Dimensity - MediaTek

MediaTek Dimensity

Developer	MediaTek, Arm Holdings
Manufacturer	TSMC
Type	System on chips
Introduction	November 26, 2019 (announced)
Architecture	Multicore 64-bit ARM SoCs
ISA	ARMv8
µarch	Cortex-A55, Cortex-A76, Cortex-A77, Cortex-A78
Word size	64 bit 8 octets 16 nibbles
Process	7 nm 0.007 μm 7.0e-6 mm , 6 nm 0.006 μm 6.0e-6 mm
Technology	CMOS
←	→
Helio Genio	Kompanio

Dimensity is a family of 64-bit multi-core ARM system on chips developed by MediaTek announced in 2019, serving as a sucessor to the Helio family.

Dimensity is MediaTek's flagship family of SoCs presenting their highest-performance and largest selection of features.

Overview[edit]

Dimensity is the successor to Helio, a family of high-performance mobile SoCs first announced in late 2019.

MediaTek Dimensity Series[edit]

• ARMv8.2-A

Dimensity 700 Series
Dimensity 800 Series
Dimensity 900 Series
Dimensity 1000 Series

Dimensity 6000 Series
Dimensity 7000 Series
Dimensity 8000 Series
Dimensity 9000 Series

Dimensity 700 (MT6833/G/V) • 7nm (TSMC N7) • Q1 2021

2× Cortex-A76 @2.2GHz + 6× Cortex-A55 @2.0GHz

Mali-G57 MC2 @950MHz (121.6 GFLOPS in FP32)

Dimensity 720 (MT6853V/Z/N) • Q3 2020

2× Cortex-A76 @2.0GHz + 6× Cortex-A55 @2.0GHz

Mali-G57 MC3 @730MHz (140.2 GFLOPS in FP32)

Dimensity 800 (MT6873) • 7nm (TSMC N7) • Q2 2020

4× Cortex-A76 @2.0GHz + 4× Cortex-A55 @2.0GHz

Mali-G57 MC4 @748MHz (191.5 GFLOPS in FP32)

Dimensity 800U (MT6853T/V) • Q3 2020

2× Cortex-A76 @2.4GHz + 6× Cortex-A55 @2.0GHz

Mali-G57 MC3 @950MHz (182.4 GFLOPS in FP32)

Dimensity 810 (MT6833P/GP/V) • 6nm (TSMC N6) • Q3 2021

2× Cortex-A76 @2.4GHz + 6× Cortex-A55 @2.0GHz

Mali-G57 MC2 @1068MHz (136.7 GFLOPS in FP32)

Dimensity 820 (MT6875) • 7nm (TSMC N7) • Q2 2020

4× Cortex-A76 @2.6GHz + 4× Cortex-A55 @2.0GHz

Mali-G57 MC5 @900MHz (288 GFLOPS in FP32)

Dimensity 900 (MT6877/V) • 6nm (TSMC N6) • Q2 2021

2× Cortex-A78 @2.4GHz + 6× Cortex-A55 @2.0GHz

Mali-G68 MC4 @900MHz (230.4 GFLOPS in FP32)

Dimensity 920 (MT6877/T/V/TZA) • Q3 2021

2× Cortex-A78 @2.5GHz + 6× Cortex-A55 @2.0GHz

Mali-G68 MC4 @950MHz (243.2 GFLOPS in FP32)

Dimensity 930 (MT6855 MT6855V/AZA) • Q3 2022

2× Cortex-A78 @2.2GHz + 6× Cortex-A55 @2.0GHz

IMG BXM-8-256 @950MHz • 108MP Single Camera

Dimensity 1000 (MT6889) • 7nm (TSMC N7) • Q2 2020

4× Cortex-A77 @2.6GHz + 4× Cortex-A55 @2.0GHz

Mali-G77 MC9 @836MHz (481.5 GFLOPS in FP32)

