• list of microprocessor families
  == [[Centaur Technology]] == == [[Cypress Semiconductor]] ==
  12 KB (1,182 words) - 13:35, 13 March 2022
• intel/mcs-4/4004
  |technology=pMOS [[File:KL National INS4004.jpg|100px|thumbnail|left|A National Semiconductor version of the 4004, INS4004J]]
  5 KB (748 words) - 21:37, 21 November 2021
• Flip Chip Ball Grid Array
  ...aging]] solution that utilizes the [[controlled collapse chip connection]] technology, also known as [[flip chip]], for its [[die]] to [[substrate]] interconnect fcBGA packages is used in all main semiconductor manufacturers such as in the latest [[Intel]]'s [[Core i7]], [[Texas Instru
  2 KB (239 words) - 07:17, 17 December 2013
• microprocessor
  ...of the incorporated [[central processing unit|CPU]], the [[semiconductor]] technology involved, and the properties of the overall system. Some common specificati * '''[[logic family|technology]]''' - the semiconductor technology used to create the MPU (e.g. [[CMOS]], [[BiCMOS]], and [[TTL]])
  8 KB (1,149 words) - 00:41, 16 September 2019
• 10 µm lithography process
  ...process''' was the [[semiconductor process]] technology used by the major semiconductor companies during the years of 1967 and 1973. This process had an effective |Technology
  2 KB (177 words) - 23:04, 20 May 2018
• 6 µm lithography process
  ...thography process''' was the semiconductor process technology used by some semiconductor companies during the early to mid 1970s. This process was later superseded |Technology
  1 KB (119 words) - 23:04, 20 May 2018
• 3 µm lithography process
  ...thography process''' was the semiconductor process technology used by some semiconductor companies during the mid 1970s to the mid 1980s. <!-- VLSI Technology -->
  3 KB (314 words) - 23:04, 20 May 2018
• 2 µm lithography process
  ...raphy process''' was the semiconductor process technology used by the some semiconductor companies in the mid to late 1980s. By the mid 80s this process was replace | fab 10 name link = vlsi technology
  8 KB (969 words) - 12:31, 22 February 2019
• 1.5 µm lithography process
  ...aphy process''' was the semiconductor process technology used by the major semiconductor companies in the mid 1980s. This process had an effective channel length of
  3 KB (332 words) - 23:04, 20 May 2018
• 1 µm lithography process
  ...aphy process''' was the semiconductor process technology used by the major semiconductor companies between in the late 1980s. 1 µm was phased out in the early 1990 |Technology
  1 KB (166 words) - 23:04, 20 May 2018
• novix/nc4016
  |technology=CMOS In 1988, the NC4016 design was licensed and improved by Harris Semiconductor which later rebranded the chip as the [[RTX2000]], a radiation hardened ver
  2 KB (257 words) - 16:31, 13 December 2017
• 8 µm lithography process
  ...the semiconductor process technology used for early FET devices by leading semiconductor companies during the late early 1970s. This process had a smallest feature | fab 4 name link = mos technology
  5 KB (632 words) - 23:04, 20 May 2018
• fairchild/pps-25
  | developer = Fairchild Semiconductor | manufacturer = Fairchild Semiconductor
  2 KB (291 words) - 23:48, 10 July 2017
• fairchild/f9450
  XGC Technology offers a [[C]] and [[C++]] compiler and simulator for the F9450. The Compil [[Category:Fairchild Semiconductor microprocessors]]
  2 KB (253 words) - 16:27, 20 December 2015
• mosfet
  {{title|MOSFET - Metal-Oxide-Semiconductor Field-Effect-Transistor}}[[File:Electronic component mosfets.jpg|thumb|[[di ...re made of polycrystalline sillicon although in recent years, advancements technology reintroduced metallic gates in order to solve various performance issues.
