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Difference between revisions of "2 µm lithography process"

(Microprocessors)
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* DEC
 
* DEC
 
** {{decc|CVAX}}
 
** {{decc|CVAX}}
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* TI
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** {{ti|SBR9000}}
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* AMD
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** {{amd|Am29100}}
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** {{Amd|Am29500}}
 
{{expand list}}
 
{{expand list}}
  
  
 
[[Category:Lithography]]
 
[[Category:Lithography]]

Revision as of 21:22, 26 April 2016

The 2 µm lithography process was the semiconductor process technology used by the some semiconductor companies in the mid to late 1980s. By the mid 80s this process was replaced by 1.5 µm, 1.3 µm, and 1.2 µm processes.

Industry

Fab
Process Name​
1st Production​
 ​
Contacted Gate Pitch​
Interconnect Pitch (M1P)​
SRAM bit cell
Toshiba STMicro
BCD-Offline
1986 1992
Value Value
 ? nm  ? nm
 ? nm  ? nm
 ? µm2  ? µm2

Microprocessors

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