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Socket SP5
General Info
MicroarchitectureZen 4
TDP400 W
Dimension75.4 mm × 72 mm
Pitch0.81 mm
NameSocket SP5

Socket SP5 is a microprocessor socket designed by AMD for the fourth generation of their EPYC family of high performance server processors, succeeding Socket SP3. Its counterpart for desktop processors is Socket AM5.


Symbol version future.svg Preliminary Data! Information presented in this article deal with future products, data, features, and specifications that have yet to be finalized, announced, or released. Information may be incomplete and can change by final release.

Socket SP5 is a zero insertion force, heatsink actuated, surface-mount land grid array socket for use with a 6096-contact, 0.94 mm × 0.81 mm interstitial pitch, organic land grid array CPU package.

It supports 12 channels of DDR5 memory with two 40-bit subchannels (32 bit data + 8 bit ECC) and up to 2 DIMMs per channel, eight 16-lane PCIe Gen 5 I/O links, three or four of which are repurposed as inter-socket links on dual socket systems, two 4-lane PCIe Gen 3 links, four USB 3.1 Gen 1 ports, and up to 32 SATA Gen 3 ports.

This compares to eight 72-bit DDR4 channels and eight 16-lane PCIe Gen 3/4 links on its predecessor Socket SP3. (SP4 and SP4r2 are ball grid array packages of EPYC 3000 embedded processors.)

The following AMD processor families use Socket SP5:

CPU Family Microarch. Process Products
Type 0 Family 19h Models 10h–1Fh Zen 4 5 nm EPYC 7004 "Genoa"

The codename of AMD's SP5 reference platform (CRB) is "Titanite".

Package Description[edit]

The SP5 CPU package is lidded, has a 72 mm × 75.4 mm organic substrate with flip chip die attachment, 6096 land pads with gold over nickel plating, and leaves AMD's OSAT partner in a shipping tray with a carrier frame pre-installed. The carrier frame is a part of the package loading mechanism and remains on the package in the socket.

The package has the same length (75.4 mm) as the Socket SP3 package but no keying notches and a redesigned lid bridging the chiplets and decoupling capacitors on the package top with flanges on only two sides, providing more space for these components. Additional components are placed on the package bottom side. While the package has no apparent anti-rotation features, the carrier frame fits into the socket's rail frame in just one orientation. SP5 processors are electrically keyed by pin SP5R1 to SP5R4. To boot the processor compatible firmware is also required. A triangular symbol on both sides of the substrate marks the location of pin A1, with corresponding markings on the socket.

Type-0 packages are multi-chip modules integrating one I/O die and up to 12 Core Complex Dies which contain eight CPU cores each. A GMI3 link connects each CCD to the IOD.

Socket SP5 has 12 DDR5 memory channels A-L and supports up to 2 DIMMs per channel. Each channel has two independent subchannels with a 32-bit data and 8-bit ECC bus. Type-0 processors support SR/DR RDIMMs, 4R/8R LRDIMMs and 3DS RDIMMs, EC8 (80 bit wide) modules with x4 or x8 DRAM devices, or EC4 (72 bit) with x4 devices.

Like the prior generation Socket SP5 supports eight 16-lane multi-function I/O interfaces P0-P3 and G0-G3. All of these interfaces can be configured as PCIe links, some alternatively as xGMI link, and some lanes as CXL or SATA link.

Socket SP5 2P routing.svg

On dual socket (2P) systems the cache coherent xGMI links connect the Data Fabrics of each processor. Socket SP5 processors can use three or four xGMI links depending on bandwidth requirements using the G0-G3 interfaces, or four links between G0, G2, P1, and P3. xGMI links use 16 lanes, unused links release 16 lanes per socket for I/O. As with PCIe links the maximum raw data rate is 32 GT/s. A WAFL link connects the Control Fabrics of each processor, i.e. the PSP, SMUs and other IPs, primarily for temperature monitoring, power and frequency control. Physically they use the PCIe Gen 3 protocol.

Compute Express Links enable cache coherent links to peripheral devices. Type-0 processors are CXL 1.1 compliant and support CXL Type 1 devices (specialized accelerators with no local memory such as a NIC using the and CXL.cache protocols) and CXL Type 3 devices (memory expanders, using the and CXL.memory protocols) on the P0-P3 interfaces. Up to four CXL Type 1 devices are supported per socket, up to four Type 3 devices per 16-lane interface.

