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Difference between revisions of "3 nm lithography process"
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{{lithography processes}} | {{lithography processes}} | ||
| − | The '''3 nanometer (3 nm or 30 Å) lithography process''' is a [[technology node]] semiconductor manufacturing process following the [[5 nm lithography process|5 nm process]] node. Commercial [[integrated circuit]] manufacturing using 3 nm process is set to begin | + | The '''3 nanometer (3 nm or 30 Å) lithography process''' is a [[technology node]] semiconductor manufacturing process following the [[5 nm lithography process|5 nm process]] node. Commercial [[integrated circuit]] manufacturing using 3 nm process is set to begin some time around 2023. |
The term "3 nm" is simply a commercial name for a generation of a certain size and its technology, and '''does not''' represent any geometry of the transistor. | The term "3 nm" is simply a commercial name for a generation of a certain size and its technology, and '''does not''' represent any geometry of the transistor. | ||
| Line 11: | Line 11: | ||
<!-- Intel --> | <!-- Intel --> | ||
| process 1 fab = [[Intel]] | | process 1 fab = [[Intel]] | ||
| − | | process 1 name = | + | | process 1 name = P1278 (CPU), P1279? (SoC) |
| − | | process 1 date = | + | | process 1 date = 2H 2023 |
| process 1 lith = EUV | | process 1 lith = EUV | ||
| process 1 immersion = | | process 1 immersion = | ||
| process 1 exposure = SE | | process 1 exposure = SE | ||
| process 1 wafer type = Bulk | | process 1 wafer type = Bulk | ||
| − | | process 1 wafer size = 300 | + | | process 1 wafer size = 300 mm |
| − | | process 1 transistor = | + | | process 1 transistor = FinFET |
| process 1 volt = | | process 1 volt = | ||
| process 1 delta from = [[5 nm]] Δ | | process 1 delta from = [[5 nm]] Δ | ||
| Line 43: | Line 43: | ||
<!-- TSMC --> | <!-- TSMC --> | ||
| process 2 fab = [[TSMC]] | | process 2 fab = [[TSMC]] | ||
| − | | process 2 name = | + | | process 2 name = N3, N3E <info>N3 Enhanced</info> |
| − | | process 2 date = | + | | process 2 date = 2H 2022 |
| process 2 lith = EUV | | process 2 lith = EUV | ||
| process 2 immersion = | | process 2 immersion = | ||
| process 2 exposure = SE | | process 2 exposure = SE | ||
| process 2 wafer type = Bulk | | process 2 wafer type = Bulk | ||
| − | | process 2 wafer size = 300 | + | | process 2 wafer size = 300 mm |
| − | | process 2 transistor = | + | | process 2 transistor = FinFET |
| process 2 volt = | | process 2 volt = | ||
| process 2 delta from = [[5 nm]] Δ | | process 2 delta from = [[5 nm]] Δ | ||
| Line 75: | Line 75: | ||
<!-- Samsung --> | <!-- Samsung --> | ||
| process 4 fab = [[Samsung]] | | process 4 fab = [[Samsung]] | ||
| − | | process 4 name = | + | | process 4 name = 3GAE<info>3nm Gate All Around Early</info>, 3GAP<info>3nm Gate All Around |
| + | | process 1 date = 1H 2022 | ||
| + | Plus</info> | ||
| process 4 date = | | process 4 date = | ||
| process 4 lith = EUV | | process 4 lith = EUV | ||
| Line 81: | Line 83: | ||
| process 4 exposure = SE | | process 4 exposure = SE | ||
| process 4 wafer type = Bulk | | process 4 wafer type = Bulk | ||
| − | | process 4 wafer size = 300 | + | | process 4 wafer size = 300 mm |
| process 4 transistor = GAA | | process 4 transistor = GAA | ||
| process 4 volt = | | process 4 volt = | ||
| Line 106: | Line 108: | ||
| process 4 dram Δ = | | process 4 dram Δ = | ||
}} | }} | ||
| − | + | ==== P1278 ==== | |
| + | Intel's 5-nanometer (renamed as Intel 20A) process node is expected to ramp around the 2H2024/2025 timeframe. | ||
=== Samsung === | === Samsung === | ||
