Latest revision as of 23:04, 20 May 2018

Semiconductor lithography processes technology

1 nm • 18A 2 nm • 3 nm 5 nm • 7 nm 10 nm • 12 nm 14 nm • 16 nm 20 nm • 22 nm 28 nm • 32 nm 40 nm • 45 nm 55 nm • 65 nm 80 nm • 90 nm 110 nm • 130 nm 150 nm • 180 nm 220 nm • 240 nm 250 nm • 280 nm 350 nm • 500 nm 600 nm • 650 nm 700 nm • 750 nm 800 nm 1 µm • 1.2 µm 1.3 µm • 1.5 µm 2 µm • 2.5 µm 3 µm • 3.5 µm 5 µm • 6 µm 7 µm • 8 µm 10 µm • 16 µm 20 µm • 50 µm

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The 1.5 µm lithography process was the semiconductor process technology used by the major semiconductor companies in the mid 1980s. This process had an effective channel length of roughly 1.5 µm between the source and drain. By the late 80s this process was replaced by 1.3 µm, 1.2 µm, and 1 µm processes.

Industry[edit]

HP[edit]

DEC[edit]

DEC operated their 1.5 µm process (CMOS-2) at their Hudson foundry. This 2 ML process had an effective channel length of 0.9 µm with a polycide width of 1.5 µm (1.5 µm spacing) and a T_OX of 22.5 nm.

1.5 µm Microprocessors[edit]

• AMD
  • Am186
  • Am286
• Intel
  • 80286
  • 80386 DX
  • 80387
• HP
  • FOCUS
• Dec
  • Rigel

This list is incomplete; you can help by expanding it.

1.5 µm Microarchitectures[edit]

• ARM
  • ARM3
• Intel
  • 80386

This list is incomplete; you can help by expanding it.

• DEC
  • MicroPrism
  • MicroTitan