A 3D-Stacked DIMM is a type of registered memory manufactured as a Dual In-line Memory Module. The individual DRAM devices are packages of stacked chips connected by through-silicon vias (TSV), a master chip and one or more secondary chips. While other memory types may also stack chips connected in parallel to increase memory density, memory controllers communicate only with the master chips of a 3DS DIMM. Without the need for a separate data buffer performance can improve at lower power consumption.

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See also

• High-Bandwidth Memory (HBM)