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Package OBGA-349 - AMD
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Package OBGA-349
General Info
DesignerAMD
IntroductionSeptember 25, 2000 (launched)
MarketEmbedded
Package
NameOBGA-349
TypeOrganic Ball Grid Array
Contacts349
Dimension25.0 mm × 25.0 mm
Pitch1.27 mm

OBGA-349 was a package for AMD embedded microprocessors of the K6 family. Other members used the CPGA-321 and CBGA-360 package.

Features[edit]

  • 349-pin lidless ball grid array, 1.27 mm pitch, 19 × 19 pins, 25 × 25 mm organic substrate
  • 1.5, 1.6, 1.7, 1.8, 2.0 V core supply voltage, 3.135-3.6 V I/O

Chipsets[edit]

  • AMD 640
  • SiS 500 series
  • VIA Apollo series

Processors using OBGA-349[edit]

  • AMD K6-2E+
  • AMD K6-IIIE+
 List of all OBGA-349-based Processors
ModelPriceProcessLaunchedµarchFamilyCoreCTFreqTurboTDP
Count: 0

Package Diagram[edit]

OBGA-349 diag.svg

OBGA-349 package. All dimensions in millimeters.

Pin Map[edit]

OBGA-349 pinmap.svg

References[edit]

  • "AMD-K6-2E+ Embedded Processor Data Sheet", AMD Publ. #23542, Rev. A, September 2000
  • "AMD-K6-IIIE+ Embedded Processor Data Sheet", AMD Publ. #23543, Rev. A, September 2000

See also[edit]

designerAMD +
first launchedSeptember 25, 2000 +
instance ofpackage +
market segmentEmbedded +
namePackage OBGA-349 +