  8 KB (1,362 words) - 23:38, 17 November 2015
• intel
  '''Intel Corporation''' is an American [[semiconductor]] company. While most notably known for their development of [[microprocess * {{\\|Process Technology}}
  9 KB (1,150 words) - 00:03, 2 October 2022
• national semiconductor/cops i
  | developer = National Semiconductor | manufacturer = National Semiconductor
  2 KB (274 words) - 18:29, 5 February 2016
• national semiconductor/cops ii
  | developer = National Semiconductor | manufacturer = National Semiconductor
  6 KB (685 words) - 22:49, 5 February 2016
• fairchild/9400
  | developer = Fairchild Semiconductor | manufacturer = Fairchild Semiconductor
  2 KB (223 words) - 23:04, 5 October 2017
• national semiconductor/imp-8
  ...semiconductor]] and introduced in 1974. The chips were made using [[PMOS]] technology. Units could be combined to implement systems with 8 to 32-bit words. The I [[Category:National Semiconductor microprocessors]]
  1 KB (137 words) - 12:37, 21 July 2018
• national semiconductor/imp-16
  ...semiconductor]] and introduced in 1973. The chips were made using [[PMOS]] technology. Like the {{national|IMP-8}}, the IMP-16 was designed using 4 {{national|IM [[Category:National Semiconductor microprocessors]]
  1 KB (172 words) - 19:22, 5 November 2015
• fairchild/4700
  | developer = Fairchild Semiconductor | manufacturer = Fairchild Semiconductor
  3 KB (283 words) - 17:18, 12 December 2016
• national semiconductor/mm5700
  {{national title|MM5700}}{{confuse|national semiconductor/maps|l1=National MAPS (MM570X Series)}} ...designed by [[National Semiconductor]]. The chips were made using [[PMOS]] technology, most designed for 9V battery, had an a very limited set of math operations
  2 KB (231 words) - 05:26, 10 November 2015
• 7400 series
  | desc 3 = Technology Indicator * '''Technology indicator:'''
  7 KB (851 words) - 20:53, 29 July 2021
• logic family
  .... A '''logic family''' is a collection of devices that share the same core technology used to implement [[integrated circuit]]s logic (e.g. [[CMOS]] vs [[Bipolar ** [[metal-oxide-semiconductor field-effect transistor]] (MOSFET)
  1 KB (145 words) - 00:40, 26 December 2015
• general instrument
  ...microelectronics division as a wholly owned subsidiary called [[Microchip Technology]].
  1 KB (102 words) - 03:18, 17 February 2016
• Property:instance of
  ** [[allows value::semiconductor company]] ** [[allows value::technology]]
  2 KB (189 words) - 13:28, 11 August 2018
• myson technology
  {{title|Myson Technology}} | name = Myson Technology
  1,010 bytes (100 words) - 08:15, 28 April 2016
• technology node
  {{title|Technology Node}}{{lithography processes}} ...0 nm]] refer purely to a specific generation of chips made in a particular technology. It does not correspond to any gate length or half pitch. Nevertheless, th
  8 KB (1,225 words) - 13:48, 14 December 2022
• 28 nm lithography process
  ...integrated circuit]] manufacturing using 28 nm process began in 2011. This technology superseded by commercial [[22 nm lithography process|22 nm process]]. ...], [[NEC]], [[STMicroelectronics]], [[Infineon Technologies]], [[Chartered Semiconductor Manufacturing]], [[Renasas]]</info>
  6 KB (711 words) - 17:01, 26 March 2019
• 32 nm lithography process
  ...integrated circuit]] manufacturing using 32 nm process began in 2010. This technology was superseded by the [[28 nm lithography process|28 nm process]] (HN) / [[ ...tion between [[IBM]], [[Samsung]], [[Freescale]], [[Toshiba]], [[Chartered Semiconductor Manufacturing]], [[Infineon Technologies ]]</info>
  10 KB (1,090 words) - 19:14, 8 July 2021
• 14 nm lithography process
  ...nm" is simply a commercial name for a generation of a certain size and its technology, as opposed to gate length or half pitch. The 14 nm node was introduced in ...process should cater to the products that will make use of the underlying technology. The composition of the actual integrated circuit also varies by manufactur
  17 KB (2,243 words) - 19:32, 25 May 2023
• 45 nm lithography process
  ...integrated circuit]] manufacturing using 45 nm process began in 2007. This technology was superseded by the [[40 nm lithography process|40 nm process]] (HN) / [[ * Mistry, Kaizad, et al. "A 45nm logic technology with high-k+ metal gate transistors, strained silicon, 9 Cu interconnect la
  5 KB (602 words) - 05:51, 20 July 2018
• 16 µm lithography process
  ...ithography process''' was the [[semiconductor process]] technology used by semiconductor companies during the late 1960s. This process had an effective channel leng
