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Dimensity - MediaTek
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MediaTek Dimensity
Developer MediaTek, Arm Holdings
Manufacturer TSMC
Type System on chips
Introduction November 26, 2019 (announced)
Architecture Multicore 64-bit ARM SoCs
ISA ARMv8
µarch Cortex-A55, Cortex-A76, Cortex-A77, Cortex-A78
Word size 64 bit
8 octets
16 nibbles
Process 7 nm
0.007 μm
7.0e-6 mm
, 6 nm
0.006 μm
6.0e-6 mm
Technology CMOS
← →
Helio
Genio 		Kompanio

Dimensity is a family of 64-bit multi-core ARM system on chips developed by MediaTek announced in 2019, serving as a sucessor to the Helio family.

Dimensity is MediaTek's flagship family of SoCs presenting their highest-performance and largest selection of features.

Overview[edit]

Dimensity is the successor to Helio, a family of high-performance mobile SoCs first announced in late 2019.

MediaTek Dimensity Series[edit]

• ARMv8.2-A
  • Dimensity 700 Series
  • Dimensity 800 Series
  • Dimensity 900 Series
  • Dimensity 1000 Series
  • Dimensity 6000 Series
  • Dimensity 7000 Series
  • Dimensity 8000 Series
  • Dimensity 9000 Series
  • Dimensity 700 (MT6833/G/V) • 7nm (TSMC N7) • Q1 2021
2× Cortex-A76 @2.2GHz + 6× Cortex-A55 @2.0GHz
Mali-G57 MC2 @950MHz (121.6 GFLOPS in FP32)
  • Dimensity 720 (MT6853V/Z/N) • Q3 2020
2× Cortex-A76 @2.0GHz + 6× Cortex-A55 @2.0GHz
Mali-G57 MC3 @730MHz (140.2 GFLOPS in FP32)
4× Cortex-A76 @2.0GHz + 4× Cortex-A55 @2.0GHz
Mali-G57 MC4 @748MHz (191.5 GFLOPS in FP32)
  • Dimensity 800U (MT6853T/V) • Q3 2020
2× Cortex-A76 @2.4GHz + 6× Cortex-A55 @2.0GHz
Mali-G57 MC3 @950MHz (182.4 GFLOPS in FP32)
  • Dimensity 810 (MT6833P/GP/V) • 6nm (TSMC N6) • Q3 2021
2× Cortex-A76 @2.4GHz + 6× Cortex-A55 @2.0GHz
Mali-G57 MC2 @1068MHz (136.7 GFLOPS in FP32)
  • Dimensity 820 (MT6875) • 7nm (TSMC N7) • Q2 2020
4× Cortex-A76 @2.6GHz + 4× Cortex-A55 @2.0GHz
Mali-G57 MC5 @900MHz (288 GFLOPS in FP32)
  • Dimensity 900 (MT6877/V) • 6nm (TSMC N6) • Q2 2021
2× Cortex-A78 @2.4GHz + 6× Cortex-A55 @2.0GHz
Mali-G68 MC4 @900MHz (230.4 GFLOPS in FP32)
  • Dimensity 920 (MT6877/T/V/TZA) • Q3 2021
2× Cortex-A78 @2.5GHz + 6× Cortex-A55 @2.0GHz
Mali-G68 MC4 @950MHz (243.2 GFLOPS in FP32)
  • Dimensity 930 (MT6855 MT6855V/AZA) • Q3 2022
2× Cortex-A78 @2.2GHz + 6× Cortex-A55 @2.0GHz
IMG BXM-8-256 @950MHz • 108MP Single Camera
4× Cortex-A77 @2.6GHz + 4× Cortex-A55 @2.0GHz
Mali-G77 MC9 @836MHz (481.5 GFLOPS in FP32)
  • Dimensity 1000+ (MT6889Z/CZA) • Q2 2020
  • Dimensity 1000C (MT6883Z/CZA) • Q3 2020
4× Cortex-A77 @2.0GHz + 4× Cortex-A55 @2.0GHz
Mali-G57 MC5 @654MHz (209.3 GFLOPS in FP32)
4× Cortex-A77 @2.2GHz + 4× Cortex-A55 @2.0GHz
Mali-G77 MC7 @695MHz (311.4 GFLOPS in FP32)
  • Dimensity 1050 (MT6879/V/ZA) • 6nm (TSMC N6) • Q3 2022
2× Cortex-A78 @2.5GHz + 6× Cortex-A55 @2.0GHz
Mali-G610 MC3 @1.0GHz (384 GFLOPS in FP32)
  • Dimensity 1080 (MT6877/V) • Q4 2022
2× Cortex-A78 @2.6GHz + 6× Cortex-A55 @2.0GHz
Mali-G68 MC4 @950MHz (243.2 GFLOPS in FP32)
  • Dimensity 1100 (MT6891/Z) • Q1 2021
4× Cortex-A78 @2.6GHz + 4× Cortex-A55 @2.0GHz
Mali-G77 MC9 @836MHz (481.5 GFLOPS in FP32)
  • Dimensity 1200 (MT6893/Z) •
1× Cortex-A78 @3.0GHz + 3× Cortex-A78 @2.6GHz +
4× Cortex-A55 @2.0GHz
Mali-G77 MC9 @886MHz (510.3 GFLOPS in FP32)
  • Dimensity 1300 (MT6893Z_Z/_T/CZA) • Q2 2022
1× Cortex-A78 @3.0GHz + 3× Cortex-A78 @2.6GHz +
4× Cortex-A55 @2.0GHz
Mali-G77 MC9 @886MHz (510.3 GFLOPS in FP32)