Like its predecessor this socket supports various low speed interfaces. It adds support for the I3C protocol while the LPC interface was deprecated in favor of SPI/ESPI. These busses are generally used to access firmware (PSP ROM and BIOS) i.e. flash memory, and a TPM. Socket SP5 also reserves some pins for audio interfaces, perhaps for future HEDT or workstation processors.

Socket Description[edit]

Socket SP5 has a 93.4 mm × 120.3 mm footprint and consists of the following components, from top to bottom:

  • Retention Frame
  • Rail Frame
  • Socket Housing
  • Stiffener Frame
  • Insulators
  • Backplate

Removable components are:

  • Heatsink
  • Carrier Frame
  • External Cap
  • PnP Cover Cap

The retention frame, rail frame, and stiffener frame constitute the Socket Retention Mechanism. The heatsink, the CPU in a carrier frame, the SRM, housing, and backplate are separately orderable parts. The latter three are motherboard components for OEMs. Socket SP5 suppliers are Lotes Co. Ltd. (website), Foxconn Interconnect Technology (website), and Amphenol Corp.

LGA sockets use cantilever springs in the socket housing to make electrical contact with flat pads on the bottom of the CPU package. An independent loading mechanism creates the Z-axis compression load between the CPU package and the housing. Considerable force is required to deflect thousands of springs at once which rules out a lever mechanism in favor of screw actuation. The Socket SP5 retention mechanism provides sufficient force to secure the CPU in a mating position, but this socket is actuated by the heatsink, which is attached to the stiffener frame and the backplate. The stiffener frame is likewise attached to the backplate on the bottom side of the motherboard.

The retention frame is a largely flat piece stamped out of stainless steel sheets. It has a window allowing the top of the CPU package lid to protrude for contact with the heatsink. In locked state it applies a load to the flanges on two sides of the lid. The retention frame is attached to the stiffener frame by a hinge which permits vertical motion when the socket is actuated, integrates a stop feature limiting the opening angle, and a torsional spring to keep the frame open while the user inserts or removes the CPU. The retention frame is locked using a single captive screw with a Torx T20 head and M3.5×0.6 or larger thread. It mates with a self-clinching PEM nut on the stiffener frame.

The heatsink is attached using six captive nuts, also with a Torx T20 head. Four of these mate with four 10.0 mm high standoffs with an M3.5×0.6 external thread in the corners of the stiffener frame. These standoffs have conical tips for alignment. Two additional studs with the same threading protude up from the backplate, through openings in the motherboard, insulator sheets, stiffener frame, rail frame, retention frame, and carrier frame, securing the heatsink on the sides of the processor. Backplates with stud heights from 14.40 to 16.00 mm are available to account for different PCB thicknesses. The studs and nuts are symmetrically arranged so the heatsink can be installed 180 degrees rotated. The middle screws are supposed to be tightened first, then diagonally opposed corner screws, with a torque between 12.5 and 15 kgf-cm according to AMD (1.23 to 1.47 N⋅m).

The remaining components have the same function as on Socket SP3. Socket SP5 carrier frames are color coded, the color of frames for EPYC 7004 series processors is TBD.

Feature Summary[edit]