Dimensity 1000+ (MT6889Z/CZA) • Q2 2020
Dimensity 1000C (MT6883Z/CZA) • Q3 2020

4× Cortex-A77 @2.0GHz + 4× Cortex-A55 @2.0GHz

Mali-G57 MC5 @654MHz (209.3 GFLOPS in FP32)

Dimensity 1000L (MT6885Z/CZA) • Q1 2020

4× Cortex-A77 @2.2GHz + 4× Cortex-A55 @2.0GHz

Mali-G77 MC7 @695MHz (311.4 GFLOPS in FP32)

Dimensity 1050 (MT6879/V/ZA) • 6nm (TSMC N6) • Q3 2022

2× Cortex-A78 @2.5GHz + 6× Cortex-A55 @2.0GHz

Mali-G610 MC3 @1.0GHz (384 GFLOPS in FP32)

Dimensity 1080 (MT6877/V) • Q4 2022

2× Cortex-A78 @2.6GHz + 6× Cortex-A55 @2.0GHz

Mali-G68 MC4 @950MHz (243.2 GFLOPS in FP32)

Dimensity 1100 (MT6891/Z) • Q1 2021

4× Cortex-A78 @2.6GHz + 4× Cortex-A55 @2.0GHz

Mali-G77 MC9 @836MHz (481.5 GFLOPS in FP32)

Dimensity 1200 (MT6893/Z) •

1× Cortex-A78 @3.0GHz + 3× Cortex-A78 @2.6GHz +

4× Cortex-A55 @2.0GHz

Mali-G77 MC9 @886MHz (510.3 GFLOPS in FP32)

Dimensity 1300 (MT6893Z_Z/_T/CZA) • Q2 2022

1× Cortex-A78 @3.0GHz + 3× Cortex-A78 @2.6GHz +

4× Cortex-A55 @2.0GHz

Mali-G77 MC9 @886MHz (510.3 GFLOPS in FP32)

Models[edit]

	List of Dimensity Processors
	Main processor						Graphics
Model	Part number	Process	Cores	CPU	Frequency	Launched	GPU	Frequency
1000	MT6889	7 nm 0.007 μm 7.0e-6 mm	8	Cortex-A77, Cortex-A55	2.6 GHz 2,600 MHz 2,600,000 kHz , 2 GHz 2,000 MHz 2,000,000 kHz	2020	Mali-G77
1000L	MT6885Z	7 nm 0.007 μm 7.0e-6 mm	8	Cortex-A77, Cortex-A55	2.2 GHz 2,200 MHz 2,200,000 kHz , 2 GHz 2,000 MHz 2,000,000 kHz	2020	Mali-G77
800		7 nm 0.007 μm 7.0e-6 mm	8	Cortex-A76, Cortex-A55	2 GHz 2,000 MHz 2,000,000 kHz	March 2020	Mali-G57
Count: 3

Dimensity 9000 Series[edit]

