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2 µm lithography process
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The 2 µm lithography process was the semiconductor process technology used by the some semiconductor companies in the mid to late 1980s. By the mid 80s this process was replaced by 1.5 µm, 1.3 µm, and 1.2 µm processes.

Industry[edit]

Fab
Process Name​
1st Production​
Voltage​
 ​
Gate Length​
Interconnect Pitch (M1P)​
SRAM bit cell
Intel Intel Toshiba STMicro Motorola TI AMD Hitachi
P414.1 (HMOS-II) P421.X (HMOS-E) BCD-Offline Hi-CMOS II
1980 1980 1986 1992 1982
5 V
Value Value Value Value Value Value Value Value 3 µm Δ
 ? µm  ? µm  ? µm  ? µm  ? µm  ? µm  ? µm 2 µm 0.67x
 ? µm  ? µm  ? µm  ? µm  ? µm  ? µm  ? µm 3 µm 1.00x
 ? µm²  ? µm²  ? µm²  ? µm²  ? µm²  ? µm²  ? µm² 303.8 µm² 0.34x

Microprocessors[edit]

This list is incomplete; you can help by expanding it.

References[edit]

  • Minato, O., et al. "A Hi-CMOSII 8Kx8 bit static RAM." IEEE Journal of Solid-State Circuits 17.5 (1982): 793-798.
  • Meguro, S., et al. "Hi-CMOS III technology." Electron Devices Meeting, 1984 International. IEEE, 1984.