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Difference between revisions of "800 nm lithography process"
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Latest revision as of 22:04, 20 May 2018
The 800 nanometer (800 nm) lithography process was a semiconductor manufacturing process used by a variety of integrated circuit manufacturers in the late 1980s and early 1990s. A "0.8 µm process" refers to a process which has a gate length of 0.8 µm. This process was later replaced by 650 nm, 600 nm, and 500 nm processes.
Industry[edit]
Fab |
---|
Process Name |
1st Production |
Voltage |
Metal Layers |
|
Gate Length |
Interconnect Pitch (M1P) |
SRAM bit cell |
Intel (BICMOS) | Intel (CHMOS V) | TI (CMOS) | TI (BiCMOS) | Cypress | AMD | Motorola | NEC | HP | HP | National (ASIC BiCMOS) | National (Memory BiCMOS) | Hitachi | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
P650 | CMOS26B | CMOS26G | ABiC IV | BiCMOS III | |||||||||
1991 | 1989 | 1991 | 1991 | 1989 | 1989 | 1991 | 1991 | 1991 | 1990 | 1990 | |||
5 V | |||||||||||||
3 | 2 | 2 | 2 | 3 | 2 | 3 | 4 | 2 | 2 | ||||
Value | Value | 1 µm Δ | Value | Value | Value | Value | Value | Value | Value | Value | Value | Value | Value |
? nm | ? nm | ?x | ? nm | ? nm | ? nm | ? nm | ? nm | ? nm | ? nm | ? nm | ? nm | ? nm | 0.8 µm |
? nm | ? nm | ?x | ? nm | ? nm | ? nm | ? nm | ? nm | ? nm | ? nm | ? nm | 2.5 µm | 1.8 µm | 1.4 µm |
? µm² | 111 µm² | 0.50x | ? µm² | ? µm² | ? µm² | ? µm² | ? µm² | ? µm² | ? µm² | ? µm² | 100 µm² | ? µm² | ? µm² |
800 nm Microprocessors[edit]
- AMD
- Cypress
- HP
- Intel
- MIPS
- Motorola
- Qualcomm
- Sun
- microSPARC I, 1992
- SuperSPARC II
This list is incomplete; you can help by expanding it.
800 nm System on chips[edit]
- AMD
800 nm Microarchitectures[edit]
This list is incomplete; you can help by expanding it.