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Ryzen 3 PRO 3300U
General Info
Designer	AMD
Manufacturer	GlobalFoundries
Model Number	PRO 3300U
Part Number	YM330BC4T4MFG
Market	Mobile
Introduction	April 8, 2019 (announced) April 8, 2019 (launched)
Shop	Amazon
General Specs
Family	Ryzen 3
Series	3000
Frequency	2,100 MHz
Turbo Frequency	3,500 MHz
Bus type	PCIe 3.0
Clock multiplier	21
Microarchitecture
ISA	x86-64 (x86)
Microarchitecture	Zen+
Core Name	Picasso
Process	12 nm
Transistors	4,940,000,000
Technology	CMOS
Die	209.78 mm²
Word Size	64 bit
Cores	4
Threads	4
Max Memory	32 GiB
Multiprocessing
Max SMP	1-Way (Uniprocessor)
Electrical
TDP	15 W
cTDP down	12 W
cTDP up	25 W
OP Temperature	0° C – 95 °C
Packaging
Package	FP5
Package Type	Organic Micro Ball Grid Array
Dimension	35 mm × 25 mm
Pitch	0.7 mm
Contacts	1140

Ryzen 3 PRO 3300U is a 64-bit quad-core entry-level performance x86 mobile microprocessor introduced by AMD in early 2019. This processor is based on AMD's Zen+ microarchitecture and is fabricated on a 12 nm process. The PRO 3300U operates at a base frequency of 2.1 GHz with a TDP of 15 W and a Boost frequency of 3.5 GHz. This APU supports up to 32 GiB of dual-channel DDR4-2400 memory and incorporates Radeon Vega 6 Graphics operating at up to 1.2 GHz.

This model supports a configurable TDP-down of 12 W and TDP-up of 25 W.

Cache

Main article: Zen+ § Cache

[Edit/Modify Cache Info]

Cache Organization Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory. The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC. Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies. Note: All units are in kibibytes and mebibytes.

L1$ 384 KiB 393,216 B 0.375 MiB L1I$ 256 KiB 262,144 B 0.25 MiB 4x64 KiB 4-way set associative   L1D$ 128 KiB 131,072 B 0.125 MiB 4x32 KiB 8-way set associative write-back L2$ 2 MiB 2,048 KiB 2,097,152 B 0.00195 GiB     4x512 KiB 8-way set associative write-back L3$ 4 MiB 4,096 KiB 4,194,304 B 0.00391 GiB     1x4 MiB

Memory controller

[Edit/Modify Memory Info]

	Integrated Memory Controller
	Max Type DDR4-2400 Supports ECC Yes Max Mem 32 GiB Controllers 2 Channels 2 Max Bandwidth 35.76 GiB/s 36,618.24 MiB/s 38.397 GB/s 38,397.008 MB/s 0.0349 TiB/s 0.0384 TB/s Bandwidth Single 17.88 GiB/s Double 35.76 GiB/s

Expansions

This processor has 12 PCIe lanes, 1x8 typically designated for a GPU and 4 additional lanes for storage (e.g., NVMe).

[Edit/Modify Expansions Info]

	Expansion Options
PCIe Revision: 3.0 Max Lanes: 12 Configuration: 1x8+1x4, 2x4+1x4

Graphics

[Edit/Modify IGP Info]

	Integrated Graphics Information
	GPU Radeon Vega 6 Designer AMD Execution Units 6 Max Displays 4 Unified Shaders 384 Burst Frequency 1,200 MHz 1.2 GHz 1,200,000 KHz Output DP, HDMI Standards DirectX 12 OpenGL 4.6 OpenCL 2.2

[Edit] Zen with Radeon Vega Hardware Accelerated Video Capabilities
Codec	Encode			Decode
Max FPS	@1080p	@1440p	@2160p	@1080p 4:2:0	@2160p 4:2:0
MPEG-2 (H.262)				60 FPS	N/A
VC-1
VP9 8bpc				240 FPS	60 FPS
VP9 10bpc
MPEG-4 AVC (H.264) 8bpc	120 FPS	60 FPS	30 FPS
MPEG-4 AVC (H.264) 10bpc
HEVC (H.265) 8bpc	120 FPS	60 FPS	30 FPS
HEVC (H.265) 10bpc
JPEG/MJPEG 8bpc

Features

[Edit/Modify Supported Features]

Supported x86 Extensions & Processor Features

MMX MMX Extension EMMX Extended MMX Extension SSE Streaming SIMD Extensions SSE2 Streaming SIMD Extensions 2 SSE3 Streaming SIMD Extensions 3 SSSE3 Supplemental SSE3 SSE4.1 Streaming SIMD Extensions 4.1 SSE4.2 Streaming SIMD Extensions 4.2 SSE4a Streaming SIMD Extensions 4a AVX Advanced Vector Extensions AVX2 Advanced Vector Extensions 2 ABM Advanced Bit Manipulation BMI1 Bit Manipulation Instruction Set 1 BMI2 Bit Manipulation Instruction Set 2 FMA3 3-Operand Fused-Multiply-Add AES AES Encryption Instructions RdRand Hardware RNG SHA SHA Extensions ADX Multi-Precision Add-Carry CLMUL Carry-less Multiplication Extension F16C 16-bit Floating Point Conversion x86-16 16-bit x86 x86-32 32-bit x86 x86-64 64-bit x86 Real Real Mode Protected Protected Mode SMM System Management Mode FPU Integrated x87 FPU NX No-eXecute SMT Simultaneous Multithreading AMD-Vi AMD-Vi (I/O MMU virtualization) AMD-V AMD Virtualization TSME Transparent SME SenseMI SenseMI Technology

Die

Further information: Zen+ § Die

• 14 nm process
• 4,940,000,000 transistors
• 209.78 mm² die size