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Package CBGA-360 - AMD
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Package CBGA-360
General Info
DesignerAMD
IntroductionMarch 5, 1998 (launched)
MarketMobile
MicroarchitectureK6
TDP11 W
Package
NameCBGA-360
TypeCeramic Ball Grid Array
Contacts360
Dimension25.0 mm × 25.0 mm
Pitch1.27 mm

CBGA-360 was a package for the Mobile AMD K6 microprocessor. Other members of the K6 family used the CPGA-321 and OBGA-349 package.

Features[edit]

  • 360-pin lidless ball grid array, 1.27 mm pitch, 19 × 19 pins, 25 × 25 mm ceramic substrate
  • 2.0, 2.1 V core supply voltage, 3.135-3.6 V I/O

Chipsets[edit]

  • AMD 640
  • SiS 500 series
  • VIA Apollo series

Processors using CBGA-360[edit]

 List of all CBGA-360-based Processors
ModelPriceProcessLaunchedµarchFamilyCoreCTFreqTurboTDP
Count: 0

Package Diagram[edit]

CBGA-360 diag.svg

CBGA-360 package. All dimensions in millimeters.

Pin Map[edit]

CBGA-360 pinmap.svg

References[edit]

  • "Mobile AMD-K6 Processor Data Sheet", AMD Publ. #21049, Rev. H, September, 1998

See also[edit]

designerAMD +
first launchedMarch 5, 1998 +
instance ofpackage +
market segmentMobile +
microarchitectureK6 +
namePackage CBGA-360 +
tdp11 W (11,000 mW, 0.0148 hp, 0.011 kW) +