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Difference between revisions of "32 nm lithography process"

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== Industry ==
 
== Industry ==
−
TSMC cancelled its planned 32nm node process.
+
TSMC cancelled its planned 32nm node process. Intel's 32 nm process became the first process to introduce the [[self-aligned via patterning]].
−
{{scrolling table/top|style=text-align: right; | first=Fab
+
 
−
  |Process Name
+
{{nodes comp
−
  |1st Production
+
<!-- Intel -->
−
  |Type
+
| process 1 fab          = [[Intel]]
−
  |Wafer
+
| process 1 name        = P1268 (CPU) / P1269 (SoC)
−
  |&nbsp;
+
| process 1 date        = 2009
−
  |Contacted Gate Pitch
+
| process 1 lith        = 193 nm
−
  |Interconnect Pitch (M1P)
+
| process 1 immersion    = Yes
−
  |SRAM bit cell (HD)
+
| process 1 exposure    = DP
−
  |SRAM bit cell (HS)
+
| process 1 wafer type  = Bulk
−
  |SRAM bit cell (LP)
+
| process 1 wafer size  = 300 mm
−
  |DRAM bit cell
+
| process 1 transistor  = Planar
 +
| process 1 volt        = 1 V, 0.75 V
 +
| process 1 layers      = 9
 +
| process 1 delta from  = [[45 nm]] Δ
 +
| process 1 gate len    = 30 nm
 +
| process 1 gate len Δ  = &nbsp;
 +
| process 1 cpp          = 112.5 nm
 +
| process 1 cpp Δ        = 0.63x
 +
| process 1 mmp          = 112.5 nm
 +
| process 1 mmp Δ        = 0.70x
 +
| process 1 sram hp      = 0.199 µm²
 +
| process 1 sram hp Δ    = &nbsp;
 +
| process 1 sram hd      = 0.148 µm²
 +
| process 1 sram hd Δ    = &nbsp;
 +
| process 1 sram lv      = 0.171 µm²
 +
| process 1 sram lv Δ    = &nbsp;
 +
| process 1 dram        = &nbsp;
 +
| process 1 dram Δ      = &nbsp;
 +
<!-- TSMC -->
 +
| process 2 fab          = [[TSMC]]
 +
| process 2 name        = &nbsp;
 +
| process 2 date        = &nbsp;
 +
| process 2 lith        = 193 nm
 +
| process 2 immersion    = Yes
 +
| process 2 exposure    = DP
 +
| process 2 wafer type  = Bulk
 +
| process 2 wafer size  = 300 mm
 +
| process 2 transistor  = Planar
 +
| process 2 volt        = 1.1 V
 +
| process 2 layers      = &nbsp;
 +
| process 2 delta from  = [[40 nm]] Δ
 +
| process 2 gate len    = 30 nm
 +
| process 2 gate len Δ  = &nbsp;
 +
| process 2 cpp          = 130 nm
 +
| process 2 cpp Δ        = &nbsp;
 +
| process 2 mmp          = 100 nm
 +
| process 2 mmp Δ        = &nbsp;
 +
| process 2 sram hp      = &nbsp;
 +
| process 2 sram hp Δ    = &nbsp;
 +
| process 2 sram hd      = 0.15 µm²
 +
| process 2 sram hd Δ    = &nbsp;
 +
| process 2 sram lv      = &nbsp;
 +
| process 2 sram lv Δ    = &nbsp;
 +
| process 2 dram        = &nbsp;
 +
| process 2 dram Δ      = &nbsp;
 +
<!-- IBM -->
 +
| process 3 fab          = [[Common Platform Alliance]]<info>The Common Platform Alliance 20 nm node was a collaboration between [[IBM]], [[Samsung]], [[Freescale]], [[Toshiba]], [[Chartered Semiconductor Manufacturing]], [[Infineon Technologies ]]</info>
 +
