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Difference between revisions of "500 nm lithography process"

(Industry)
(500 nm Microprocessors)
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** {{hp|PA-8000}} ("Onyx", "Vulcan")
 
** {{hp|PA-8000}} ("Onyx", "Vulcan")
 
* AMD
 
* AMD
** {{amd|80486}}
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** {{amd|Am486}}
 
** {{amd|K5}}
 
** {{amd|K5}}
 
* DEC
 
* DEC

Revision as of 18:06, 16 May 2016

The 500 nm lithography process is a full node semiconductor manufacturing process following the 600 nm process. Commercial integrated circuit manufacturing using 500 nm process began in 1992. 500 nm and was phased out and later replaced by 350 nm in 1995.

Industry

Fab
Process Name​
1st Production​
Metal Layers​
 ​
Contacted Gate Pitch​
Interconnect Pitch (M1P)​
SRAM bit cell
Intel AMD DEC Fujitsu Hitachi HP IBM TI Motorola National (BiCMOS)
P852 CMOS-5 CMOS14C CMOS-5X HiPerMOS 1 ABiC V
1994 1993 1993 1994 1994 1996 1994 1995 1995
3 4 3 4 5 4 4
Value 800 nm Δ Value 800 nm Δ Value 800 nm Δ Value 800 nm Δ Value 800 nm Δ Value 800 nm Δ Value 800 nm Δ Value 800 nm Δ Value 800 nm Δ Value 800 nm Δ
 ? nm  ?x  ? nm  ?x  ? nm  ?x  ? nm  ?x  ? nm  ?x  ? nm  ?x  ? nm  ?x  ? nm  ?x  ? nm  ?x  ? nm  ?x
 ? nm  ?x  ? nm  ?x  ? nm  ?x  ? nm  ?x  ? nm  ?x  ? nm  ?x  ? nm  ?x  ? nm  ?x  ? nm  ?x  ? nm  ?x
44 µm2 0.40x  ? µm2  ?x  ? µm2  ?x  ? µm2  ?x  ? µm2  ?x  ? µm2  ?x  ? µm2  ?x  ? µm2  ?x  ? µm2  ?x  ? µm2  ?x

500 nm Microprocessors

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500 nm Microarchitectures

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