From WikiChip
16 nm lithography process
The 16 nanometer (16 nm) lithography process is a full node semiconductor manufacturing process following the 20 nm process stopgap. Commercial integrated circuit manufacturing using 16 nm process began in 2014. The term "16 nm" is simply a commercial name for a generation of a certain size and its technology, as opposed to gate length or half pitch. This technology is set to be replaced with 10 nm process in 2017.
Industry
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| Wafer |
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| Fin Pitch |
| Fin Width |
| Fin Height |
| Contacted Gate Pitch |
| Interconnect Pitch (M1P) |
| SRAM bit cell |
TSMC
TSMC demonstrated their 256 Mebibit SRAM wafer from their 7nm HKMG FinFET process. Their chip makes use of 34% of the area of their 16 nm process demo chip counterpart.
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16 nm Microprocessors
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16 nm Microarchitectures
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