Models[edit]

 List of Dimensity Processors
 Main processorGraphics
ModelPart numberProcessCoresCPUFrequencyLaunchedGPUFrequency
1000MT68897 nm
0.007 μm
7.0e-6 mm
8Cortex-A77,  Cortex-A552.6 GHz
2,600 MHz
2,600,000 kHz
,  2 GHz
2,000 MHz
2,000,000 kHz
2020Mali-G77
1000LMT6885Z7 nm
0.007 μm
7.0e-6 mm
8Cortex-A77,  Cortex-A552.2 GHz
2,200 MHz
2,200,000 kHz
,  2 GHz
2,000 MHz
2,000,000 kHz
2020Mali-G77
8007 nm
0.007 μm
7.0e-6 mm
8Cortex-A76,  Cortex-A552 GHz
2,000 MHz
2,000,000 kHz
March 2020Mali-G57
Count: 3

Dimensity 9000 Series[edit]

Model number ISA Fab
node 		CPU (Cores/Freq) GPU Memory APU ISP Wireless radio Released
Dimensity 9000
(MT6983 [1]
MT6983Z/CZA
MT8798
MT8798Z/CNZA) 		ARM
v9-A
(64-bit) 		4 nm
(TSMC
N4) 		1× Cortex-X2 @3.05GHz
3× Cortex-A710 @2.85GHz
4× Cortex-A510 @1.8GHz 		Mali-G710 MC10
@848MHz (1085.4
GFLOPS) 		4× 16-bit (64-bit)
LPDDR5-6400
@3200MHz
(51.2GB/s)
LPDDR5X-7500
@3750MHz
(60.0GB/s) 		MediaTek
NPU 590 		MediaTek
Imagiq 790
Photo: 320MP
Video: 4K
(HDR) 		5G NR Sub-6GHz,
4G LTE,
tri-band GNSS,
Bluetooth 5.3,
Wi-Fi 6E (2x2) 		Q4 2021 [2]
Dimensity 9000+
(MT6983 [3]
MT6983W/CZA
MT8798
MT8798Z/TNZA) 		1× Cortex-X2 @3.2GHz
3× Cortex-A710 @2.85GHz
4× Cortex-A510 @1.8GHz 		Mali-G710 MC10
@848/950MHz
(1085.4/1216
GFLOPS) 		Q2 2022 [4]
Dimensity 9200
(MT6985 [5]
MT6985W/CZA) 		4 nm
(TSMC
N4P) 		1× Cortex-X3 @3.05GHz
3× Cortex-A715 @2.85GHz
4× Cortex-A510 @1.8GHz 		Immortalis-G715
MC11 @981MHz
(2762.5 GFLOPS) 		4× 16-bit (64-bit)
LPDDR5X-8533
@4266.5MHz
(68.2GB/s) 		MediaTek
NPU 690 		MediaTek
Imagiq 890
Photo: 320MP
Video: 8K30,
4K60 (HDR) 		5G NR Sub-6GHz
&mmWave,4G LTE,
quad-band GNSS,
Bluetooth 5.3,
Wi-Fi 7 (2x2) 		Q4 2022 [6]
Dimensity 9200+
(MT6985 [7]
MT6985W/TCZA) 		1× Cortex-X3 @3.35GHz
3× Cortex-A715 @3.0GHz
4× Cortex-A510 @2.0GHz 		Immortalis-G715
MC11 @981MHz/
1.15GHz (2762.5/
3238.4 GFLOPS) 		Q2 2023 [8]
Dimensity 9300
(MT6989 [9]
MT6989W/CZA
MT8796 [10]
MT8796W/CNZA) 		ARM
v9.2-A
(64-bit) 		4 nm
(TSMC
N4P) 		1× Cortex-X4 @3.25GHz
3× Cortex-X4 @2.85GHz
4× Cortex-A720 @2.0GHz 		Immortalis-G720
MC12 @1300MHz
(3993.6 GFLOPS) 		4× 16-bit (64-bit)
LPDDR5T-9600
@4800MHz
(76.8GB/s) 		MediaTek
NPU 790 		MediaTek
Imagiq 990
Photo: 320MP
Video: 8K30,
4K60 (HDR) 		5G NR Sub-6GHz
&mmWave,4G LTE,
quad-band GNSS,
Bluetooth 5.4,
Wi-Fi 7 (2x2) 		Q4 2023 [11]
Dimensity 9300+
(MT6989 [12]
MT6989W/TCZA) 		1× Cortex-X4 @3.4GHz
3× Cortex-X4 @2.85GHz
4× Cortex-A720 @2.0GHz 		Q2 2024 [13]
Dimensity 9400
(MT6991 [14]
MT6991Z/CZA
MT6991W/CZA) 		3 nm
(TSMC
N3E) 		1× Cortex-X925 @3.62GHz
3× Cortex-X4 @3.3GHz
4× Cortex-A720 @2.4GHz 		Immortalis-G925
MC12 @1612MHz
(4952.1 GFLOPS) 		4× 16-bit (64-bit)
LPDDR5X-10667
@5333.5MHz
(85.3GB/s) 		MediaTek
NPU 890 		MediaTek
Imagiq 1090
Photo: 320MP
Video: 8K60
(HDR) 		5G NR Sub-6GHz,
4G LTE, quad-
band GNSS,
Bluetooth 6.0,
Wi-Fi 7 (3x3/5x4) 		Q4 2024 [15]
Dimensity 9400+
(MT6991 [16]
MT6991Z/TCZA) 		1× Cortex-X925 @3.73GHz
3× Cortex-X4 @3.3GHz
4× Cortex-A720 @2.4GHz 		Q2 2025 [17]
Dimensity 9450
Dimensity 9500
(MT6992) [18] 		ARM
v9.2-A
(64-bit) 		3 nm
(TSMC
N3P) 		1× Cortex-X930 @4.2GHz
3× Cortex-X930 @3.6GHz
4× Cortex-A730 @2.8GHz 		Immortalis-G930
MC16 (Drage) 		4× 16-bit (64-bit)
LPDDR5X-10667 		MediaTek
NPU 890 		MediaTek
Imagiq 1090
Photo: 320MP
Video: 8K60
(HDR) 		5G NR Sub-6GHz,
4G LTE, quad-
band GNSS,
Bluetooth 6.0,
Wi-Fi 7 		Q2 2025