  502 bytes (66 words) - 23:04, 20 May 2018
• 20 µm lithography process
  ...ithography process''' was the [[semiconductor process]] technology used by semiconductor companies during the mid to late 1960s. This process had an effective chann |Technology
  902 bytes (119 words) - 23:04, 20 May 2018
• 50 µm lithography process
  ...aphy process''' was the [[semiconductor process]] technology used by early semiconductor companies during the mid 1960s. This process had an effective channel (Alu)
  524 bytes (70 words) - 23:04, 20 May 2018
• 22 nm lithography process
  ...g using 22 nm process began in 2008 for memory and 2012 for [[MPU]]s. This technology was replaced by with [[20 nm lithography process|20 nm process]] (HN) in 20 * [[:File:22FFL-2017.pdf|Intel's 22FFL technology]]
  7 KB (891 words) - 09:52, 25 November 2020
• 16 nm lithography process
  ...ain size and its technology, as opposed to gate length or half pitch. This technology is set to be replaced with [[10 nm lithography process|10 nm process]] in 2 ...2016 TSMC announced a "12nm" process (e.g. 12FFC<info>12nm FinFET Compact Technology</info>) which uses the similar design rules as the 16nm node but a tighter
  4 KB (580 words) - 17:00, 26 March 2019
• 20 nm lithography process
  ...integrated circuit]] manufacturing using 20 nm process began in 2014. This technology superseded by commercial [[16 nm lithography process|16 nm process]]. <tr><th>Technology</th><td>20 nm HK-MG</td></tr>
  4 KB (483 words) - 23:04, 20 May 2018
• 40 nm lithography process
  ...ss began in 2008 by leading semiconductor companies such as [[TSMC]]. This technology superseded by commercial [[32 nm lithography process|32 nm process]] by 201
  2 KB (182 words) - 03:11, 17 August 2023
• 55 nm lithography process
  ...process began in late 2006 by companies such as [[TSMC]] and [[NEC]]. This technology superseded by commercial [[45 nm lithography process|45 nm process]].
  600 bytes (72 words) - 05:54, 20 July 2018
• 65 nm lithography process
  ...integrated circuit]] manufacturing using 65 nm process began in 2005. This technology was superseded by the [[55 nm lithography process|55 nm process]] (HN) / [[
  4 KB (407 words) - 05:55, 20 July 2018
• 130 nm lithography process
  ...ntegrated circuit]] manufacturing using 130 nm process began in 2001. This technology was replaced by with [[110 nm lithography process|110 nm process]] (HN) in * Tyagi, Sunit, et al. "A 130 nm generation logic technology featuring 70 nm transistors, dual Vt transistors and 6 layers of Cu interco
  5 KB (500 words) - 16:02, 13 May 2020
• 90 nm lithography process
  ...integrated circuit]] manufacturing using 90 nm process began in 2003. This technology was superseded by the [[80 nm lithography process|80 nm process]] (HN) / [[
  3 KB (354 words) - 03:09, 17 August 2023
• 180 nm lithography process
  ...ated circuit]] manufacturing using 180 nm process began in late 1998. This technology was replaced by with [[150 nm lithography process|150 nm process]] (HN) in
  4 KB (413 words) - 03:04, 17 August 2023
• 10 nm lithography process
  ...nm" is simply a commercial name for a generation of a certain size and its technology, as opposed to [[gate length]] or [[half pitch]]. The 10 nm node is current First introduced between 2017-2019, the 10 nm [[process technology]] is characterized by its use of [[FinFET]] transistors with a 30-40s nm [[
  14 KB (1,903 words) - 06:52, 17 February 2023
• 7 nm lithography process
  ...rated circuit]] fabricated using a 7 nm process began in 2018. The process technology will be phased out by leading-edge foundries by 2020/21 timeframe where it ...nm" is simply a commercial name for a generation of a certain size and its technology, and '''does not''' represent any geometry of the transistor.
  13 KB (1,941 words) - 02:40, 5 November 2022
• 5 nm lithography process
  The '''5 nanometer (5 nm) lithography process''' is a [[technology node]] semiconductor manufacturing process following the [[7 nm lithography process|7 nm process ...nm" is simply a commercial name for a generation of a certain size and its technology, and '''does not''' represent any geometry of the transistor.
  11 KB (1,662 words) - 02:58, 2 October 2022
• 250 nm lithography process
  ...nometer (250 nm) lithography process''' is a [[technology node|full node]] semiconductor manufacturing process following the [[350 nm lithography process|350 nm pro ...et al. "Intel’s 0.25 micron, 2.0 volts logic process technology." Intel Technology Journal Q 3 (1998): 1998.