| process 3 name        = &nbsp;
 +
| process 3 date        = 2011
 +
| process 3 lith        = 193 nm
 +
| process 3 immersion    = Yes
 +
| process 3 exposure    = DP
 +
| process 3 wafer type  = Bulk
 +
| process 3 wafer size  = 300 mm
 +
| process 3 transistor  = Planar
 +
| process 3 volt        = 1 V, 0.8 V
 +
| process 3 layers      = 11
 +
| process 3 delta from  = [[45 nm]] Δ
 +
| process 3 gate len    = 30 nm
 +
| process 3 gate len Δ  = &nbsp;
 +
| process 3 cpp          = 126 nm
 +
| process 3 cpp Δ        = &nbsp;
 +
| process 3 mmp          = 100 nm
 +
| process 3 mmp Δ        = &nbsp;
 +
| process 3 sram hp      = &nbsp;
 +
| process 3 sram hp Δ    = &nbsp;
 +
| process 3 sram hd      = 0.157 µm²
 +
| process 3 sram hd Δ    = &nbsp;
 +
| process 3 sram lv      = &nbsp;
 +
| process 3 sram lv Δ    = &nbsp;
 +
| process 3 dram        = &nbsp;
 +
| process 3 dram Δ      = &nbsp;
 +
<!-- Toshiba -->
 +
| process 4 fab          = [[Toshiba]] / [[NEC]]
 +
| process 4 name        = &nbsp;
 +
| process 4 date        = &nbsp;
 +
| process 4 lith        = 193 nm
 +
| process 4 immersion    = Yes
 +
| process 4 exposure    = DP
 +
| process 4 wafer type  = Bulk
 +
| process 4 wafer size  = 300 mm
 +
| process 4 transistor  = Planar
 +
| process 4 volt        = 1 V
 +
| process 4 layers      = &nbsp;
 +
| process 4 delta from  = [[40 nm]] Δ
 +
| process 4 gate len    = &nbsp;
 +
| process 4 gate len Δ  = &nbsp;
 +
| process 4 cpp          = 120 nm
 +
| process 4 cpp Δ        = &nbsp;
 +
| process 4 mmp          = 100 nm
 +
| process 4 mmp Δ        = &nbsp;
 +
  | process 4 sram hp      = &nbsp;
 +
  | process 4 sram hp Δ    = &nbsp;
 +
  | process 4 sram hd      = 0.124 µm²
 +
  | process 4 sram hd Δ    = &nbsp;
 +
  | process 4 sram lv      = &nbsp;
 +
  | process 4 sram lv Δ    = &nbsp;
 +
  | process 4 dram        = &nbsp;
 +
| process 4 dram Δ      = &nbsp;
 +
<!-- IBM SOI -->
 +
| process 5 fab          = [[Common Platform Alliance]] (SOI)<info>[[IBM]], [[Freescale]], [[AMD]]</info>
 +
| process 5 name        = &nbsp;
 +
| process 5 date        = &nbsp;
 +
  | process 5 lith        = 193 nm
 +
| process 5 immersion    = Yes
 +
| process 5 exposure    = DP
 +
| process 5 wafer type  = SOI
 +
| process 5 wafer size  = 300 mm
 +
| process 5 transistor  = Planar
 +
| process 5 volt        = 1 V
 +
| process 5 layers      = 11
 +
| process 5 delta from  = [[45 nm]] Δ
 +
| process 5 gate len    = 25 nm
 +
| process 5 gate len Δ  = &nbsp;
 +
| process 5 cpp          = 130 nm
 +
| process 5 cpp Δ        = &nbsp;
 +
| process 5 mmp          = 100 nm
 +
| process 5 mmp Δ        = &nbsp;
 +
| process 5 sram hp      = &nbsp;
 +
| process 5 sram hp Δ    = &nbsp;
 +
| process 5 sram hd      = 0.149 µm²
 +
| process 5 sram hd Δ    = &nbsp;
 +
| process 5 sram lv      = &nbsp;
 +
  | process 5 sram lv Δ    = &nbsp;
 +
  | process 5 dram        = 0.039 µm²
 +
  | process 5 dram Δ      = &nbsp;
 
