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  • ...microprocessors of the [[amd/k6|K6]] family. Other members used the [[amd/packages/super socket 7|CPGA-321]] and {{\\|CBGA-360}} package.
    2 KB (309 words) - 18:42, 25 July 2020
  • 2 KB (295 words) - 04:45, 2 December 2016
  • ...ned by [[Intel]] for their {{intel|5 Series}} chipset. It's considered a {{packages|Socket-G1}} type although it's not socket-mounted and is instead permanentl
    2 KB (274 words) - 18:31, 1 December 2016
  • 2 KB (275 words) - 22:17, 12 April 2017
  • |predecessor link=amd/packages/socket fm2+ |predecessor 2 link=amd/packages/socket am3+
    30 KB (6,098 words) - 01:58, 12 January 2024
  • #REDIRECT [[amd/packages/socket am4]]
    37 bytes (5 words) - 08:59, 21 July 2020
  • #REDIRECT [[intel/packages/lga-1567]]
    37 bytes (4 words) - 02:06, 10 January 2017
  • #REDIRECT [[amd/packages/socket am4]]
    37 bytes (5 words) - 08:59, 21 July 2020
  • ...s socket accepts Intel's 1151-pin flip-chip land grid array (FCLGA-1151) [[packages]]. This socket is used for Intel's 6th generation, 7th generation, and 8th
    2 KB (343 words) - 01:34, 6 September 2019
  • |successor link=amd/packages/socket strx4 |successor 2 link=amd/packages/socket swrx8
    86 KB (17,313 words) - 02:48, 13 March 2023
  • #REDIRECT [[amd/packages/socket_tr4]]
    37 bytes (5 words) - 14:52, 11 August 2018
  • |predecessor link=amd/packages/socket g34 |successor link=amd/packages/socket sp5
    110 KB (21,122 words) - 02:46, 13 March 2023
  • * Lidded and lidless (mobile processors) packages OPGA-754 lidded package. Pin AG10 MEMRESET_L is NC on lidless packages.
    5 KB (662 words) - 09:51, 29 January 2020
  • 4 KB (576 words) - 15:27, 30 January 2020
  • 4 KB (490 words) - 22:47, 9 February 2020
  • #REDIRECT [[amd/packages/socket strx4]]
    39 bytes (5 words) - 17:07, 15 April 2022
  • #REDIRECT [[amd/packages/socket swrx8]]
    39 bytes (5 words) - 17:08, 15 April 2022
  • 7 KB (1,029 words) - 18:40, 22 February 2020
  • 8 KB (1,212 words) - 19:01, 22 February 2020
  • 12 KB (1,960 words) - 12:23, 18 July 2020
  • |predecessor link=amd/packages/socket_am3 |successor link=amd/packages/socket_am4
    6 KB (822 words) - 15:01, 9 December 2022
  • 3 KB (481 words) - 16:24, 16 March 2023
  • 4 KB (527 words) - 16:25, 16 March 2023
  • 14 KB (2,611 words) - 00:31, 4 April 2022
  • ...e [[AMD]] K6 microprocessor. Other members of the K6 family used the [[amd/packages/super socket 7|CPGA-321]] and {{\\|OBGA-349}} package.
    2 KB (293 words) - 17:41, 25 July 2020
  • ...embedded processors AMD developed the {{\\|CBGA-360}} and {{\\|OBGA-349}} packages. Super Socket 7 was superseded by {{\\|Slot A}}.
    6 KB (935 words) - 09:30, 27 July 2020
  • 7 KB (1,063 words) - 15:50, 4 September 2020
  • 5 KB (770 words) - 15:12, 4 September 2020
  • 5 KB (727 words) - 15:34, 4 September 2020
  • 5 KB (645 words) - 16:31, 16 March 2023
  • 4 KB (610 words) - 16:33, 16 March 2023
  • 4 KB (543 words) - 16:33, 16 March 2023
  • 4 KB (580 words) - 13:34, 7 September 2020
  • 5 KB (755 words) - 13:50, 7 September 2020
  • 5 KB (642 words) - 14:08, 7 September 2020
  • #REDIRECT [[amd/packages/socket am1]]
    37 bytes (5 words) - 14:14, 7 September 2020
  • 4 KB (641 words) - 23:21, 25 March 2023
  • 5 KB (630 words) - 23:22, 25 March 2023
  • 3 KB (404 words) - 16:38, 16 March 2023
  • ...vailable in the smaller {{\\|FT3b}} and {{\\|FT4}} BGA packages and in PGA packages for {{\\|Socket FM2+}} and {{\\|Socket AM4}}. FP4 is the successor to the {
    5 KB (679 words) - 23:22, 25 March 2023
  • 5 KB (642 words) - 23:22, 25 March 2023
  • All FP6 packages carry a monolithic die which integrates eight CPU cores, two memory control
    20 KB (3,273 words) - 17:47, 10 May 2023
  • ...cket systems. Uniprocessor Opterons with a DDR2 interface were released in packages for {{\\|Socket AM2}} and {{\\|Socket AM2+|AM2+}} with a single HT link. So ...cessors support UDIMMs instead of RDIMMs. Socket Fr3 is incompatible with packages for other revisions.