  6 KB (661 words) - 16:18, 21 August 2022
• 350 nm lithography process
  ...ography process''' (350 nm or 0.35 µm) is a [[technology node|full node]] semiconductor manufacturing process following the [[500 nm lithography process|500 nm pro
  5 KB (586 words) - 22:44, 4 April 2022
• 500 nm lithography process
  ...nometer (500 nm) lithography process''' is a [[technology node|full node]] semiconductor manufacturing process following the [[600 nm lithography process|600 nm pro ...pan="2" | [[TI]] || colspan="2" | [[Motorola]] || colspan="2" | [[National Semiconductor|National]] (BiCMOS)
  4 KB (438 words) - 06:15, 20 July 2018
• 1.2 µm lithography process
  ...aphy process''' was the semiconductor process technology used by the major semiconductor companies between in the late 1980s. 1 µm was phased out in the early 1990
  962 bytes (118 words) - 23:04, 20 May 2018
• 1.3 µm lithography process
  ...aphy process''' was the semiconductor process technology used by the major semiconductor companies between in the late 1980s. 1.3 µm was phased out from the late 1 * Meguro, S., et al. "Hi-CMOS III technology." Electron Devices Meeting, 1984 International. IEEE, 1984.
  1 KB (138 words) - 12:57, 23 October 2022
• 110 nm lithography process
  ...10 nm) lithography process''' is a [[technology node#half node|half-node]] semiconductor manufacturing process used as a stopgap between the [[130 nm lithography pr
  1 KB (143 words) - 05:57, 20 July 2018
• 150 nm lithography process
  ...ed circuit]] manufacturing using 150 nm process began in early 2000s. This technology superseded by commercial [[130 nm]], [[110 nm]], and [[90 nm]] processes.
  2 KB (238 words) - 02:56, 27 September 2020
• 7 µm lithography process
  ...thography process''' was the semiconductor process technology used by some semiconductor companies during the early to mid 1970s. This process was later superseded |Technology
  710 bytes (91 words) - 06:15, 18 January 2022
• 5 µm lithography process
  ...thography process''' was the semiconductor process technology used by some semiconductor companies during the mid 1970s. This process was later superseded by [[3 µ
  2 KB (325 words) - 06:22, 20 July 2018
• 3.5 µm lithography process
  ...thography process''' was the semiconductor process technology used by some semiconductor companies during the mid 1970s. This process had an effective channel lengt |Technology
  1 KB (122 words) - 06:21, 20 July 2018
• 2.5 µm lithography process
  ...thography process''' was the semiconductor process technology used by some semiconductor companies during the late 1970s to early 1980s. This process was later supe
  563 bytes (64 words) - 06:20, 20 July 2018
• 80 nm lithography process
  ...grated circuit]] manufacturing using 40 nm process began around 2004. This technology superseded by commercial [[65 nm lithography process|65 nm process]] by 200
  1 KB (136 words) - 05:55, 20 July 2018
• arm holdings
  ...joint venture between [[Acorn Computers]], [[Apple Computer]], and [[VLSI Technology]].
  6 KB (733 words) - 22:02, 3 November 2022
• nvidia
  '''NVIDIA Corporation''' is an American [[fabless]] semiconductor company that focuses largely on [[graphics processing unit]]s for the gamin == Technology ==
  3 KB (261 words) - 16:48, 20 March 2024
• chips and technologies
  | logo = chips and technology logo.svg ...Technologies, Inc. ''' ('''C&T''' or '''CHIPS''') was an early [[fabless]] semiconductor company.
  986 bytes (102 words) - 10:18, 28 January 2018
• 1999
  * January 4: [[rockwell international|Rockwell Semiconductor Systems]] spun-off as a public company, [[Conexant]] (NASDAQ: CNXT). ...nologies]] announced the acquisition of [[Cyrix]] division from [[National Semiconductor]].
