The 180 nanometer (180 nm) lithography process is a full node semiconductor manufacturing process following the 220 nm process stopgap. Commercial integrated circuit manufacturing using 180 nm process began in late 1998. This technology was replaced by with 150 nm process (HN) in 2000 and 130 nm process (FN) in 2001.

Industry

The 180 nm process was first to use Cu metalization as a replacement for Al for interconnects.

Fab
Process Name​
1st Production​
Metal Layers​
​
Contacted Gate Pitch​
Interconnect Pitch (M1P)​
SRAM bit cell

Intel		Fujitsu		TSMC		Motorola		IBM		NEC		Samsung		TI		TI		AMD
P858		CS-80				HiPerMOS 6		CMOS-8S3						C07a		GS30
1999		2000		2000		2000		1998		2000		2001				2000		1999
7		6		6		7		7						6		5
Value	250 nm Δ	Value	250 nm Δ	Value	250 nm Δ	Value	220 nm Δ	Value	250 nm Δ	Value	250 nm Δ	Value	250 nm Δ	Value	250 nm Δ	Value	250 nm Δ	Value	250 nm Δ
480 nm	0.96x	? nm	?x	? nm	?x	? nm	?x	? nm	?x	? nm	?x	? nm	?x	? nm	?x	? nm	?x	? nm	?x
500 nm	0.82x	? nm	?x	? nm	?x	? nm	?x	? nm	?x	? nm	?x	? nm	?x	? nm	?x	? nm	?x	? nm	?x
5.59 µm2	0.54x	4.18 µm2	?x	4.65	0.62x	? µm2	?x	? µm2	?x	? µm2	?x	? µm2	?x	? µm2	?x	? µm2	?x	? µm2	?x

180 nm Microprocessors

• AMD
  • K6-III
  • Athlon
  • Athlon MP
  • Athlon XP
• Cyrix
  • Cyrix III
• DEC
  • Alpha 21264C
  • Alpha 21364
  • Alpha 21264B
• HAL (Fujitsu)
  • SPARC64 GP
• HP
  • PA-8700
  • PA-8700+
• IBM
  • RS64 IV
• Intel
  • Itanium
  • Itanium 2
  • Mobile Pentium III
  • Pentium 4
• Motorola
  • PowerPC
• Rapport
  • Kilocore (PipeRench)
• Sun
  • UltraSPARC IIi
  • UltraSPARC IIe

This list is incomplete; you can help by expanding it.

180 nm Microarchitectures

This list is incomplete; you can help by expanding it.