Revision as of 22:04, 20 May 2018

Semiconductor lithography processes technology

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The 22 nanometer (22 nm) lithography process is a full node semiconductor manufacturing process following the 28 nm process stopgap. The term "22 nm" is simply a commercial name for a generation of a certain size and its technology, as opposed to gate length or half pitch. Commercial integrated circuit manufacturing using 22 nm process began in 2008 for memory and 2012 for MPUs. This technology was replaced by with 20 nm process (HN) in 2014 and 16 nm process (FN) in late 2015.

Industry

The 22 nm became Intel's first generation of Tri-gate FinFET transistors and the first such transistor on the market. This process became 3rd generation high-k + metal gate transistors for Intel. In 2017 Intel announce the introduction of a new process "22FFL" specifically for low power IOT and mobile products for their custom foundry.

Intel

Intel 22nm SoC Interconnect Design Rules
Layer	Pitch	Process	Dielectric Materials	CPU	SoC	Image
Fin	60 nm	-	-	Fin	Fin
Contact	90 nm	SAC	-	Contact	Contact
M1	90 nm	SAV	ULK CDO	M1	M1
MT - 1x	80 nm	SAV	ULK CDO	M2/M3	2-6 layers
MT - 1.4x	112 nm	SAV	ULK CDO	M4	Semi-global
MT - 2x	160 nm	SAV	ULK CDO	M5	Semi-global
MT - 3x	240 nm	SAV	ULK CDO	M6	Global Routing
MT - 4x	320 nm 360 nm	Via First	LK CDO	M7/M8	Global Routing
MT - TOP	14 µm	Plate Up	Polymer	M9	Top Metal

Find models

Click to browse all 22 nm MPU models

22 nm Microprocessors

• Intel
  • Core i3
  • Core i5
  • Core i7
  • Core i7EE
  • Xeon
  • Xeon E3
  • Xeon E5
  • Xeon E7

This list is incomplete; you can help by expanding it.

Click to browse all 22 nm MPU models

22 nm Microarchitectures

• Intel
  • Haswell
  • Ivy Bridge
  • Silvermont
• IBM
  • POWER8
  • z13

This list is incomplete; you can help by expanding it.

Documents

• Intel's 22FFL technology

References

• IEDM 2012
• IEDM 2014
• ISSCC 2015