See also[edit]

References[edit]

  1. ↑ MediaTek Dimensity 9000.
  2. ↑ MediaTek Officially Launches Dimensity 9000 Flagship Chip And Announces Adoption by Global Device Makers.
  3. ↑ MediaTek Dimensity 9000+.
  4. ↑ MediaTek Expands Flagship Smartphone Performance with the Dimensity 9000+.
  5. ↑ MediaTek Dimensity 9200.
  6. ↑ MediaTek Launches Flagship Dimensity 9200 Chipset for Incredible Performance and Unmatched Power Savings.
  7. ↑ MediaTek Dimensity 9200+.
  8. ↑ MediaTek Pushes Flagship Smartphone Performance Further with the Dimensity 9200+.
  9. ↑ MediaTek Dimensity 9300.
  10. ↑ MediaTek Dimensity 9300 (N4P) Transistor Characterization | TechInsights.
  11. ↑ MediaTek's New All Big Core Design for Flagship Dimensity 9300 Chipset Maximizes Smartphone Performance and Efficiency.
  12. ↑ MediaTek Dimensity 9300+.
  13. ↑ MediaTek Boosts Flagship Smartphone Performance with Dimensity 9300+ SoC.
  14. ↑ MediaTek Dimensity 9400.
  15. ↑ MediaTek’s Dimensity 9400 Flagship SoC Offers Extreme Performance and Efficiency for the Latest AI Experiences.
  16. ↑ MediaTek Dimensity 9400+.
  17. ↑ MediaTek Enhances Flagship AI Performance with Dimensity 9400+ Mobile Platform.
  18. ↑ MediaTek Dimensity 9500.
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Facts about "Dimensity - MediaTek"
RDF feed
designerMediaTek + and Arm Holdings +
first announcedNovember 26, 2019 +
full page namemediatek/dimensity +
instance ofsystem on a chip family +
instruction set architectureARMv8 +
main designerMediaTek +
manufacturerTSMC +
microarchitectureCortex-A55 +, Cortex-A76 +, Cortex-A77 + and Cortex-A78 +
nameMediaTek Dimensity +
process7 nm (0.007 μm, 7.0e-6 mm) + and 6 nm (0.006 μm, 6.0e-6 mm) +
technologyCMOS +
word size64 bit (8 octets, 16 nibbles) +