  533 bytes (60 words) - 23:21, 27 January 2018
• uc davis/kilocore
  | technology = CMOS ...is. The chip, which was manufactured on [[IBM]]'s [[32 nm process]] PD-SOI technology, has a maximum computation rate of 1.78 trillion fully-independent MIMD ins
  8 KB (1,031 words) - 14:09, 10 May 2019
• 2016
  * January 19: [[Microchip Technology]] acquires [[Atmel]] for $3.6 Billion * April 28: [[Cypress Semiconductor]] acquires [[Broadcom]]'s Wireless Internet of Things Business for $550 mil
  5 KB (593 words) - 01:28, 5 August 2018
• umc
  | founder = Industrial Technology Research Institute '''UMC''' ('''United Microelectronics Corporation''') is a Taiwan semiconductor company. UMC operates the world's third largest foundry business - after [[
  540 bytes (53 words) - 01:14, 30 June 2017
• mathstar
  '''MathStar, Inc.''' was an American [[fabless]] semiconductor company based in [[wikipedia:Hillsboro, Oregon|Hillsboro, Oregon]]. MathSta ...logy.pdf|Using Reconfigurable Processing to Take Advantage of 0.13μm CMOS Technology]]
  3 KB (313 words) - 22:47, 27 June 2016
• exponential technology
  {{title|Exponential Technology}} | name = Exponential Technology
  2 KB (211 words) - 17:29, 3 December 2016
• 1997
  * January 7: [[Exponential Technology]] announces 3 {{expotech|X704|X704 models}}: 466 MHz, 500 MHz, and 533 MHz * May 15: [[Exponential Technology]] defuncts.
  765 bytes (89 words) - 23:26, 2 September 2018
• intrinsity
  ...ded in 1997 by a group of engineers following the closure of [[Exponential Technology]].
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• phytium
  {{title|Phytium Technology}} | name = Phytium Technology
  1,018 bytes (102 words) - 14:58, 26 March 2019
• pezy
  ...se governmental funding program (see [[wikipedia:New Energy and Industrial Technology Development Organization|NEDO]]). The name ''PEZY'' stands for '''P'''eta,
  1 KB (148 words) - 09:27, 9 May 2019
• arm holdings/microarchitectures/cortex-a53
  ...chitecture is designed as a synthesizable [[IP core]] and is sold to other semiconductor companies to be implemented in their own chips. == Process Technology ==
  6 KB (758 words) - 13:01, 6 March 2022
• x86/list of processor families
  '''[[RDC Semiconductor]]:''' '''[[VIA]] (Centaur Technology):'''
  4 KB (569 words) - 06:08, 11 July 2022
• 2017
  * February 2: [[Amkor Technology]] acquires [[NANIUM]] for undisclosed sum. * March 13: [[TSMC]] Technology Symposium
  8 KB (999 words) - 11:04, 3 January 2019
• moore's law
  ...a key observation and projection turned self-fulfilling prophecy in the [[semiconductor industry]] that states that the number of [[transistor]]s on a dense [[inte ...w is named after Gordon Moore, the co-founder of [[Intel]] and [[Fairchild Semiconductor]], whose original 1965 paper became the basis for this law.
  2 KB (369 words) - 09:36, 21 February 2023
• mos technology
  {{title|MOS Technology}} | name = MOS Technology
  2 KB (269 words) - 18:40, 31 August 2021
• ibm
  ...Business Machines Corporation''' ('''IBM''') is an American multinational technology. ...ries]]. While they still design chips, they are now operating as a fabless semiconductor business.
  2 KB (251 words) - 11:14, 15 September 2019
• arm/history
  ...of code. The first processor, the {{armh|ARM1}}, was fabricated on [[VLSI Technology]]'s [[3 µm process]] using just 24,800 transistors. First silicon prototyp ...processors. In 1993, in addition to VLSI, both [[Sharp]] and [[GEC-Plessey Semiconductor]] (GPS) became licensees of ARM.
  6 KB (834 words) - 01:12, 29 January 2019
• loongson
  | name = Loongson Technology | founder 2 = Institute of Computing Technology of the Chinese Academy of Sciences
  2 KB (181 words) - 23:20, 20 March 2017
• 3 nm lithography process
  ...nanometer (3 nm or 30 Å) lithography process''' is a [[technology node]] semiconductor manufacturing process following the [[5 nm lithography process|5 nm process ...nm" is simply a commercial name for a generation of a certain size and its technology, and '''does not''' represent any geometry of the transistor.
  5 KB (558 words) - 19:04, 29 December 2023
• blx ic design
  | founder 2 = Institute of Computing Technology of the Chinese Academy of Sciences ...vernment funding. BLX was established in an attempt to advance the Chinese semiconductor industry.
