The 32 nm lithography process is a full node semiconductor manufacturing process following the 40 nm process stopgap. Commercial integrated circuit manufacturing using 32 nm process began in 2010. This technology was superseded by the 28 nm process (HN) / 22 nm process (FN) in 2012.

Industry

TSMC cancelled its planned 32nm node process.

Fab
Type​
​
Contacted Gate Pitch​
Interconnect Pitch (M1P)​
SRAM bit cell

Common Platform IBM, Freescale, AMD		Intel		TSMC		Samsung		Toshiba / NEC		Common Platform 2 IBM, STMicroelectronics, Frescale, Chartered, Infineon
PDSOI		Bulk
Value	45 nm Δ	Value	45 nm Δ	Value	45 nm Δ	Value	45 nm Δ	Value	45 nm Δ	Value	45 nm Δ
130 nm	0.68x	112.5 nm	0.63x	130 nm	0.80x	113.4 nm	?x	120 nm	?x	126 nm	?x
? nm	?x	112.5 nm	0.70x	? nm	?x	113.4 nm	?x	? nm	?x	?nm	?x
0.15 µm2	0.41	0.171 µm2	0.63x	0.15 µm2	0.62x	0.120 µm2	?x	0.124 µm2	?x	0.157 µm2	?x

Design Rules

Intel 32nm Design Rules
Layer	Pitch	Thick	Aspect Ratio
Isolation	140 nm	200	-
Contacted Gate	112.5 nm	35 nm	--
Metal 1	112.5 nm	95 nm	1.7
Metal 2	112.5 nm	95 nm	1.7
Metal 3	112.5 nm	95 nm	1.7
Metal 4	168.8 nm	151 nm	1.8
Metal 5	225.0 nm	204 nm	1.8
Metal 6	337.6 nm	303 nm	1.8
Metal 7	450.1 nm	388 nm	1.7
Metal 8	566.5 nm	504 nm	1.8
Metal 9	19.4 µm	8 µm	1.5

32 nm Microprocessors

• AMD
  • A8
  • A10
• Intel
  • Core i7EE

This list is incomplete; you can help by expanding it.

32 nm System on Chips

This list is incomplete; you can help by expanding it.

32 nm Microarchitectures

• Intel:
  • Saltwell
  • Sandy Bridge
  • Westmere

This list is incomplete; you can help by expanding it.