}}
 
}}
−
{{scrolling table/mid}}
+
 
−
|-
 
−
! colspan="2" | Common Platform <info>[[IBM]], [[Freescale]], [[AMD]]</info> !! colspan="2" | [[Intel]] !! colspan="2" | [[TSMC]] !! colspan="2" | [[Samsung]] !! colspan="2" | [[Toshiba]] / NEC !! colspan="2" | Common Platform 2<info>[[IBM]], [[STMicroelectronics]], [[Frescale]], [[Chartered]], [[Infineon]]</info>
 
−
|- style="text-align: center;"
 
−
| colspan="2" | || colspan="2" | P1268 (CPU) / P1269 (SoC) || colspan="2" | || colspan="2" | 32LP || colspan="2" | || colspan="2" |
 
−
|- style="text-align: center;"
 
−
| colspan="2" | 2009 || colspan="2" | 2009 || colspan="2" | 2009 || colspan="2" | 2009 || colspan="2" | 2009 || colspan="2" | 2010
 
−
|- style="text-align: center;"
 
−
| colspan="2" | PDSOI || colspan="10" | Bulk
 
−
|- style="text-align: center;"
 
−
| colspan="12" | 300mm
 
−
|-
 
−
! Value !! [[45 nm]] Δ !! Value !! [[45 nm]] Δ !! Value !! [[40 nm]] Δ || Value !! [[40 nm]] Δ || Value !! [[40 nm]] Δ || Value !! [[45 nm]] Δ
 
−
|-
 
−
| 130 nm || 0.68x || 112.5 nm || 0.63x || 130 nm || 0.80x || 126 nm || 0.98x || 120 nm || 0.71x || 126 nm || 0.66x
 
−
|-
 
−
| ? nm || ?x || 112.5 nm || 0.70x || 100 nm || 0.83x || 100 nm || 0.85x || ? nm || ?x || 100 nm || ?x
 
−
|-
 
−
| 0.15 µm<sup>2</sup> || 0.41x || 0.148 µm<sup>2</sup> || 0.43x || 0.15 µm<sup>2</sup> || 0.62x || 0.149 µm<sup>2</sup> || ?x || 0.124 µm<sup>2</sup> || 0.64x || 0.157 µm<sup>2</sup> || 0.42x
 
−
|-
 
−
| || || 0.199 µm<sup>2</sup> || || || || || || || || ||
 
−
|-
 
−
| || || 0.171 µm<sup>2</sup>  || 0.45x || || || || || || || ||
 
−
|-
 
−
| 0.039 µm<sup>2</sup> || 0.58x
 
−
{{scrolling table/end}}
 
 
=== Design Rules ===
 
=== Design Rules ===
 
{| class="wikitable collapsible collapsed"
 
{| class="wikitable collapsible collapsed"
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! Layer !! Pitch !! Thick !! Aspect Ratio !! Image
 
! Layer !! Pitch !! Thick !! Aspect Ratio !! Image
 
|-
 
|-
−
| Isolation || 140 nm || 200 || - || rowspan="11" | [[file:intel 32nm design rules.png|750px]]
+
| Isolation || 140 nm || 200 || - || rowspan="12" | [[file:intel 32nm design rules.png|750px]]
 
|-
 
|-
 
| Contacted Gate ||  112.5 nm || 35 nm || --
 
| Contacted Gate ||  112.5 nm || 35 nm || --
Line 71: Line 171:
 
|-
 
|-
 
| Metal 9 || 19.4 µm || 8 µm || 1.5
 
| Metal 9 || 19.4 µm || 8 µm || 1.5
 +
|-
 +
| Bump || 145.9 µm || 25.5 µm || -
 
|}
 
|}
  
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== 32 nm Microarchitectures ==
 
== 32 nm Microarchitectures ==
 +
* AMD
 +
** {{amd|Bulldozer|l=arch}}
 +
** {{amd|Piledriver|l=arch}}
 +
* IBM
 +
** {{ibm|z12|l=arch}}
 