    11 KB (1,717 words) - 17:25, 5 February 2021
  • 8 KB (1,126 words) - 18:53, 12 January 2021
  • #REDIRECT [[amd/packages/socket s1g1]]
    38 bytes (6 words) - 18:55, 12 January 2021
  • 8 KB (1,211 words) - 19:08, 12 January 2021
  • 5 KB (767 words) - 19:14, 12 January 2021
  • 10 KB (1,781 words) - 19:23, 12 January 2021
  • ...links. Uniprocessor Opterons with DDR3 memory controllers were released in packages for {{\\|Socket AM3}} and {{\\|Socket AM3+|AM3+}} which support two memory Socket C32 has the same dimensions as Socket F, however the LGA-1207 packages for these sockets are mechanically, due to keying notches in different posi
    7 KB (998 words) - 20:07, 7 February 2021
  • ...generations. Uniprocessor Opterons with a DDR3 interface were released in packages for {{\\|Socket AM3}} and {{\\|Socket AM3+|AM3+}} which make a single HT li
    36 KB (7,214 words) - 15:50, 23 April 2022

Page text matches

  • ...edia Interface}} 1.0. All processors use [[packages/socket-g1|PGA-988]] ([[packages/socket-g1|Socket G1]]) packaging. They all have the following features: ...face}} 1.0 and introduced {{x86|AES}} instructions. These processors use {{packages|Socket-G1}}. They all have the following features:
    43 KB (5,739 words) - 21:30, 22 April 2024
  • ...is attractive where performance is more important than cost. Flip-chip BGA packages can be mounted using standard [[printed circuit board]]s and can be replace ...d, high density ceramic substrates or organic laminate. Additionally fcBGA packages are often offered in bare die, flat lid, and full lid configuration. They a
    2 KB (239 words) - 07:17, 17 December 2013
  • |package module 1={{packages/pdip-28}} |package module 2={{packages/cdip-28}}
    617 bytes (77 words) - 16:03, 13 December 2017
  • ...h the [[Intel 4004]]. The chip came in 16-pin [[Dual in-line package|DIP]] packages. The HD35404 was part of the [[Hitachi HMCS-4]], an [[Intel MCS-4]] clone.
    1 KB (157 words) - 01:34, 24 December 2015
  • ...ters may be formed by powering selected LED elements. SSDs come in various packages and pin arranges.
    4 KB (490 words) - 09:47, 24 July 2019
  • 1 KB (209 words) - 20:19, 26 November 2015
  • ...packages]]. Most designers are thus restricted to one of those pre-defined packages. Sometimes the device that's designed does not utilize all the pins for var
    2 KB (238 words) - 20:56, 26 November 2015
  • |package module 1={{packages/intel/fcbga-1364}}
    4 KB (404 words) - 16:22, 13 December 2017
  • |package module 1={{packages/intel/fcbga-1364}}
    3 KB (401 words) - 14:24, 12 February 2019
  • |package module 1={{packages/intel/fcbga-1364}}
    3 KB (399 words) - 16:22, 13 December 2017
  • |package module 1={{packages/intel/fcbga-1364}}
    3 KB (400 words) - 16:22, 13 December 2017
  • |package module 1={{packages/intel/fcbga-1364}}
    3 KB (399 words) - 16:22, 13 December 2017
  • |package module 1={{packages/intel/fcbga-1364}}
    3 KB (386 words) - 09:14, 26 December 2017
  • |package module 1={{packages/intel/fcbga-1364}}
    3 KB (401 words) - 16:22, 13 December 2017
  • |package module 1={{packages/intel/fcbga-1364}}
    3 KB (397 words) - 16:22, 13 December 2017
  • |package module 1={{packages/intel/fcbga-1364}}
    3 KB (398 words) - 16:22, 13 December 2017
  • |package module 1={{packages/intel/fcbga-1364}}
    4 KB (406 words) - 16:22, 13 December 2017
  • |package module 1={{packages/intel/fcbga-1364}}
    4 KB (404 words) - 16:19, 13 December 2017
  • |package module 1={{packages/intel/fcbga-1364}}
    3 KB (401 words) - 16:19, 13 December 2017
  • |package module 1={{packages/intel/fcbga-1364}}
