Edit Values | |
Package FP5 | |
General Info | |
Designer | AMD |
Introduction | January 8, 2018 (launched) |
Market | Mobile, Embedded |
Microarchitecture | Zen, Zen+ |
TDP | 45 W 45,000 mW 0.0603 hp 0.045 kW |
Package | |
Name | FP5 |
Type | Organic Micro Ball Grid Array |
Contacts | 1140 |
Dimension | 35 mm 3.5 cm × 25 mm1.378 in 2.5 cm 0.984 in |
Pitch | 0.7 mm 0.0276 in |
FP5 is a BGA-1140 package for AMD mobile and embedded microprocessors with an integrated north bridge, graphics processor, and controller hub targeting the notebook and embedded market. Its counterpart for desktop processors is the PGA-1331 package for Socket AM4. FP5 is the successor to the FP4 package and was superseded by the FP6 package.
All processors in the FP5 package, codename "Raven Ridge", "Great Horned Owl", "Banded Kestrel", "Picasso", and "Dali", are members of AMD's Family 17h with CPU cores based on the Zen and Zen+ microarchitecture, and are fabricated on 12 and 14 nm SOI processes.
Contents
Features[edit]
- 1140-pin lidless micro ball grid array package, 0.7-1.0 mm multi-pitch, 35 × 25 mm, organic substrate
- 2 × 64/72 bit DDR4 SDRAM interface up to 1600 MHz, PC4-25600 (DDR4-3200), 51.2 GB/s
- Up to 2 SR/DR UDIMMs or SODIMMs (1 per channel), ECC supported
- Up to 32 GiB total
- PCIe Gen 1.0, 2.0, 3.0 (8 GT/s)
- Configurable x8 external graphics card link
- Configurable x8 General Purpose Ports (x4, x2, x1, NVMe, SATA, GbE)
- Up to four independent display controllers
- Four single link Digital Display Interfaces, two multiplexed with one USB 3.1 Type-C port each
- DisplayPort 1.4 up to 3840 × 2160 at 120 Hz, DP++, DP Audio
- HDMI 2.0b up to 4096 × 2160 at 60 Hz
- eDP 1.4 up to 4096 × 2160
- Integrated Controller Hub
- 2 × USB 1.1, 2.0, 3.1 (10 Gb/s), Type-C, DisplayPort Alternate Mode, Power Delivery capable
- 2 × USB 1.1, 2.0, 3.1 (10 Gb/s)
- 1 × USB 1.1, 2.0, 3.0 (5 Gb/s)
- 1 × USB 1.1, 2.0
- 2 × SATA 1.0, 2.0, 3.0 (6 Gb/s) or 1 × SATA Express, each port multiplexed with one (SATA Express two) x1 GPP lane
- 2 × 1/2.5/10 Gigabit Ethernet, multiplexed with GPP
- eMMC 5.0, SD/SDIO 3.0/4.0, 2 × UART, 4 × I2C, 2 × SMBus, LPC, SPI/eSPI, I2S/HDA/SW, Serial IRQ, GPIO
Note some processor models support only a subset of these features.
Processors using package FP5[edit]
- AMD Ryzen 3/5/7 Mobile Processor
- AMD Athlon 3000 Series Mobile Processor
- AMD Ryzen Embedded V1000 Series
- AMD Ryzen Embedded R1000 Series
List of all FP5-based Processors | |||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Model | Price | Process | Launched | µarch | Family | Core | C | T | Freq | Turbo | TDP | ||||||||
Count: 0 |
Package Diagram[edit]
Approximate dimensions of the Raven Ridge package. All dimensions in millimeters.
Approximate dimensions of the Banded Kestrel package. All dimensions in millimeters.
FP5 package ball numbers.
Pin Map[edit]
References[edit]
- "Processor Programming Reference (PPR) for AMD Family 17h Model 18h, Revision B1 Processors (PUB)", AMD Publ. #55570, Rev. 3.14, October 8, 2019
- "Processor Programming Reference (PPR) for AMD Family 17h Model 20h, Revision A1 Processors", AMD Publ. #55772, Rev. 3.07, May 21, 2020
- "Product Brief: AMD Ryzen™ Embedded V1000 Processor Family", PID 1887101-F, 2019
- "Product Brief: AMD Ryzen™ Embedded R1000 Processor Family", PID 19237320-E, 2020
- "Hot Chips 30: AMD Ryzen™ Processors with Radeon™ Vega Graphics", August 2018
See also[edit]
designer | AMD + |
first launched | January 8, 2018 + |
instance of | package + |
market segment | Mobile + and Embedded + |
microarchitecture | Zen + and Zen+ + |
name | Package FP5 + |
package | FP5 + |
package contacts | 1,140 + |
package length | 35 mm (3.5 cm, 1.378 in) + |
package pitch | 0.7 mm (0.0276 in) + |
package type | Organic Micro Ball Grid Array + |
package width | 25 mm (2.5 cm, 0.984 in) + |
tdp | 45 W (45,000 mW, 0.0603 hp, 0.045 kW) + |