  • Lidded land grid array package, 75.4 mm × 72 mm
    • 6096 contacts in a 89 × 75 grid, 0.81 mm × 0.94 mm interstitial pitch
    • Organic substrate, flip chip die attachment
  • 12 × 80 bit DDR5 SDRAM interface
    • Up to 2600 MHz, PC5-41600 (DDR5-5200), 499.2 GB/s total raw bandwidth
    • Two DDR5 subchannels per DRAM channel, 32 bit data + 8 bit ECC
    • Up to 2 DIMMs/channel, up to 24 DIMMs total
    • SR/DR RDIMM, 4R/8R LRDIMM, 4R/8R 3DS DIMM types
    • ECC supported
  • Eight multi-function I/O interfaces G0-G3, P0-P3
Lane 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
PCIe / CXL x16
x8 x8
x4 x4 x4 x4
PCIe x2 x2 x2 x2 x2 x2 x2 x2
x1 x1 x1 x1 x1 x1 x1 x1 x1 x1 x1 x1 x1 x1 x1 x1
SATA 17 16 15 14 13 12 11 10 07 06 05 04 03 02 01 00
37 36 35 34 33 32 31 30 27 26 25 24 23 22 21 20
  • PCIe Gen 1 to 5 (32 GT/s) protocol supported on all interfaces
    • 16 lanes, up to 9 ports per group configurable x16, x8, x4, x2, x1 with power-of-two alignment (e.g. 1x8 + 1x4 + 4x1)
    • Max. 8 PCIe ports per interface if any lane is configured as SATA port
    • Lane polarity inversion, per port lane reversal
    • Up to 128 PCIe lanes total on 1P systems
    • Up to 64 or 80 PCIe lanes total per socket on 2P systems
  • xGMI protocol on G0-G3, P1, and P3, used on 2P systems only
    • Four link option 1: G0 (socket 0) ↔ G2 (socket 1), G1 ↔ G3, G2 ↔ G0, G3 ↔ G1
    • Four link option 2: G0 ↔ G2, G2 ↔ G0, P1 ↔ P3, P3 ↔ P1
    • Three link option: G0 ↔ G2, G1 ↔ G3, G2 ↔ G0
    • Max. data rate 32 GT/s
    • Lane polarity inversion, x16 lane reversal
  • CXL protocol on the P0-P3 interfaces (Type-0 processors)
    • CXL Type 1 (accelerators): One link per interface, 1x16 or 1x8 lanes
    • CXL Type 3 (memory expanders): Up to four links per interface, 1x16, 2x8, or 4x4 lanes
    • Unused lanes available for PCIe, configurable 1x8, 2x4, or 3x4
  • SATA Gen 1, 2, 3 (6 Gb/s) protocol on P0 and G3
    • P0: SATA00-07 & SATA10-17, G3: SATA20-27 & SATA30-37
    • Unused lanes available for PCIe, also lanes sharing a PHY group
    • Up to 32 SATA ports total on 1P systems
    • Up to 16 SATA ports total per socket on 2P systems (SATA not supported on G3 regardless of xGMI link option)
  • Two supplementary I/O interfaces P4, P5
    • PCIe Gen 1, 2, 3 (8 GT/s) protocol on both interfaces
      • 4 lanes, up to 4 ports per interface configurable x4, x2, x1
      • Up to 8 PCIe lanes total on 1P systems
      • Up to 6 PCIe lanes total per socket on 2P systems
    • WAFL protocol on lane 0-1 of P5, used on 2P systems only
      • P5[0] (socket 0) ↔ P5[1] (socket 1)
  • 4 × USB 1.1, 2.0, 3.2 Gen 1×1 (5 Gb/s)
  • Low speed interfaces (some sharing pins):
    • 3 × 2-wire or 1 × 4-wire + 1 × 2-wire UART
    • 2 × 1/2/4-bit SPI/eSPI
    • 4 × I3C
    • 6 × I2C
    • 2 × SMBus
    • 4 × SGPIO
    • 2 × SATA DevSlp
    • 76 × GPIO
    • Sideband Interface a.k.a. APML-I3C (SB-RMI, SB-TSI)
    • 2 × Serial VID Interface (SVI3)
    • JTAG

Processors using Socket SP5[edit]

Count: 0


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Package Diagrams[edit]

LGA-6096 diag tv.svg LGA-6096 diag bv.svg

SP5 package. All dimensions in millimeters.

LGA-6096 carrier diag tv.svg LGA-6096 carrier diag bv.svg

SP5 carrier frame. All dimensions in millimeters.

Socket Diagrams[edit]

Socket SP5 housing tv.svg Socket SP5 housing bv.svg

Socket SP5 housing (AMD). All dimensions in millimeters.

Socket SP5 PCB layout.svg

PCB layout of Socket SP5. All dimensions in millimeters.

Pin Map[edit]

Socket SP5 pinmap.svg

Socket SP5 pinout, top view. This is a preview, click for a larger image and other views.

Pin Description[edit]

