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Helio X30 (MT6799) - MediaTek
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MediaTek Helio X30
General Info
DesignerMediaTek,
ARM Holdings
ManufacturerTSMC
Model NumberHelio X30
Part NumberMT6799
MarketMobile, Embedded
IntroductionSeptember 26, 2016 (announced)
February 27, 2017 (launched)
General Specs
FamilyHelio
SeriesHelio X
Frequency2,500 MHz, 2,200 MHz, 1,900 MHz
Bus typeAMBA 4 AXI
Microarchitecture
ISAARMv8 (ARM)
MicroarchitectureCortex-A53, Cortex-A73, Cortex-A35
Core NameCortex-A35, Cortex-A53, Cortex-A73
Process10 nm
TechnologyCMOS
Word Size64 bit
Cores10
Threads10
Max CPUs1 (Uniprocessor)
Max Memory8 GiB

Helio X30 (MT6799) is a 64-bit deca-core ARM LTE system on a chip designed by MediaTek and launched in early 2017. This SoC incorporates 3 independent clusters of cores (called "Tri-Cluster" by MediaTek) operating at varying degrees of performance designed for certain workloads (operating at 1.9 GHz, 2.2 GHz, and 2.5 GHz) and supports up to 8 GiB of quad-channel LPDDR4X-3732 memory. This SoC also incorporates a PowerVR GT7400 Plus IGP operating at 800 MHz. The chip has a modem supporting LTE User Equipment (UE) category 10.

Architecture[edit]

The Helio X30 is designed is composed of 3 individual clusters of CPU cores depending on the level of performance required by the active applications.

The three clusters are designed as a modified big.LITTLE configuration.

Cache[edit]

Main articles: Cortex-A53 § Cache and Cortex-A73 § Cache
New text document.svg This section is empty; you can help add the missing info by editing this page.

Memory controller[edit]

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeLPDDR4X-3732
Supports ECCNo
Max Mem8 GiB
Controllers1
Channels4
Width16 bit
Max Bandwidth27.81 GiB/s
Bandwidth
Single 6.95 GiB/s
Double 13.9 GiB/s
Quad 27.81 GiB/s

Expansions[edit]

[Edit/Modify Expansions Info]

ide icon.svg
Expansion Options
USB
Revision2.0, 3.0
Ports8
UART

GP I/OYes

Graphics[edit]

[Edit/Modify IGP Info]

screen icon.svg
Integrated Graphics Information
GPUPowerVR GT7400 Plus
DesignerImagination Technologies
Frequency800 MHz
0.8 GHz
800,000 KHz
OutputDSI

Max Resolution
DSI3840x2160

Standards
Direct3D11.2
OpenGL3.3
OpenCL2.0
OpenGL ES3.2
Vulkan1.0

Wireless[edit]

Antu network-wireless-connected-100.svgWireless Communications
Wi-Fi
WiFi
802.11acYes
Cellular
2G
CSD Yes
GSM Yes
GPRS Yes
EDGE Yes
3G
UMTS
TD-SCDMAYes
DC-HSDPAYes
HSUPAYes
CDMA2000
1XYes
1xEV-DOYes
4G
LTE Advanced
E-UTRANYes
UE Cat10

Image[edit]

  • Integrated image signal processor supports 28 MP
  • Supports image stabilization
  • Supports video stabilization
  • Supports noise reduction
  • Supports lens shading correction
  • Supports AE/AWB/AF
  • Supports edge enhancement
  • Supports face detection and visual tracking
  • Hardware JPEG encoder

Video[edit]

  • Video encoding 4K2K @ 30fps with H.265 and HDR
  • Video decoding 4K2K @ 30fps, h.264, h.265 / HEVC, MPEG-1/2/4, VC-1, VP-8, VP-9

Audio[edit]

  • Audio content sampling rates 8kHz to 192kHz
  • Audio content sampling format 8-bit/16-bit/24-bit Mono/Stereo
  • I2S, PCM
  • Encode: AMR-NB, AMR-WB, AAC, OGG, ADPCM
  • Decode: WAV, MP3, MP2, AAC, AMR-NB, AMR-WB, MIDI, Vorbis, APE, AAC-plus v1, AAC-plus v2, FLAC, WMA, ADPCM
  • 7.1 channel MHL output

Utilizing devices[edit]

  • Meizu Pro 7
  • Meizu Pro 7 Plus

This list is incomplete; you can help by expanding it.

Die[edit]

x30 die shot.png

Bibliography[edit]

  • Mair, Hugh, et al. "3.4 A 10nm FinFET 2.8 GHz tri-gear deca-core CPU complex with optimized power-delivery network for mobile SoC performance." Solid-State Circuits Conference (ISSCC), 2017 IEEE International. IEEE, 2017.
base frequency2,500 MHz (2.5 GHz, 2,500,000 kHz) +, 2,200 MHz (2.2 GHz, 2,200,000 kHz) + and 1,900 MHz (1.9 GHz, 1,900,000 kHz) +
bus typeAMBA 4 AXI +
core count10 +
core nameCortex-A35 +, Cortex-A53 + and Cortex-A73 +
designerMediaTek + and ARM Holdings +
familyHelio +
first announcedSeptember 26, 2016 +
first launchedFebruary 27, 2017 +
full page namemediatek/helio/mt6799 +
has 2g supporttrue +
has 3g supporttrue +
has 4g supporttrue +
has cdma2000 1x supporttrue +
has cdma2000 1xev-do supporttrue +
has cdma2000 supporttrue +
has csd supporttrue +
has dc-hsdpa supporttrue +
has e-utran supporttrue +
has ecc memory supportfalse +
has edge supporttrue +
has gprs supporttrue +
has gsm supporttrue +
has hsupa supporttrue +
has lte advanced supporttrue +
has td-scdma supporttrue +
has umts supporttrue +
instance ofmicroprocessor +
integrated gpuPowerVR GT7400 Plus +
integrated gpu base frequency800 MHz (0.8 GHz, 800,000 KHz) +
integrated gpu designerImagination Technologies +
isaARMv8 +
isa familyARM +
ldateFebruary 27, 2017 +
manufacturerTSMC +
market segmentMobile + and Embedded +
max cpu count1 +
max memory8,192 MiB (8,388,608 KiB, 8,589,934,592 B, 8 GiB, 0.00781 TiB) +
max memory channels4 +
microarchitectureCortex-A53 +, Cortex-A73 + and Cortex-A35 +
model numberHelio X30 +
nameMediaTek Helio X30 +
part numberMT6799 +
process10 nm (0.01 μm, 1.0e-5 mm) +
seriesHelio X +
supported memory typeLPDDR4X-3732 +
technologyCMOS +
thread count10 +
used byMeizu Pro 7 + and Meizu Pro 7 Plus +
user equipment category10 +
word size64 bit (8 octets, 16 nibbles) +