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Difference between revisions of "800 nm lithography process"
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− | | 1991 || 1990 || colspan="2" | 1989 || 1991 || 1991 || 1989 || | + | | 1991 || 1990 || colspan="2" | 1989 || 1991 || 1991 || 1989 || 1989 || 1991 || 1991 || 1991 || || 1990 || 1990 |
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Revision as of 20:36, 8 May 2016
The 800 nm lithography process was a semiconductor manufacturing process used by the leading integrated circuit manufacturers in early 1990s. This process was later replaced by 650 nm, 600 nm, and 500 nm processes.
Industry
Fab |
---|
Process Name |
1st Production |
Metal Layers |
|
Contacted Gate Pitch |
Interconnect Pitch (M1P) |
SRAM bit cell |
Intel (BICMOS) | Intel (CHMOS V) | Intel (CMOS) | TI (CMOS) | TI (BiCMOS) | Cypress | AMD | Motorola | NEC | HP | HP | National (ASIC BiCMOS) | National (Memory BiCMOS) | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
P650 | CMOS26B | CMOS26G | ABiC IV | BiCMOS III | |||||||||
1991 | 1990 | 1989 | 1991 | 1991 | 1989 | 1989 | 1991 | 1991 | 1991 | 1990 | 1990 | ||
2 | 3 | 2 | 2 | 2 | 3 | 2 | 3 | 4 | 2 | ||||
Value | Value | Value | 1 µm Δ | Value | Value | Value | Value | Value | Value | Value | Value | Value | Value |
? nm | ? nm | ? nm | ?x | ? nm | ? nm | ? nm | ? nm | ? nm | ? nm | ? nm | ? nm | ? nm | ? nm |
? nm | ? nm | ? nm | ?x | ? nm | ? nm | ? nm | ? nm | ? nm | ? nm | ? nm | ? nm | 2.5 µm | 1.8 µm |
? µm2 | ? µm2 | 111 µm2 | 0.50x | ? µm2 | ? µm2 | ? µm2 | ? µm2 | ? µm2 | ? µm2 | ? µm2 | ? µm2 | 100 µm2 | ? µm2 |
800 nm Microprocessors
- Intel
- AMD
- Sun
- microSPARC I, 1992
- SuperSPARC II
- HP
- Motorola
- Cypress
- MIPS
This list is incomplete; you can help by expanding it.