Signal Type Description
O-IOMEM-D DRAM Channel A-L DIMM 0/1 Differential Clock
MAA-MLA_CA[6:0] O-IOMEM-S DRAM Channel A-L Subchannel A Command/Address Bus
MAB-MLB_CA[6:0] O-IOMEM-S DRAM Channel A-L Subchannel B Command/Address Bus
MAA-MLA_CHECK[7:0] B-IOMEM-S DRAM Channel A-L Subchannel A ECC Check Byte
MAB-MLB_CHECK[7:0] B-IOMEM-S DRAM Channel A-L Subchannel B ECC Check Byte
MAA-MLA_DATA[31:0] B-IOMEM-S DRAM Channel A-L Subchannel A Data Bus
MAB-MLB_DATA[31:0] B-IOMEM-S DRAM Channel A-L Subchannel B Data Bus
MAA-MLA_DQS_H/L[9:0] B-IOMEM-D DRAM Channel A-L Subchannel A Data Strobes (x4 and x8) Differential Pair
MAB-MLB_DQS_H/L[9:0] B-IOMEM-D DRAM Channel A-L Subchannel B Data Strobes (x4 and x8) Differential Pair
MAA-MLA_PAR O-IOMEM-S DRAM Channel A-L Subchannel A Parity
MAB-MLB_PAR O-IOMEM-S DRAM Channel A-L Subchannel B Parity
O-IOMEM-S DRAM Channel A-L DIMM 0/1 Subchannel A Chip Select
O-IOMEM-S DRAM Channel A-L DIMM 0/1 Subchannel B Chip Select
I-IOMEM-S DRAM Channel A-L DIMM 0/1 Subchannel A Response Signal
I-IOMEM-S DRAM Channel A-L DIMM 0/1 Subchannel B Response Signal
P0/P2_RXP/RXN[15:0] I-PCIE-D PCIe Receive Data Differential Pairs
P0/P2_TXP/TXN[15:0] O-PCIE-D PCIe Transmit Data Differential Pairs
P1/P3_RXP/RXN[15:0] I-XGMI-D or I-PCIE-D xGMI or PCIe Receive Data Differential Pairs
P1/P3_TXP/TXN[15:0] O-XGMI-D or O-PCIE-D xGMI or PCIe Transmit Data Differential Pairs
P4/P5_RXP/RXN[3:0] I-PCIE-D PCIe Receive Data Differential Pairs
P4/P5_TXP/TXN[3:0] O-PCIE-D PCIe Transmit Data Differential Pairs
G0-G3_RXP/RXN[15:0] I-XGMI-D or I-PCIE-D xGMI or PCIe Receive Data Differential Pairs
G0-G3_TXP/TXN[15:0] I-XGMI-D or O-PCIE-D xGMI or PCIe Transmit Data Differential Pairs
PCIE_RST0/1_L O-IO18S5-S PCIe Reset Signals from I/O Die
WAFL_RXP/RXN[1:0] I-WAFL-D WAFL Receive Data Differential Pairs (alt. func. of P5[1:0])
WAFL_TXP/TXN[1:0] O-WAFL-D WAFL Transmit Data Differential Pairs
SATA(0-3)(0-7)_RXP/RXN I-SATA-D SATA Receive Data Differential Pairs (alt. func. of P0 & G3)
SATA(0-3)(0-7)_TXP/TXN O-SATA-D SATA Transmit Data Differential Pairs
SATA_ACT_L O-IO18S5-OD SATA Activity signal (HD LED)
SATA_ZP(0-1)_L O-IO18S5-OD Zero Power SATA ODD
SGPIO(0-3)_CLK O-IO18S5-S SGPIO CLK Output for SATA ports 0x-3x
SGPIO_LOAD O-IO18S5-S SGPIO LOAD Output for all SATA ports
USB(0-1)(0-1)_DP/DN B-USB2_S5-D USB High Speed I/O Differential Pairs
USB(0-1)(0-1)_RXP/RXN I-USB3_S5-D USB Super Speed Receive Differential Pairs
USB(0-1)(0-1)_TXP/TXN O-USB3_S5-D USB Super Speed Transmit Differential Pairs
USB(0-1)(0-1)_OC_L I-IO18S5-S USB Over Current signal from USB connector
UART0_CTS_L I-IO18S5-S UART0 Clear To Send Input (alt. func. of UART2_TXD)
UART0_INTR I-IO18S5-S UART0 Interrupt Request
UART0_RTS_L O-IO18S5-S UART0 Request To Send Output (alt. func. of UART2_RXD)
UART(0-2)_RXD I-IO18S5-S UART Receive Data
UART(0-2)_TXD O-IO18S5-S UART Transmit Data
SPI_CLK(0-1) O-IO18S5-S SPI Clock
SPI(0-1)_DAT[0] B-IO18S5-S or O-IO18S5-S SPI Data 0 for multi-I/O device or Data Out
SPI(0-1)_DAT[1] B-IO18S5-S or I-IO18S5-S SPI Data 1 for multi-I/O device or Data In
