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Difference between revisions of "180 nm lithography process"
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Line 7: | Line 7: | ||
|Process Name | |Process Name | ||
|1st Production | |1st Production | ||
+ | |Wafer | ||
|Metal Layers | |Metal Layers | ||
| | | | ||
Line 20: | Line 21: | ||
|- style="text-align: center;" | |- style="text-align: center;" | ||
| colspan="2" | 1999 || colspan="2" | 2000 || colspan="2" | 2000 || colspan="2" | 2000 || colspan="2" | 1998 || colspan="2" | 2000 || colspan="2" | 2001 || colspan="2" | || colspan="2" | 2000 || colspan="2" | 1999 | | colspan="2" | 1999 || colspan="2" | 2000 || colspan="2" | 2000 || colspan="2" | 2000 || colspan="2" | 1998 || colspan="2" | 2000 || colspan="2" | 2001 || colspan="2" | || colspan="2" | 2000 || colspan="2" | 1999 | ||
+ | |- style="text-align: center;" | ||
+ | | colspan="22" | 200 mm | ||
|- style="text-align: center;" | |- style="text-align: center;" | ||
| colspan="2" | 7 || colspan="2" | 6 || colspan="2" | 6 || colspan="2" | 7 || colspan="2" | 7 || colspan="2" | || colspan="2" | || colspan="2" | 6 || colspan="2" | 5 || colspan="2" | | | colspan="2" | 7 || colspan="2" | 6 || colspan="2" | 6 || colspan="2" | 7 || colspan="2" | 7 || colspan="2" | || colspan="2" | || colspan="2" | 6 || colspan="2" | 5 || colspan="2" | | ||
Line 25: | Line 28: | ||
! Value !! [[250 nm]] Δ !! Value !! [[250 nm]] Δ !! Value !! [[250 nm]] Δ !! Value !! [[220 nm]] Δ !! Value !! [[250 nm]] Δ !! Value !! [[250 nm]] Δ !! Value !! [[250 nm]] Δ !! Value !! [[250 nm]] Δ !! Value !! [[250 nm]] Δ !! Value !! [[250 nm]] Δ | ! Value !! [[250 nm]] Δ !! Value !! [[250 nm]] Δ !! Value !! [[250 nm]] Δ !! Value !! [[220 nm]] Δ !! Value !! [[250 nm]] Δ !! Value !! [[250 nm]] Δ !! Value !! [[250 nm]] Δ !! Value !! [[250 nm]] Δ !! Value !! [[250 nm]] Δ !! Value !! [[250 nm]] Δ | ||
|- | |- | ||
− | | 480 nm || 0.96x || ? nm || ?x || | + | | 480 nm || 0.96x || ? nm || ?x || 430 nm || 0.67x || ? nm || ?x || 420 nm || ?x || ? nm || ?x || ? nm || ?x || ? nm || ?x || ? nm || ?x || ? nm || ?x |
|- | |- | ||
− | | 500 nm || 0.82x || ? nm || ?x || | + | | 500 nm || 0.82x || ? nm || ?x || 460 nm || 0.72x || ? nm || ?x || 440 nm || ?x || ? nm || ?x || ? nm || ?x || ? nm || ?x || ? nm || ?x || ? nm || ?x |
|- | |- | ||
| 5.59 µm<sup>2</sup> || 0.54x || 4.18 µm<sup>2</sup> || ?x || 4.65 µm<sup>2</sup> || 0.62x || ? µm<sup>2</sup> || ?x || ? µm<sup>2</sup> || ?x || ? µm<sup>2</sup> || ?x || ? µm<sup>2</sup> || ?x || ? µm<sup>2</sup> || ?x || ? µm<sup>2</sup> || ?x || ? µm<sup>2</sup> || ?x | | 5.59 µm<sup>2</sup> || 0.54x || 4.18 µm<sup>2</sup> || ?x || 4.65 µm<sup>2</sup> || 0.62x || ? µm<sup>2</sup> || ?x || ? µm<sup>2</sup> || ?x || ? µm<sup>2</sup> || ?x || ? µm<sup>2</sup> || ?x || ? µm<sup>2</sup> || ?x || ? µm<sup>2</sup> || ?x || ? µm<sup>2</sup> || ?x | ||
Line 34: | Line 37: | ||
== 180 nm Microprocessors== | == 180 nm Microprocessors== | ||
* AMD | * AMD | ||
− | + | {{collist | |
− | + | | count = 4 | |
− | + | | | |
− | + | * {{amd|K6-III}} | |
− | + | * {{amd|K6-2+}} | |
− | + | * {{amd|K6-III+}} | |
− | + | * {{amd|Athlon}} | |
− | + | * {{amd|Athlon 4}} | |
+ | * {{amd|Athlon MP}} | ||
+ | * {{amd|Athlon XP}} | ||
+ | * {{amd|Duron}} | ||
+ | }} | ||
* Cyrix | * Cyrix | ||
** {{cyrix|Cyrix III}} | ** {{cyrix|Cyrix III}} | ||
Line 50: | Line 57: | ||
