Latest revision as of 05:15, 20 July 2018

Semiconductor lithography processes technology

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The 500 nanometer (500 nm) lithography process is a full node semiconductor manufacturing process following the 600 nm process. Commercial integrated circuit manufacturing using 500 nm process began in 1992. 500 nm and was phased out and later replaced by 350 nm in 1995.

Industry[edit]

DEC[edit]

See also: DEC's Process Technology History

DEC's half-micron process, CMOS-5, which was used for their microprocessors such as the Alpha 21164 used a Cabalt di-silicide in diffusion and poly with a channel length of 0.365 µm with a T_OX of 9 nm along with 4 metal layers of AlCu (Aluminum Copper). The process had a Vtn/p = 0.5/-0.5 V and a supply voltage of 3.3 V.

500 nm Microprocessors[edit]

• AMD
  • Am486
  • K5 ("SSA/5" models only)
• Cyrix
  • 6x86
• DEC
  • Alpha 21164
  • Alpha 21064A
  • Alpha 21164PC
• Exponential
  • X704
• Fujitsu
  • microSPARC II ("Swift")
• Hitachi
  • harp-1
• HP
  • PA-7200 ("Thunderbird")
  • PA-7300LC
  • PA-8000 ("Onyx", "Vulcan")
• IBM
  • PowerPC 601v
  • PowerPC 602
  • PowerPC 603
  • PowerPC 603e
• Intel
  • Pentium Pro
• NexGen
  • Nx586
• Qualcomm
  • MSM2
• Ross
  • hyperSPARC ("Colorado 2")
• Sun
  • microSPARC II, 1994
  • UltraSPARC

This list is incomplete; you can help by expanding it.

500 nm Microarchitectures[edit]

• AMD
  • K5
• DEC
  • Alpha 21164
• Intel
  • 80186 (embedded IP cores only)

This list is incomplete; you can help by expanding it.