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Ryzen 9 5900HX
General Info
Designer	AMD
Manufacturer	TSMC
Model Number	5900HX
Part Number	100-000000300
Market	Mobile
Introduction	January 12, 2021 (announced) January 12, 2021 (launched)
Shop	Amazon
General Specs
Family	Ryzen 9
Series	5000
Frequency	3,300 MHz
Turbo Frequency	4,600 MHz
Clock multiplier	33
Microarchitecture
ISA	x86-64 (x86)
Microarchitecture	Zen 3
Core Name	Cezanne
Core Family	25
Core Model	80
Process	7 nm
Technology	CMOS
Word Size	64 bit
Cores	8
Threads	16
Multiprocessing
Max SMP	1-Way (Uniprocessor)
Electrical
TDP	45 W
cTDP down	35 W
cTDP up	54 W
Tcase	0 °C – 105 °C
Packaging
Package	BGA-1140 (FC-OBGA)
Dimension	35 mm × 25 mm × 1.38 mm
Pitch	0.65 mm
Contacts	1140

Ryzen 9 5900HX is a 64-bit octa-core high-end performance x86 mobile microprocessor introduced by AMD in early 2021. Fabricated on a TSMC 7-nanometer process and based on AMD's Zen 3 microarchitecture, the 5900HX operates at a base frequency of 3.3 GHz with a TDP of 45 W and a boost frequency of up to 4.6 GHz. This APU supports a configurable TDP-down of 35 W and TDP-up of 54 W, DDR4-3200 or LPDDR4-4266 memory, and integrates a Radeon Vega 8 GPU operating at up to 2.1 GHz.

Cache

Main article: Zen 3 § Cache

[Edit/Modify Cache Info]

Cache Organization Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory. The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC. Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies. Note: All units are in kibibytes and mebibytes.

L1$ 512 KiB 524,288 B 0.5 MiB L1I$ 256 KiB 262,144 B 0.25 MiB 8x32 KiB 8-way set associative   L1D$ 256 KiB 262,144 B 0.25 MiB 8x32 KiB 8-way set associative write-back L2$ 4 MiB 4,096 KiB 4,194,304 B 0.00391 GiB     8x512 KiB 8-way set associative write-back L3$ 16 MiB 16,384 KiB 16,777,216 B 0.0156 GiB     1x16 MiB 16-way set associative write-back

Memory controller

[Edit/Modify Memory Info]

	Integrated Memory Controller
	Max Type DDR4-3200, LPDDR4-4266

Expansions

[Edit/Modify Expansions Info]

	Expansion Options
PCIe Revision: 3.0

Graphics

[Edit/Modify IGP Info]

	Integrated Graphics Information
	GPU Radeon Vega 8 Designer AMD Execution Units 8 Burst Frequency 2,100 MHz 2.1 GHz 2,100,000 KHz

Features

[Edit/Modify Supported Features]

Supported x86 Extensions & Processor Features

MMX MMX Extension EMMX Extended MMX Extension SSE Streaming SIMD Extensions SSE2 Streaming SIMD Extensions 2 SSE3 Streaming SIMD Extensions 3 SSSE3 Supplemental SSE3 SSE4.1 Streaming SIMD Extensions 4.1 SSE4.2 Streaming SIMD Extensions 4.2 SSE4a Streaming SIMD Extensions 4a AVX Advanced Vector Extensions AVX2 Advanced Vector Extensions 2 ABM Advanced Bit Manipulation BMI1 Bit Manipulation Instruction Set 1 BMI2 Bit Manipulation Instruction Set 2 FMA3 3-Operand Fused-Multiply-Add AES AES Encryption Instructions RdRand Hardware RNG SHA SHA Extensions ADX Multi-Precision Add-Carry CLMUL Carry-less Multiplication Extension F16C 16-bit Floating Point Conversion x86-16 16-bit x86 x86-32 32-bit x86 x86-64 64-bit x86 Real Real Mode Protected Protected Mode SMM System Management Mode FPU Integrated x87 FPU NX No-eXecute SMT Simultaneous Multithreading AMD-Vi AMD-Vi (I/O MMU virtualization) AMD-V AMD Virtualization SenseMI SenseMI Technology

References

• "AMD Announces World’s Best Mobile Processors In CES 2021 Keynote" (Press release). AMD.com. January 12, 2021. Retrieved May 2021.
• "AMD Ryzen™ 9 5900HX". AMD.com. Retrieved May 2021.