* HAL (Fujitsu) | * HAL (Fujitsu) | ||
** {{hal|SPARC64 GP}} | ** {{hal|SPARC64 GP}} | ||
+ | * HiSilicon | ||
+ | ** {{hisil|K3}} | ||
* HP | * HP | ||
** {{hp|PA-8700}} | ** {{hp|PA-8700}} | ||
Line 55: | Line 64: | ||
* IBM | * IBM | ||
** {{ibm|RS64 IV}} | ** {{ibm|RS64 IV}} | ||
+ | ** {{ibm|z900}} | ||
* Intel | * Intel | ||
** {{intel|Itanium}} | ** {{intel|Itanium}} | ||
Line 60: | Line 70: | ||
** {{intel|Mobile Pentium III}} | ** {{intel|Mobile Pentium III}} | ||
** {{intel|Pentium 4}} | ** {{intel|Pentium 4}} | ||
+ | * Loongson | ||
+ | ** {{loongson|Godson 2}} | ||
* Motorola | * Motorola | ||
** {{motorola|PowerPC}} | ** {{motorola|PowerPC}} | ||
+ | * Qualcomm | ||
+ | ** {{qualcomm|MSM6xxx}} | ||
* Rapport | * Rapport | ||
** {{rapport|Kilocore}} ({{cmu|PipeRench}}) | ** {{rapport|Kilocore}} ({{cmu|PipeRench}}) | ||
Line 67: | Line 81: | ||
** {{sun|UltraSPARC IIi}} | ** {{sun|UltraSPARC IIi}} | ||
** {{sun|UltraSPARC IIe}} | ** {{sun|UltraSPARC IIe}} | ||
+ | * STMicroelectronics | ||
+ | ** STM32 F0 | ||
{{expand list}} | {{expand list}} | ||
== 180 nm Microarchitectures == | == 180 nm Microarchitectures == | ||
* AMD | * AMD | ||
− | ** {{amd| | + | ** {{amd|K6-III|l=arch}} |
− | ** {{amd| | + | ** {{amd|K7|l=arch}} |
+ | * ARM | ||
+ | ** {{armh|ARM7|l=arch}} | ||
+ | * IBM | ||
+ | ** {{ibm|z900|l=arch}} | ||
* Intel | * Intel | ||
− | ** {{intel| | + | ** {{intel|NetBurst|l=arch}} |
{{expand list}} | {{expand list}} | ||
+ | |||
+ | [[category:lithography]] |
Latest revision as of 02:04, 17 August 2023
The 180 nanometer (180 nm) lithography process is a full node semiconductor manufacturing process following the 220 nm process stopgap. Commercial integrated circuit manufacturing using 180 nm process began in late 1998. This technology was replaced by with 150 nm process (HN) in 2000 and 130 nm process (FN) in 2001.
Industry[edit]
The 180 nm process was first to use Cu metalization as a replacement for Al for interconnects.
Fab |
---|
Process Name |
1st Production |
Wafer |
Metal Layers |
|
Contacted Gate Pitch |
Interconnect Pitch (M1P) |
SRAM bit cell |
Intel | Fujitsu | TSMC | Motorola | IBM | NEC | Samsung | TI | TI | AMD | ||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
P858 | CS-80 | HiPerMOS 6 | CMOS-8S3 | C07a | GS30 | ||||||||||||||||
1999 | 2000 | 2000 | 2000 | 1998 | 2000 | 2001 | 2000 | 1999 | |||||||||||||
200 mm | |||||||||||||||||||||
7 | 6 | 6 | 7 | 7 | 6 | 5 | |||||||||||||||
Value | 250 nm Δ | Value | 250 nm Δ | Value | 250 nm Δ | Value | 220 nm Δ | Value | 250 nm Δ | Value | 250 nm Δ | Value | 250 nm Δ | Value | 250 nm Δ | Value | 250 nm Δ | Value | 250 nm Δ | ||
480 nm | 0.96x | ? nm | ?x | 430 nm | 0.67x | ? nm | ?x | 420 nm | ?x | ? nm | ?x | ? nm | ?x | ? nm | ?x | ? nm | ?x | ? nm | ?x | ||
500 nm | 0.82x | ? nm | ?x | 460 nm | 0.72x | ? nm | ?x | 440 nm | ?x | ? nm | ?x | ? nm | ?x | ? nm | ?x | ? nm | ?x | ? nm | ?x | ||
5.59 µm2 | 0.54x | 4.18 µm2 | ?x | 4.65 µm2 | 0.62x | ? µm2 | ?x | ? µm2 | ?x | ? µm2 | ?x | ? µm2 | ?x | ? µm2 | ?x | ? µm2 | ?x | ? µm2 | ?x |
180 nm Microprocessors[edit]
- AMD
- Cyrix
- DEC
- HAL (Fujitsu)
- HiSilicon
- HP
- IBM
- Intel
- Loongson
- Motorola
- Qualcomm
- Rapport
- Sun
- STMicroelectronics
- STM32 F0
This list is incomplete; you can help by expanding it.
180 nm Microarchitectures[edit]
This list is incomplete; you can help by expanding it.