Revision as of 20:27, 28 March 2017

Semiconductor lithography processes technology

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The 10 nanometer (10 nm) lithography process is a full node semiconductor manufacturing process following the 14 nm process stopgap. The term "10 nm" is simply a commercial name for a generation of a certain size and its technology, as opposed to gate length or half pitch. Commercial mass production of integrated circuit manufacturing using 10 nm process begun in late 2016. This technology is set to be replaced by 7 nm process 2019.

Industry

Preliminary Data! Information presented in this article deal with future products, data, features, and specifications that have yet to be finalized, announced, or released. Information may be incomplete and can change by final release.

Samsung

Samsung demonstrated their 128 Mebibit SRAM wafer from their 10nm FinFET process.

Samsung 128 Mib SRAM demo 10 nm wafer
Technology 10nm FinFET Supply voltage 1.8 V (i/o) Bit cell size 0.040 µm² macro configs 256x512 Kib Capacity 256 Mib Test Features Programmable E-fuse Die Size 75.6mm2²

10 nm Microprocessors

• MediaTek
  • Helio
• Qualcomm
  • Snapdragon 800
  • Centriq
• Xiaomi
  • Surge

This list is incomplete; you can help by expanding it.

10 nm Microarchitectures

• Intel
  • Cannonlake
  • Icelake
  • Tigerlake
• Qualcomm
  • Falkor

This list is incomplete; you can help by expanding it.

Documents

• Intel's 10 nm Technology: Delivering the Highest Logic Transistor Density in the Industry Through the Use of Hyper Scaling

References

• Cho, H-J., et al. "Si FinFET based 10nm technology with multi Vt gate stack for low power and high performance applications." VLSI Technology, 2016 IEEE Symposium on. IEEE, 2016.
• Song, Taejoong, et al. "A 10 nm FinFET 128 Mb SRAM With Assist Adjustment System for Power, Performance, and Area Optimization." IEEE Journal of Solid-State Circuits (2016).
• Intel data Based on a presentation by Mark Bohr, Intel