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Difference between revisions of "45 nm lithography process"
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{{Lithography processes}} | {{Lithography processes}} | ||
The '''45 nm lithography process''' is a [[technology node|full node]] semiconductor manufacturing process following the [[55 nm lithography process|55 nm process]] stopgap. Commercial [[integrated circuit]] manufacturing using 45 nm process began in 2007. This technology was superseded by the [[40 nm lithography process|40 nm process]] (HN) / [[32 nm lithography process|32 nm process]] (FN) in 2010. | The '''45 nm lithography process''' is a [[technology node|full node]] semiconductor manufacturing process following the [[55 nm lithography process|55 nm process]] stopgap. Commercial [[integrated circuit]] manufacturing using 45 nm process began in 2007. This technology was superseded by the [[40 nm lithography process|40 nm process]] (HN) / [[32 nm lithography process|32 nm process]] (FN) in 2010. | ||
+ | |||
+ | == Industry == | ||
+ | |||
+ | === Intel === | ||
+ | {| class="wikitable" | ||
+ | |- | ||
+ | | || Measurement || Scaling from [[65 nm]] | ||
+ | |- | ||
+ | | Contacted Gate Pitch || 180 nm || 0.82x | ||
+ | |- | ||
+ | | Interconnect Pitch (M1P) || 160 nm || 0.76x | ||
+ | |- | ||
+ | | [[SRAM]] bit cell || 0.346 µm<sup>2</sup> || 0.61x | ||
+ | |} | ||
== 45 nm Microprocessors== | == 45 nm Microprocessors== |
Revision as of 18:50, 23 April 2016
The 45 nm lithography process is a full node semiconductor manufacturing process following the 55 nm process stopgap. Commercial integrated circuit manufacturing using 45 nm process began in 2007. This technology was superseded by the 40 nm process (HN) / 32 nm process (FN) in 2010.
Contents
Industry
Intel
Measurement | Scaling from 65 nm | |
Contacted Gate Pitch | 180 nm | 0.82x |
Interconnect Pitch (M1P) | 160 nm | 0.76x |
SRAM bit cell | 0.346 µm2 | 0.61x |
45 nm Microprocessors
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45 nm System on Chips
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45 nm Microarchitectures
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