The 3 nanometer (3 nm or 30 Å) lithography process is a technology node semiconductor manufacturing process following the 5 nm process node. Commercial integrated circuit manufacturing using 5 nm process is set to begin sometimes around 2023.

The term "3 nm" is simply a commercial name for a generation of a certain size and its technology, and does not represent any geometry of the transistor.

Industry

Preliminary Data! Information presented in this article deal with future products, data, features, and specifications that have yet to be finalized, announced, or released. Information may be incomplete and can change by final release.

Process Name
1st Production
Lithography	Lithography
	Immersion
	Exposure
Wafer	Type
	Size
Transistor	Type
	Voltage
Fin	Pitch
	Width
	Height
Gate Length (Lg)
Contacted Gate Pitch (CPP)
Minimum Metal Pitch (MMP)
SRAM bitcell	High-Perf (HP)
	High-Density (HD)
	Low-Voltage (LV)
DRAM bitcell	eDRAM

Intel		TSMC		GlobalFoundries		Samsung
P1280? (CPU), P1281? (SoC)						3LLP 3nm Low Power Plus
EUV		EUV		EUV		EUV
SE		SE		SE		SE
Bulk		Bulk		Bulk		Bulk
300 nm		300 nm		300 nm		300 nm
						GAA
Value	5 nm Δ	Value	5 nm Δ	Value	5 nm Δ	Value	5 nm Δ
						N/A

Samsung

On May 24 2017 Samsung announced they will be switching to a transistor they call Multi-Bridge-Channel FET (MBCFET), an extension of a Gate-all-around (GAA) FET. This is planned for somewhere after the 5nm node but the exact timeline or specification is currently unknown.

3.5 nm Microprocessors

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3.5 nm Microarchitectures

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References

• Kinam Kim, President of Semiconductor Business, announced MBCFET for the node after 5 nm, May 24, 2017