Model number	ISA	Fab node	CPU (Cores/Freq)	GPU	Memory	APU	ISP	Wireless radio	Released
Dimensity 9000 (MT6983 ^[1] MT6983Z/CZA MT8798 MT8798Z/CNZA)	ARM v9-A (64-bit)	4 nm (TSMC N4)	1× Cortex-X2 @3.05GHz 3× Cortex-A710 @2.85GHz 4× Cortex-A510 @1.8GHz	Mali-G710 MC10 @848MHz (1085.4 GFLOPS)	4× 16-bit (64-bit) LPDDR5-6400 @3200MHz (51.2GB/s) LPDDR5X-7500 @3750MHz (60.0GB/s)	MediaTek NPU 590	MediaTek Imagiq 790 Photo: 320MP Video: 4K (HDR)	5G NR Sub-6GHz, 4G LTE, tri-band GNSS, Bluetooth 5.3, Wi-Fi 6E (2x2)	Q4 2021 ^[2]
Dimensity 9000+ (MT6983 ^[3] MT6983W/CZA MT8798 MT8798Z/TNZA)		4 nm (TSMC N4)	1× Cortex-X2 @3.2GHz 3× Cortex-A710 @2.85GHz 4× Cortex-A510 @1.8GHz	Mali-G710 MC10 @848/950MHz (1085.4/1216 GFLOPS)		MediaTek NPU 590	MediaTek Imagiq 790 Photo: 320MP Video: 4K (HDR)		Q2 2022 ^[4]
Dimensity 9200 (MT6985 ^[5] MT6985W/CZA)		4 nm (TSMC N4P)	1× Cortex-X3 @3.05GHz 3× Cortex-A715 @2.85GHz 4× Cortex-A510 @1.8GHz	Immortalis-G715 MC11 @981MHz (2762.5 GFLOPS)	4× 16-bit (64-bit) LPDDR5X-8533 @4266MHz (68.2GB/s)	MediaTek NPU 690	MediaTek Imagiq 890 Photo: 320MP Video: 8K30, 4K60 (HDR)	5G NR Sub-6GHz &mmWave,4G LTE, quad-band GNSS, Bluetooth 5.3, Wi-Fi 7 (2x2)	Q4 2022 ^[6]
Dimensity 9200+ (MT6985 ^[7] MT6985W/TCZA)		4 nm (TSMC N4P)	1× Cortex-X3 @3.35GHz 3× Cortex-A715 @3.0GHz 4× Cortex-A510 @2.0GHz	Immortalis-G715 MC11 @981MHz/ 1.15GHz (2762.5/ 3238.4 GFLOPS)	4× 16-bit (64-bit) LPDDR5X-8533 @4266MHz (68.2GB/s)	MediaTek NPU 690	MediaTek Imagiq 890 Photo: 320MP Video: 8K30, 4K60 (HDR)		Q2 2023 ^[8]
Dimensity 9300 (MT6989 ^[9] MT6989W/CZA MT8796 ^[10] MT8796W/CNZA)	ARM v9.2-A (64-bit)	4 nm (TSMC N4P)	1× Cortex-X4 @3.25GHz 3× Cortex-X4 @2.85GHz 4× Cortex-A720 @2.0GHz	Immortalis-G720 MC12 @1300MHz (3993.6 GFLOPS)	4× 16-bit (64-bit) LPDDR5T-9600 @4800MHz (76.8GB/s)	MediaTek NPU 790	MediaTek Imagiq 990 Photo: 320MP Video: 8K30, 4K60 (HDR)	5G NR Sub-6GHz &mmWave,4G LTE, quad-band GNSS, Bluetooth 5.4, Wi-Fi 7 (2x2) Bluetooth 6.0	Q4 2023 ^[11]
Dimensity 9300+ (MT6989 ^[12] MT6989W/TCZA)			1× Cortex-X4 @3.4GHz 3× Cortex-X4 @2.85GHz 4× Cortex-A720 @2.0GHz		4× 16-bit (64-bit) LPDDR5T-9600 @4800MHz (76.8GB/s)				Q2 2024 ^[13]
Dimensity 9400e (MT6989 ^[14] MT6989W/Z)					4× 16-bit (64-bit) LPDDR5X-8533 @4266MHz (68.2GB/s))				Q2 2025 ^[15]
Dimensity 9400 (MT6991 ^[16] MT6991Z/CZA MT6991W/CZA)		3 nm (TSMC N3E)	1× Cortex-X925 @3.62GHz 3× Cortex-X4 @3.3GHz 4× Cortex-A720 @2.4GHz	Immortalis-G925 MC12 @1612MHz (4952.1 GFLOPS)	4× 16-bit (64-bit) LPDDR5X-10667 @5333MHz (85.3GB/s)	MediaTek NPU 890	MediaTek Imagiq 1090 Photo: 320MP Video: 8K60 (HDR)	5G NR Sub-6GHz, 4G LTE, quad- band GNSS, Bluetooth 6.0, Wi-Fi 7 (3x3/5x4)	Q4 2024 ^[17]
Dimensity 9400+ (MT6991 ^[18] MT6991Z/TCZA)		3 nm (TSMC N3E)	1× Cortex-X925 @3.73GHz 3× Cortex-X4 @3.3GHz 4× Cortex-A720 @2.4GHz	Immortalis-G925 MC12 @1612MHz (4952.1 GFLOPS)	4× 16-bit (64-bit) LPDDR5X-10667 @5333MHz (85.3GB/s)	MediaTek NPU 890	MediaTek Imagiq 1090 Photo: 320MP Video: 8K60 (HDR)		Q2 2025 ^[19]
Dimensity 9450
Dimensity 9500 (MT6992) ^[20]	ARM v9.2-A (64-bit)	3 nm (TSMC N3P)	1× Cortex-X930 @4.2GHz 3× Cortex-X930 @3.6GHz 4× Cortex-A730 @2.8GHz	Immortalis-G930 MC16 (Drage)	4× 16-bit (64-bit) LPDDR5X-10667	MediaTek NPU 890	MediaTek Imagiq 1090 Photo: 320MP Video: 8K60 (HDR)	5G NR Sub-6GHz, 4G LTE, quad- band GNSS, Bluetooth 6.0, Wi-Fi 7	Q2 2025