SPI(0-1)_DAT[3:2] B-IO18S5-S SPI Port Data 2, 3 for multi-I/O device
SPI_CS(0-2)_L O-IO18S5-S SPI Chip Select
SPI_TPM_CS_L O-IO18S5-S SPI Chip Select for TPM
ESPI_CLK(0-2) O-IO18S5-S ESPI Clock (0-1 alt. func. of SPI_CLK0, SPI_CLK1)
ESPI(0-1)_DAT[3:0] B-IO18S5-S ESPI Data (alt. func. of SPI(0-1)_DAT[3:0])
ESPI_CS(0-1)_L O-IO18S5-S ESPI Chip Select
I3C(0-3)_SCL O-IO11S3-S I3C Clock
I3C(0-3)_SDA B-IO11S3-S I3C Data
I2C(0-3)_SCL B-IO18S5-OD I2C Clock (alt. func. of I3C0-I3C3)
I2C(0-3)_SDA B-IO18S5-OD I2C Data
I2C(4-5)_SCL B-IO18S5-OD I2C Clock
I2C(4-5)_SDA B-IO18S5-OD I2C Data
SEC_SCL I-IO11S3-S I3C or I2C CLK for security function
SEC_SDA B-IO11S3-S I3C or I2C Data for security function
SPD(0-3)_SCL, SPD(0-3)_SDA SPD Busses (I3C0-I3C3)
SPD_HOST_CTRL_L O-IO18S5-OD SPD I3C/I2C Bus Mux Control Signal
UBM_CPRSNT_CHANGE_DET_L I-IO18S5-S UBM Subsystem Interrupt
SMBUS(0-1)_SCL B-IO11S3-OD SMBUS Clock (alt. func. of I2C3/I2C5)
AGPIO* Advanced GPIO pin for interrupt, wake, or I/O
GENINT_L I-IO18S5-S Generic Interrupt Request
REFCLK100SSC_P/N O-CLK-D 100 MHz CPU Reference Clock Output from BSP for AP
GPP_CLK10P/N I-CLK-D 100 MHz CPU Reference Clock Input for AP from BSP
GPP_CLK(0-1)(1-5)P/N O-CLK-D 100 MHz Differential PCIe Reference Clock Outputs from I/O Die (Internal CLKGEN Mode)
GPP_CLK(0-1)2P/N I-CLK-D 100 MHz Differential PCIe Reference Clock Input (External CLKGEN Mode)
X32K_X1/X2 A 32768 Hz Real Time Clock XTAL
X48M_X1/X2 A or I-IO18S5-S 48 MHz clock XTAL or (X48M_X1 only): 48 MHz reference clock input for the integrated clock generator
RTCCLK O-IO18S5-S 32768 Hz Real Time Clock output, e.g. BSP to AP, or for a device requiring an RTC clock
KBRST_L I-IO18S5-S Keyboard Controller Reset Input (warm reset)
PM_INTR_L I-IO18S5-S Hotplug SMBus Subsystem Interrupt Input for NVMe Drives and Hotplug Slots
PWR_BTN_L I-IO18S5-S Power Button; Requests sleep state or causes wake event
PWR_GOOD I-IO18S5-S Power Good Input; Asserted when all voltages are within specification; From motherboard to BSP or BSP to AP
PWRGD_OUT O-IO18S5-S Power Good Output, from BSP to PWR_GOOD input of AP
RESET_L B-IO18S5-OD Bidirectional signal that resets the processor when asserted; Normally controlled by an internal state machine but can also be asserted by a second external source, in a 2P system from BSP to AP
RSMRST_L I-IO18S5-S Resume Reset from motherboard, resets all in-processor S5 and S0 logic; Asserted on power up, deasserted when S5 power supplies are within specification
SLP_S3/S5_L O-IO18S5-S S3/S5 Sleep State Power Plane Control Signal
SYS_RESET_L I-IO18S5-S System Reset Input (reset button)
WAKE_L B-IO18S5-OD PCIe WAKE_L signal, wake system out of sleep state
NMI_SYNC_FLOOD_L I-IO33-S Signals a NMI or a Sync Flood indicating a fatal system error
ALERT_L O-IO18S5-OD SB-TSI Interrupt or APML Alert Signal
PROCHOT_L I-IO18S5-S Asserted to force the processor into HTC-active state
SIC I-IO11S3-S Sideband Interface Clock[1]
SID B-IO11S3-S Sideband Interface Data
THERMTRIP_L O-IO18S5-OD Temperature Trip Output
BP(0-3) B-IO18S5-S Break Point Indicator; Used to trigger external test equipment such as oscilloscopes and logic analyzers
