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Socket 754 - AMD
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Socket 754
General Info
DesignerAMD
IntroductionSeptember 23, 2003 (launched)
MarketDesktop
MicroarchitectureK8
TDP89 W
Package
NameOPGA-754
TypeOrganic Pin Grid Array
Contacts754
Dimension40.0 mm × 40.0 mm
Pitch1.27 mm
Socket
NameSocket 754
TypePGA

Socket 754 was the socket for µOPGA-754-packaged AMD microprocessors, successor to Socket A and the original socket for AMD's Athlon 64 family, i.e. K8 microarchitecture processors. With the introduction of the dual memory channel Socket 939 in mid-2004 this socket was relegated to the budget/value segment. Server processors progressed to Socket 940. Socket 754 was used in AMD's first mobile platform and superseded in this role by Socket S1.

Features[edit]

  • 754-pin micro pin grid array, 1.27 mm pitch, 29 × 29 pins, 40 × 40 mm organic substrate
  • Lidded and lidless (mobile processors) packages
  • 0.8 - 1.55 V supply voltage, 89 W TDP
  • 16 bit HyperTransport interface up to 800 MHz, 1600 MT/s, 3.2 Gbyte/s in each direction
  • 64/72 bit DDR SDRAM interface up to 200 MHz, PC-3200 (DDR-400), 3.2 Gbyte/s, SEC-DED ECC
    • Up to 3 UDIMMs or 4 RDIMMs (Athlon 64), up to 1 Gbyte per UDIMM, 4 Gbyte per RDIMM
    • Up to 2 SO-UDIMMs (Turion 64)
    • Up to 3 UDIMMs (other models)
  • P-States, ACPI C1 (Halt), C2, C3/S1 (Stop Grant), S3 (Core & HT power down), S5 (all power off)
  • Thermal diode, overtemperature protection

Chipsets[edit]

  • ATI 380, 480 series
  • SiS 750, 760 series
  • Nvidia nForce3, nForce4, nForce 410/430
  • VIA K8T800, K8M800

Processors using Socket 754[edit]

  • AMD Athlon 64 codename "ClawHammer", "Newcastle", "Venice"
  • AMD Mobile Athlon 64 "ClawHammer", "Odessa", "Oakville", "Newark"
  • AMD Sempron "Paris", "Palermo"
  • AMD Mobile Sempron "Dublin", "Georgetown", "Sonora", "Albany", "Roma"
  • AMD Turion 64 "Lancaster"
  • AMD Athlon XP-M "ClawHammer", "Odessa", "Dublin"
 List of all Socket 754-based Processors
ModelPriceProcessLaunchedµarchFamilyCoreCTFreqTurboTDP
Count: 0

Package Diagram[edit]

OPGA-754 lidded diag.svg

OPGA-754 lidded package. All dimensions in millimeters.

OPGA-754 lidless B1 diag.svg

OPGA-754 lidless B1 package (Mobile Athlon 64 and Athlon XP-M "ClawHammer"). All dimensions in millimeters.

OPGA-754 lidless B2 diag.svg

OPGA-754 lidless B2 package (Mobile Athlon 64 and Athlon XP-M "Odessa"). All dimensions in millimeters.

OPGA-754 lidless B3 diag.svg

OPGA-754 lidless B3 package (Mobile Sempron and Athlon XP-M "Dublin"). All dimensions in millimeters.

Socket Outline[edit]

Socket 754 diag.svg

All dimensions in millimeters.

Pin Map[edit]

OPGA-754 lidded pinmap.svg

OPGA-754 lidded package. Pin AG10 MEMRESET_L is NC on lidless packages.

References[edit]

  • "AMD Functional Data Sheet, 754 Pin Package", AMD Publ. #31410
  • "Socket 754 Design and Qualification Requirements", AMD Publ. #24850
  • "AMD Athlon™ 64 Processor Product Data Sheet", AMD Publ. #24659
  • "AMD Sempron™ Processor Product Data Sheet", AMD Publ. #31805
  • "AMD Turion™ 64 Mobile Technology Product Data Sheet", AMD Publ. #32816

See also[edit]

Facts about "Socket 754 - AMD"
designerAMD +
first launchedSeptember 23, 2003 +
instance ofpackage +
market segmentDesktop +
microarchitectureK8 +
nameSocket 754 +
tdp89 W (89,000 mW, 0.119 hp, 0.089 kW) +