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10 µm lithography process

The 10 µm lithography process was the semiconductor process technology used by the major semiconductor companies during the years of 1967 and 1973. This process had an effective channel length of roughly 10 µm between the source and drain (Poly-SI channel implant). The typical wafer size for this process at companies such as Fairchild and TI was 2-inch (51 mm).

Industry[edit]

Fab
Process Name​
1st Production​
Contacted Gate Pitch​
Interconnect Pitch​
Metal Layers​
Technology​
Wafer
Intel TI RCA Fairchild National MIL
 
1970 1969 1969 1969
 ? nm  ? nm  ? nm  ? nm  ? nm  ? nm
 ? nm  ? nm  ? nm  ? nm  ? nm  ? nm
2 2 2 2
PMOS PMOS CMOS PMOS PMOS
51 mm

10 µm Microprocessors[edit]

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10 µm Chips[edit]

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