  1 KB (186 words) - 15:21, 20 March 2017
• zhaoxin
  ...goes by '''VIA Alliance Semiconductor Co., Ltd.''') is [[Chinese]] fabless semiconductor company jointly owned by [[VIA Technologies]] and the Shanghai Municipal Go ...tual property, but it does appear Zhaoxin has at least access to [[Centaur Technology]] {{centtech|CN|l=arch}} [[x86]] microarchitecture as a starting point.
  2 KB (254 words) - 02:16, 20 September 2023
• fujitsu
  '''Fujitsu Ltd.''' Japanese multinational technology conglomerate company. ...50mm]] and [[200 mm]] fabs in Aizu-Wakamatsu became part of [[Aizu Fujitsu Semiconductor]] (AFSL). Fujitsu entered into a joint venture with [[UMC]] in 2015 which g
  2 KB (185 words) - 16:26, 29 June 2018
• icc (shanghai)
  | founder = Minister of Science and Technology of China ...was formed to promote and advance the development of domestic [[Chinese]] semiconductor industry by offering various amenities designed to attract startups such as
  2 KB (195 words) - 01:59, 24 April 2017
• intel/process
  {{intel title|Process Technology History}} This article details '''[[Intel]]'s [[semiconductor process technology]]''' history for research and posterity.
  13 KB (1,998 words) - 03:56, 4 March 2022
• marvell
  {{title|Marvell Technology}} ...company. Marvell primarily focuses on communication, storage, and embedded semiconductor products.
  1 KB (129 words) - 21:28, 28 June 2019
• arm holdings/microarchitectures/cortex-a55
  ...chitecture is designed as a synthesizable [[IP core]] and is sold to other semiconductor companies to be implemented in their own chips. == Process Technology ==
  4 KB (603 words) - 04:23, 27 April 2023
• dec
  '''Digital Equipment Corporation''' ('''DEC''') was a major American semiconductor corporation and a pioneer of minicomputers. * {{decc|Process Technology}}
  2 KB (196 words) - 19:33, 17 June 2017
• dec/microarchitectures/strongarm
  ...ARM on the other hand, which was design using DEC's own in-house tools and semiconductor process, resulted in performance increase of up to 5 times as much. StrongA ...of fate as part of a settlement, Intel agreed to buy {{decc|process|DEC's semiconductor manufacturing}} operations for $700 million which included the Hudson, Mass
  5 KB (738 words) - 13:49, 15 July 2018
• alpha processor
  ...cessor, Inc''' ('''API''', later renamed to '''API NetWorks, Inc''') was a semiconductor company founded by [[Compaq]] and [[Samsung]] in [[1998]] to effectively su ...ed they've reached an agreement with Compaq to license most of Alpha's key technology along with the transfer of development team. Following Compaq's merger with
  1 KB (179 words) - 11:49, 11 June 2017
• dec/process
  {{dec title|Process Technology History}} This article details details '''[[DEC]]'s [[semiconductor process technology]]''' history for research and posterity.
  4 KB (588 words) - 00:02, 26 December 2017
• vti
  {{title|VLSI Technology}} | name = VLSI Technology
  885 bytes (84 words) - 18:16, 30 June 2017
• arm holdings/microarchitectures/arm6
  |manufacturer=VLSI Technology ...e same year ARM signed with a number of additional licensees beyond [[VLSI Technology]], including [[Sharp]] and [[GEC-Plessey]].
  11 KB (1,679 words) - 18:49, 18 May 2023
• arm holdings/microarchitectures/arm7
  |manufacturer=VLSI Technology ...This microarchitecture is designed as an [[IP core]] and is sold to other semiconductor companies to be implemented in their own chips. The ARM7 was the first majo
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• google
  '''Google Inc.''' is an American technology company that specializes in Internet-related services and products. Among m [[category:semiconductor companies]]
  1,016 bytes (117 words) - 00:31, 20 May 2019
• 2018
  * March 27: GPU Technology Conference * April 1: [[ON Semiconductor]] increased stake in [[Aizu Fujitsu Semiconductor]] to 40%
  5 KB (639 words) - 01:27, 30 December 2019
• andes
  '''Andes Technology''' is a [[Taiwanese]] [[fabless]] semiconductor company that designs and licenses [[IP cores]] based on their own in-house
  952 bytes (112 words) - 13:37, 25 December 2017
• mergers and acquisitions
  ** [[Saffron Technology]] (2015) * [[National Semiconductor]]
  656 bytes (64 words) - 00:05, 6 April 2018

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