* Intel
 
* Intel
−
** {{intel|smicroarchitectures/saltwell|Saltwell}}
+
** {{intel|Saltwell|l=arch}}
−
** {{intel|microarchitectures/sandy_bridge|Sandy Bridge}}
+
** {{intel|Sandy Bridge|l=arch}}
−
** {{intel|microarchitectures/westmere|Westmere}}
+
** {{intel|Westmere|l=arch}}
−
* AMD
 
−
** {{amd|microarchitectures/bulldozer|Bulldozer}}
 
−
** {{amd|microarchitectures/piledriver|Piledriver}}
 
  
 
{{expand list}}
 
{{expand list}}
 +
 +
== Documents ==
 +
* [[:File:samsung foundry solution 28-32nm.pdf|Samsung foundry solution for 32 & 28 nm]]
  
 
== References ==
 
== References ==
−
* [[:File:samsung foundry solution 28-32nm.pdf|Samsung foundry solution for 32 & 28 nm]]
+
* Greene, B., et al. "High performance 32nm SOI CMOS with high-k/metal gate and 0.149 µm 2 SRAM and ultra low-k back end with eleven levels of copper." VLSI Technology, 2009 Symposium on. IEEE, 2009.
 +
* Jan, C-H., et al. "A 32nm SoC platform technology with 2 nd generation high-k/metal gate transistors optimized for ultra low power, high performance, and high density product applications." Electron Devices Meeting (IEDM), 2009 IEEE International. IEEE, 2009.
 +
* Wu, Shien-Yang, et al. "A 32nm CMOS low power SoC platform technology for foundry applications with functional high density SRAM." Electron Devices Meeting, 2007. IEDM 2007. IEEE International. IEEE, 2007.
 +
* Chen, X., et al. "A cost effective 32nm high-K/metal gate CMOS technology for low power applications with single-metal/gate-first process." VLSI Technology, 2008 Symposium on. IEEE, 2008.
 
* Diaz, C. H., et al. "32nm gate-first high-k/metal-gate technology for high performance low power applications." Electron Devices Meeting, 2008. IEDM 2008. IEEE International. IEEE, 2008.
 
* Diaz, C. H., et al. "32nm gate-first high-k/metal-gate technology for high performance low power applications." Electron Devices Meeting, 2008. IEDM 2008. IEEE International. IEEE, 2008.
 +
* Natarajan, S., et al. "A 32nm logic technology featuring 2 nd-generation high-k+ metal-gate transistors, enhanced channel strain and 0.171 μm 2 SRAM cell size in a 291Mb array." Electron Devices Meeting, 2008. IEDM 2008. IEEE International. IEEE, 2008.
 +
* Hasegawa, S., et al. "A cost-conscious 32nm CMOS platform technology with advanced single exposure lithography and gate-first metal gate/high-k process." Electron Devices Meeting, 2008. IEDM 2008. IEEE International. IEEE, 2008.
 +
* Arnaud, F., et al. "32nm general purpose bulk CMOS technology for high performance applications at low voltage." Electron Devices Meeting, 2008. IEDM 2008. IEEE International. IEEE, 2008.
 +
* Pilo, Harold, et al. "A 64 Mb SRAM in 32 nm high-k metal-gate SOI technology with 0.7 V operation enabled by stability, write-ability and read-ability enhancements." IEEE Journal of Solid-State Circuits 47.1 (2012): 97-106.
 +
 +
[[category:lithography]]

Latest revision as of 18:14, 8 July 2021

basic wafer drawing.svg Semiconductor lithography processes technology
v · d · e

The 32 nanometer (32 nm) lithography process is a full node semiconductor manufacturing process following the 40 nm process stopgap. Commercial integrated circuit manufacturing using 32 nm process began in 2010. This technology was superseded by the 28 nm process (HN) / 22 nm process (FN) in 2012.

Industry[edit]

TSMC cancelled its planned 32nm node process. Intel's 32 nm process became the first process to introduce the self-aligned via patterning.