On May 24 2017 Samsung announced they will be switching to a transistor they call ''Multi-Bridge-Channel FET'' (''MBCFET''), an extension of a [[Gate-all-around]] (GAA) FET. This is planned for somewhere after the 5nm node but the exact timeline or specification is currently unknown. | On May 24 2017 Samsung announced they will be switching to a transistor they call ''Multi-Bridge-Channel FET'' (''MBCFET''), an extension of a [[Gate-all-around]] (GAA) FET. This is planned for somewhere after the 5nm node but the exact timeline or specification is currently unknown. | ||
| + | |||
| + | === TSMC === | ||
| + | N3 technology will offer up to 70% logic density gain, up to 15% speed improvement at the same power and up to 30% power reduction at the same speed as compared with N5 technology (According to TSMCs website). If this holds true we could see 300+ MT/mm2. | ||
== 3 nm Microprocessors== | == 3 nm Microprocessors== | ||
| + | * Apple | ||
| + | ** {{apple|A17 Pro}} | ||
| + | * Apple | ||
| + | ** {{apple|M3}} | ||
| + | * Apple | ||
| + | ** {{apple|M3 Pro}} | ||
| + | * Apple | ||
| + | ** {{apple|M3 MAX}} | ||
{{expand list}} | {{expand list}} | ||
Latest revision as of 00:53, 18 September 2024
Semiconductor lithography processes technology
The 3 nanometer (3 nm or 30 Å) lithography process is a technology node semiconductor manufacturing process following the 5 nm process node. Commercial integrated circuit manufacturing using 3 nm process is set to begin some time around 2023.
The term "3 nm" is simply a commercial name for a generation of a certain size and its technology, and does not represent any geometry of the transistor.
Contents
Industry[edit]
 |
Preliminary Data! Information presented in this article deal with future products, data, features, and specifications that have yet to be finalized, announced, or released. Information may be incomplete and can change by final release. |
| Process Name | |
|---|---|
| 1st Production | |
| Lithography | Lithography |
| Immersion | |
| Exposure | |
| Wafer | Type |
| Size | |
| Transistor | Type |
| Voltage | |
| Fin | Pitch |
| Width | |
| Height | |
| Gate Length (Lg) | |
| Contacted Gate Pitch (CPP) | |
| Minimum Metal Pitch (MMP) | |
| SRAM bitcell | High-Perf (HP) |
| High-Density (HD) | |
| Low-Voltage (LV) | |
| DRAM bitcell | eDRAM |
| Intel | TSMC | Samsung | |||
|---|---|---|---|---|---|
| P1278 (CPU), P1279? (SoC) | N3, N3E N3 Enhanced |
3GAE 3nm Gate All Around Early , 3GAP3nm Gate All Around
| process 1 date = 1H 2022Plus | |||
| 2H 2023 | 2H 2022 | ||||
| EUV | EUV | EUV | |||
| SE | SE | SE | |||
| Bulk | Bulk | Bulk | |||
| 300 mm | 300 mm | 300 mm | |||
| FinFET | FinFET | GAA | |||
| Value | 5 nm Δ | Value | 5 nm Δ | Value | 5 nm Δ |
| N/A | |||||
P1278[edit]
Intel's 5-nanometer (renamed as Intel 20A) process node is expected to ramp around the 2H2024/2025 timeframe.
Samsung[edit]
On May 24 2017 Samsung announced they will be switching to a transistor they call Multi-Bridge-Channel FET (MBCFET), an extension of a Gate-all-around (GAA) FET. This is planned for somewhere after the 5nm node but the exact timeline or specification is currently unknown.
TSMC[edit]
N3 technology will offer up to 70% logic density gain, up to 15% speed improvement at the same power and up to 30% power reduction at the same speed as compared with N5 technology (According to TSMCs website). If this holds true we could see 300+ MT/mm2.
3 nm Microprocessors[edit]
This list is incomplete; you can help by expanding it.
3 nm Microarchitectures[edit]
This list is incomplete; you can help by expanding it.
References[edit]
- Kinam Kim, President of Semiconductor Business, announced MBCFET for the node after 5 nm, May 24, 2017