    3 KB (396 words) - 16:22, 13 December 2017
  • |package module 1={{packages/intel/fcbga-1364}}
    3 KB (391 words) - 16:22, 13 December 2017
  • |package module 1={{packages/intel/fcbga-1364}}
    3 KB (399 words) - 16:27, 13 December 2017
  • |package module 1={{packages/intel/fcbga-1356}}
    4 KB (596 words) - 16:15, 13 December 2017
  • |package module 1={{packages/intel/fcbga-1356}}
    4 KB (596 words) - 16:15, 13 December 2017
  • |package module 1={{packages/intel/fclga-1151}}
    4 KB (627 words) - 16:17, 13 December 2017
  • |package module 1={{packages/intel/fclga-1151}}
    4 KB (627 words) - 16:20, 13 December 2017
  • |package module 1={{packages/intel/fcbga-1356}}
    4 KB (640 words) - 02:21, 16 January 2019
  • |package module 1={{packages/intel/fcbga-1356}}
    4 KB (650 words) - 02:21, 16 January 2019
  • |package module 1={{packages/intel/fcbga-1364}}
    4 KB (407 words) - 16:22, 13 December 2017
  • |package module 1={{packages/intel/fcbga-1364}}
    4 KB (401 words) - 16:22, 13 December 2017
  • |package module 1={{packages/intel/fcbga-1364}}
    4 KB (395 words) - 16:22, 13 December 2017
  • |package module 1={{packages/intel/fcbga-1364}}
    4 KB (424 words) - 16:22, 13 December 2017
  • |package module 1={{packages/intel/fcbga-1364}}
    4 KB (405 words) - 16:22, 13 December 2017
  • |package module 1={{packages/intel/fcbga-1364}}
    4 KB (409 words) - 16:19, 13 December 2017
  • |package module 1={{packages/intel/fcbga-1364}}
    4 KB (409 words) - 16:19, 13 December 2017
  • |package module 1={{packages/intel/fcbga-1364}}
    4 KB (415 words) - 16:19, 13 December 2017
  • |package module 1={{packages/intel/fcbga-1356}}
    4 KB (631 words) - 16:18, 13 December 2017
  • |package module 1={{packages/intel/fcbga-1356}}
    4 KB (649 words) - 16:20, 13 December 2017
  • The MC14500B came in a few different packages for different specifications.
    2 KB (232 words) - 16:31, 13 December 2017
  • ...2 mm² {{intel|FCBGA-441}} package. Models ending in ''P'' use those large packages. A couple of models (those ending with 'T') also support industrial tempera
    17 KB (2,292 words) - 09:32, 16 July 2019
  • ! Part !! [[clock generator|Clock]] !! OP Temp !! Packages !! Notes
    4 KB (514 words) - 00:54, 19 May 2016
  • ...replaced with {{intel|Direct Media Interface}} 1.0. These processors use {{packages|Socket-G1}}. They all have the following features: ...were introduced in mid-[[2011]]. Mobile Pentium uses {{intel|FCBGA-1023}} packages and {{intel|rPGA988B}} for B models. Sandy Bridge incorporated the [[integr
    20 KB (2,661 words) - 00:45, 11 October 2017
  • ...replaced with {{intel|Direct Media Interface}} 1.0. These processors use {{packages|Socket-G1}}. They all have the following features:
    25 KB (3,201 words) - 03:13, 22 September 2018
  • | type = System in packages
    13 KB (1,784 words) - 08:04, 6 April 2019
  • ...those years were the [[TO-5]] and [[TO-18]] (Transistor Outline) metal-can packages.
    502 bytes (66 words) - 23:04, 20 May 2018
  • ...5]] and [[TO-18]] (Transistor Outline) metal-can packages and dual in-line packages.
    902 bytes (119 words) - 23:04, 20 May 2018
  • ...those years were the [[TO-5]] and [[TO-18]] (Transistor Outline) metal-can packages.
    524 bytes (70 words) - 23:04, 20 May 2018
  • Sandy Bridge comes in three different [[C4]] packages: [[PGA]] for mobile computers, [[LGA]] for desktop systems and [[BGA]] for
    84 KB (13,075 words) - 00:54, 29 December 2020
  • === Packages ===
    79 KB (11,922 words) - 06:46, 11 November 2022
  • === Packages ===
    38 KB (5,431 words) - 10:41, 8 April 2024

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