 
Process Name
1st Production
Lithography Lithography
Immersion
Exposure
Wafer Type
Size
Transistor Type
Voltage
Metal Layers
 
Gate Length (Lg)
Contacted Gate Pitch (CPP)
Minimum Metal Pitch (MMP)
SRAM bitcell High-Perf (HP)
High-Density (HD)
Low-Voltage (LV)
DRAM bitcell eDRAM
Intel TSMC Common Platform Alliance
The Common Platform Alliance 20 nm node was a collaboration between IBM, Samsung, Freescale, Toshiba, Chartered Semiconductor Manufacturing, Infineon Technologies
Toshiba / NEC Common Platform Alliance (SOI)
IBM, Freescale, AMD
P1268 (CPU) / P1269 (SoC)        
2009   2011    
193 nm 193 nm 193 nm 193 nm 193 nm
Yes Yes Yes Yes Yes
DP DP DP DP DP
Bulk Bulk Bulk Bulk SOI
300 mm 300 mm 300 mm 300 mm 300 mm
Planar Planar Planar Planar Planar
1 V, 0.75 V 1.1 V 1 V, 0.8 V 1 V 1 V
9   11   11
Value 45 nm Δ Value 40 nm Δ Value 45 nm Δ Value 40 nm Δ Value 45 nm Δ
30 nm   30 nm   30 nm       25 nm  
112.5 nm 0.63x 130 nm   126 nm   120 nm   130 nm  
112.5 nm 0.70x 100 nm   100 nm   100 nm   100 nm  
0.199 µm²                  
0.148 µm²   0.15 µm²   0.157 µm²   0.124 µm²   0.149 µm²  
0.171 µm²                  
                0.039 µm²  

Design Rules[edit]

Find models[edit]

Click to browse all 32 nm MPU models

32 nm Microprocessors[edit]

This list is incomplete; you can help by expanding it.

32 nm Microarchitectures[edit]

This list is incomplete; you can help by expanding it.

Documents[edit]

References[edit]

  • Greene, B., et al. "High performance 32nm SOI CMOS with high-k/metal gate and 0.149 µm 2 SRAM and ultra low-k back end with eleven levels of copper." VLSI Technology, 2009 Symposium on. IEEE, 2009.
  • Jan, C-H., et al. "A 32nm SoC platform technology with 2 nd generation high-k/metal gate transistors optimized for ultra low power, high performance, and high density product applications." Electron Devices Meeting (IEDM), 2009 IEEE International. IEEE, 2009.
  • Wu, Shien-Yang, et al. "A 32nm CMOS low power SoC platform technology for foundry applications with functional high density SRAM." Electron Devices Meeting, 2007. IEDM 2007. IEEE International. IEEE, 2007.
  • Chen, X., et al. "A cost effective 32nm high-K/metal gate CMOS technology for low power applications with single-metal/gate-first process." VLSI Technology, 2008 Symposium on. IEEE, 2008.
  • Diaz, C. H., et al. "32nm gate-first high-k/metal-gate technology for high performance low power applications." Electron Devices Meeting, 2008. IEDM 2008. IEEE International. IEEE, 2008.
  • Natarajan, S., et al. "A 32nm logic technology featuring 2 nd-generation high-k+ metal-gate transistors, enhanced channel strain and 0.171 μm 2 SRAM cell size in a 291Mb array." Electron Devices Meeting, 2008. IEDM 2008. IEEE International. IEEE, 2008.
  • Hasegawa, S., et al. "A cost-conscious 32nm CMOS platform technology with advanced single exposure lithography and gate-first metal gate/high-k process." Electron Devices Meeting, 2008. IEDM 2008. IEEE International. IEEE, 2008.
  • Arnaud, F., et al. "32nm general purpose bulk CMOS technology for high performance applications at low voltage." Electron Devices Meeting, 2008. IEDM 2008. IEEE International. IEEE, 2008.
  • Pilo, Harold, et al. "A 64 Mb SRAM in 32 nm high-k metal-gate SOI technology with 0.7 V operation enabled by stability, write-ability and read-ability enhancements." IEEE Journal of Solid-State Circuits 47.1 (2012): 97-106.
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