DBREQ_L I-IO18S5-S Debug Request input to JTAG controller
TDI I-IO18S5-S JTAG Data Input
TDO O-IO18S5-S JTAG Data Output
TMS I-IO18S5-S JTAG Mode Select
TEST* Test/Debug signals
XTRIG_L[7:4] B-IO18S5-OD XTRIG Debug Signals
SVC0, SVC1 Serial VID Bus 0/1 Clock; Bus 0: VDDCR_CPU0, VDDCR_SOC; Bus 1: VDDCR_CPU1; VDDIO regulator supported by both busses
SVD0, SVD1 Serial VID Bus 0/1 Data
SVT0, SVT1 Serial VID Bus 0/1 Telemetry Output
VDDBT_RTC_G Integrated Real Time Clock battery power supply
RTC_LDO_SELECT Enables the LDO integrated in Socket SP5 processors so VDDBT_RTC_G can be sourced directly from a 3 V coin-cell battery
VDDCR_CPU0 S Core Power Supply 0
VDDCR_CPU0_SENSE Differential (with VSS_SENSE_A) feedback for VDDCR_CPU0 power supply
VDDCR_CPU1 S Core Power Supply 1
VDDCR_CPU1_SENSE Differential (with VSS_SENSE_C) feedback for VDDCR_CPU1 power supply
VDDCR_SOC S Power Supply for Digital Logic
VDDCR_SOC_SENSE Differential (with VSS_SENSE_A) feedback for VDDCR_SOC power supply
VDDIO S Power Supply for Caches and PHY Macros
VDDIO_SENSE Differential (with VSS_SENSE_B) feedback for VDDIO power supply
VDDIO_AUDIO S To be connected to VDD_18_S5 supply
VDD_11_S3 S 1.1 V DDR5 I/O Power Supply
VDD_11_S3_SENSE Differential (with VSS_SENSE_C) feedback for VDD_11_S3 power supply
VDD_18_S5 S 1.8 V Supply for Analog Circuits and GPIOs
VDD_18_S5_SENSE Differential (with VSS_SENSE_D) feedback for VDD_18_S5 power supply
VDD_33_S5 S 3.3 V I/O Supply Voltage
VDD_33_S5_SENSE Differential (with VSS_SENSE_B) feedback for VDD_33_S5 power supply
VSS S Ground for all power supplies
VSS_SENSE_A/B/C/D S VSS SENSE Feedback Signal to voltage regulators
AZ_*, SW_* Reserved Signals (Azalia HDA, SoundWire)
CORETYPE(0-2) Processor Core Type Indicator; NC = Not connected, VSS = connected to VSS on the package
CPU_PRESENT_L CPU Presence Indicator, connected to VSS on the package
SP5R1-SP5R4 Processor Family Revision Identifier; NC = Not connected, VSS = connected to VSS on the package
SA[1:0] I-IO18S5-S Socket Identifier; 0 = connected to VSS, 1 = 2.2 kΩ PU to VDD_18_S5
AP (2P systems)01
RSVD Reserved
  1. The Sideband Interface (SBI) a.k.a. APML is a SMBus interconnect to the processor's SB-RMI and SB-TSI interfaces.

Pin Types[edit]

Voltage Domain Internal to SoC, derived from VDDIO
I/O-xGMI/PCIE/SATA/WAFL-D Input / Output, xGMI / PCIe / SATA / WAFL Domain, Differential
Voltage Domain Internal to SoC, derived from VDD_18_S5
I/O-USB3_S5-D Input / Output, USB3, Differential
I/O-CLK-D Input / Output, CLK, Differential
Other Voltage Domains
I/O/B-IOMEM-S Input / Output / Bidirectional, VDD_11_S3, Single-Ended
O/B-IOMEM-D Output / Bidirectional, VDD_11_S3, Differential
I/O/B-IO18S5-S Input / Output / Bidirectional, VDD_18_S5, Single-Ended
O/B-IO18S5-OD Output / Bidirectional, VDD_18_S5, Open Drain
B-USB2_S5-D Bidirectional, VDD_33_S5 USB2, Differential
A Analog
S Supply Voltage


See also[edit]

designerAMD +
instance ofpackage +
market segmentServer +
microarchitectureZen 4 +
nameSocket SP5 +
tdp400 W (400,000 mW, 0.536 hp, 0.4 kW) +