The 90 nm lithography process is a full node semiconductor manufacturing process following the 110 nm process stopgap. Commercial integrated circuit manufacturing using 90 nm process began in 2004. This technology was superseded by the 80 nm process (HN) / 65 nm process (FN) in 2006.

Industry

Intel

• 300mm (12-inch) wafers

	Measurement	Scaling from 130 nm
Contacted Gate Pitch	260 nm	0.82x
Interconnect Pitch (M1P)	220 nm	0.63x
SRAM bit cell	1.0 µm2	0.50x

90 nm Microprocessors

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90 nm System on Chips

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90 nm Microarchitectures

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