References[edit]

[1] Jump up ↑ MediaTek Dimensity 9000.

[2] Jump up ↑ MediaTek Officially Launches Dimensity 9000 Flagship Chip And Announces Adoption by Global Device Makers.

[3] Jump up ↑ MediaTek Dimensity 9000+.

[4] Jump up ↑ MediaTek Expands Flagship Smartphone Performance with the Dimensity 9000+.

[5] Jump up ↑ MediaTek Dimensity 9200.

[6] Jump up ↑ MediaTek Launches Flagship Dimensity 9200 Chipset for Incredible Performance and Unmatched Power Savings.

[7] Jump up ↑ MediaTek Dimensity 9200+.

[8] Jump up ↑ MediaTek Pushes Flagship Smartphone Performance Further with the Dimensity 9200+.

[9] Jump up ↑ MediaTek Dimensity 9300.

[10] Jump up ↑ MediaTek Dimensity 9300 (N4P) Transistor Characterization | TechInsights.

[11] Jump up ↑ MediaTek's New All Big Core Design for Flagship Dimensity 9300 Chipset Maximizes Smartphone Performance and Efficiency.

[12] Jump up ↑ MediaTek Dimensity 9300+.

[13] Jump up ↑ MediaTek Boosts Flagship Smartphone Performance with Dimensity 9300+ SoC.

[14] Jump up ↑ MediaTek Dimensity 9400e.

[15] Jump up ↑ MediaTek Delivers More Flagship-Class Experiences with Dimensity 9400e Mobile Platform.

[16] Jump up ↑ MediaTek Dimensity 9400.

[17] Jump up ↑ MediaTek’s Dimensity 9400 Flagship SoC Offers Extreme Performance and Efficiency for the Latest AI Experiences.

[18] Jump up ↑ MediaTek Dimensity 9400+.

[19] Jump up ↑ MediaTek Enhances Flagship AI Performance with Dimensity 9400+ Mobile Platform.

[20] Jump up ↑ MediaTek Dimensity 9500.

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designer	MediaTek + and Arm Holdings +
first announced	November 26, 2019 +
full page name	mediatek/dimensity +
instance of	system on a chip family +
instruction set architecture	ARMv8 +
main designer	MediaTek +
manufacturer	TSMC +
microarchitecture	Cortex-A55 +, Cortex-A77 +, Cortex-A76 + and Cortex-A78 +
name	MediaTek Dimensity +
process	7 nm (0.007 μm, 7.0e-6 mm) + and 6 nm (0.006 μm, 6.0e-6 mm) +
technology	CMOS +
word size	64 bit (8 octets, 16 nibbles) +

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