Revision as of 21:01, 6 September 2017

Semiconductor lithography processes technology

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The 180 nanometer (180 nm) lithography process is a full node semiconductor manufacturing process following the 220 nm process stopgap. Commercial integrated circuit manufacturing using 180 nm process began in late 1998. This technology was replaced by with 150 nm process (HN) in 2000 and 130 nm process (FN) in 2001.

Industry

The 180 nm process was first to use Cu metalization as a replacement for Al for interconnects.

180 nm Microprocessors

• AMD

• Cyrix
  • Cyrix III
• DEC
  • Alpha 21264C
  • Alpha 21364
  • Alpha 21264B
• HAL (Fujitsu)
  • SPARC64 GP
• HiSilicon
  • K3
• HP
  • PA-8700
  • PA-8700+
• IBM
  • RS64 IV
  • z900
• Intel
  • Itanium
  • Itanium 2
  • Mobile Pentium III
  • Pentium 4
• Loongson
  • Godson 2
• Motorola
  • PowerPC
• Qualcomm
  • MSM6xxx
• Rapport
  • Kilocore (PipeRench)
• Sun
  • UltraSPARC IIi
  • UltraSPARC IIe

This list is incomplete; you can help by expanding it.

180 nm Microarchitectures

• AMD
  • K6-III
  • K7
• ARM
  • ARM7
• IBM
  • z900
• Intel
  • NetBurst

This list is incomplete; you can help by expanding it.