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Package CBGA-360 - AMD
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Package CBGA-360
General Info
DesignerAMD
IntroductionMarch 5, 1998 (launched)
MarketMobile
MicroarchitectureK6
TDP11 W
11,000 mW
0.0148 hp
0.011 kW
Package
NameCBGA-360
TypeCeramic Ball Grid Array
Contacts360
Dimension25.0 mm
2.5 cm
0.984 in
× 25.0 mm
2.5 cm
0.984 in
Pitch1.27 mm
0.05 in

CBGA-360 was a package for the Mobile AMD K6 microprocessor. Other members of the K6 family used the CPGA-321 and OBGA-349 package.

Features[edit]

  • 360-pin lidless ball grid array, 1.27 mm pitch, 19 × 19 pins, 25 × 25 mm ceramic substrate
  • 2.0, 2.1 V core supply voltage, 3.135-3.6 V I/O

Chipsets[edit]

  • AMD 640
  • SiS 500 series
  • VIA Apollo series

Processors using CBGA-360[edit]

 List of all CBGA-360-based Processors
ModelPriceProcessLaunchedµarchFamilyCoreCTFreqTurboTDP
AMD-K6/233BCZ250 nm
0.25 μm
2.5e-4 mm
5 March 1998K6K6Little Foot110.233 GHz
233.33 MHz
233,330 kHz
AMD-K6/266BCZ250 nm
0.25 μm
2.5e-4 mm
5 March 1998K6K6Little Foot110.267 GHz
266.66 MHz
266,660 kHz
AMD-K6/300BDZ250 nm
0.25 μm
2.5e-4 mm
5 March 1998K6K6Little Foot110.3 GHz
299.99 MHz
299,990 kHz
Count: 3

Package Diagram[edit]

CBGA-360 diag.svg

CBGA-360 package. All dimensions in millimeters.

Pin Map[edit]

CBGA-360 pinmap.svg

References[edit]

  • "Mobile AMD-K6 Processor Data Sheet", AMD Publ. #21049, Rev. H, September, 1998

See also[edit]

designerAMD +
first launchedMarch 5, 1998 +
instance ofpackage +
market segmentMobile +
microarchitectureK6 +
namePackage CBGA-360 +
packageCBGA-360 +
package contacts360 +
package length25 mm (2.5 cm, 0.984 in) +
package pitch1.27 mm (0.05 in) +
package typeCeramic Ball Grid Array +
package width25 mm (2.5 cm, 0.984 in) +
tdp11 W (11,000 mW, 0.0148 hp, 0.011 kW) +