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20 nm lithography process
The 20 nanometer (20 nm) lithography process is a half-node semiconductor manufacturing process used as a stopgap between the 22 nm and 16 nm processes. The term "20 nm" is simply a commercial name for a generation of a certain size and its technology, as opposed to gate length or half pitch. Commercial integrated circuit manufacturing using 20 nm process began in 2014. This technology superseded by commercial 16 nm process.
Industry
Process Name | |
---|---|
1st Production | |
Lithography | Lithography |
Immersion | |
Exposure | |
Wafer | Type |
Size | |
Transistor | Type |
Voltage | |
Metal Layers | |
Gate Length (Lg) | |
Contacted Gate Pitch (CPP) | |
Minimum Metal Pitch (MMP) | |
SRAM bitcell | High-Perf (HP) |
High-Density (HD) | |
Low-Voltage (LV) | |
DRAM bitcell | eDRAM |
TSMC | IBM Common Platform Alliance The IBM Common Platform Alliance is a joint effort by IBM, Samsung, GlobalFoundries, Toshiba, STMicroelectronics
| ||
---|---|---|---|
2014 | 2014 | ||
193 nm | 193 nm | ||
Yes | Yes | ||
Bulk | Bulk | ||
300 mm | 300 mm | ||
Planar | Planar | ||
0.95 V | 0.9 V | ||
10 | |||
Value | 28 nm Δ | Value | 28 nm Δ |
20 nm | 0.67x | ||
90 nm | 0.77x | 86 nm | 0.76 |
64 nm | 0.67x | 64 nm | 0.71x |
0.102 µm² | |||
0.081 µm² | 0.64x | 0.081 µm² | 0.68x |
TSMC
TSMC demonstrated their 112 Mebibit SRAM wafer from their 20 nm HKMG process at the 2013 IEEE ISSCC.
20 nm Microprocessors
- MediaTek
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20 nm Microarchitectures
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References
- Chang, Jonathan, et al. "A 20nm 112Mb SRAM in High-к metal-gate with assist circuitry for low-leakage and low-V MIN applications." Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2013 IEEE International. IEEE, 2013.
- Shang, Huiling, et al. "High performance bulk planar 20nm CMOS technology for low power mobile applications." VLSI Technology (VLSIT), 2012 Symposium on. IEEE, 2012.