (8 GT/s)
    • Configurable x8 external graphics card link
    • Configurable x8 General Purpose Ports (x4, x2, x1, NVMe, SATA, GbE)
  • Up to four independent display controllers
    • Four single link Digital Display Interfaces, two multiplexed with one USB 3.1 Type-C port each
    • DisplayPort 1.4 up to 3840 × 2160 at 120 Hz, DP++, DP Audio
    • HDMI 2.0b up to 4096 × 2160 at 60 Hz
    • eDP 1.4 up to 4096 × 2160
  • Integrated Controller Hub
    • 2 × USB 1.1, 2.0, 3.1 (10 Gb/s), Type-C, DisplayPort Alternate Mode, Power Delivery capable
    • 2 × USB 1.1, 2.0, 3.1 (10 Gb/s)
    • 1 × USB 1.1, 2.0, 3.0 (5 Gb/s)
    • 1 × USB 1.1, 2.0
    • 2 × SATA 1.0, 2.0, 3.0 (6 Gb/s) or 1 × SATA Express, each port multiplexed with one (SATA Express two) x1 GPP lane
    • 2 × 1/2.5/10 Gigabit Ethernet, multiplexed with GPP
    • eMMC 5.0, SD/SDIO 3.0/4.0, 2 × UART, 4 × I2C, 2 × SMBus, LPC, SPI/eSPI, I2S/HDA/SW, Serial IRQ, GPIO

Note some processor models support only a subset of these features.

Processors using package FP5[edit]

  • AMD Ryzen 3/5/7 Mobile Processor
  • AMD Athlon 3000 Series Mobile Processor
  • AMD Ryzen Embedded V1000 Series
  • AMD Ryzen Embedded R1000 Series
 List of all FP5-based Processors
ModelPriceProcessLaunchedµarchFamilyCoreCTFreqTurboTDP
Count: 0

Package Diagram[edit]

BGA-1140 RR diag.svg

Approximate dimensions of the Raven Ridge package. All dimensions in millimeters.

BGA-1140 BK diag.svg

Approximate dimensions of the Banded Kestrel package. All dimensions in millimeters.

BGA-1140 pn.svg

FP5 package ball numbers.

Pin Map[edit]

BGA-1140 pinmap.svg

References[edit]

  • "Processor Programming Reference (PPR) for AMD Family 17h Model 18h, Revision B1 Processors (PUB)", AMD Publ. #55570, Rev. 3.14, October 8, 2019
  • "Processor Programming Reference (PPR) for AMD Family 17h Model 20h, Revision A1 Processors", AMD Publ. #55772, Rev. 3.07, May 21, 2020
  • "Product Brief: AMD Ryzen™ Embedded V1000 Processor Family", PID 1887101-F, 2019
  • "Product Brief: AMD Ryzen™ Embedded R1000 Processor Family", PID 19237320-E, 2020
  • "Hot Chips 30: AMD Ryzen™ Processors with Radeon™ Vega Graphics", August 2018

See also[edit]

Facts about "Package FP5 - AMD"
designerAMD +
first launchedJanuary 8, 2018 +
instance ofpackage +
market segmentMobile + and Embedded +
microarchitectureZen + and Zen+ +
namePackage FP5 +
packageFP5 +
package contacts1,140 +
package length35 mm (3.5 cm, 1.378 in) +
package pitch0.7 mm (0.0276 in) +
package typeOrganic Micro Ball Grid Array +
package width25 mm (2.5 cm, 0.984 in) +
tdp45 W (45,000 mW, 0.0603 hp, 0.045 kW) +