The 350 nm lithography process is a full node semiconductor manufacturing process following the 500 nm process node. Commercial integrated circuit manufacturing using 350 nm process began in late 1995. 350 nm was phased out and replaced by 250 nm in 1999.

Industry

Fab
Process Name​
1st Production​
Metal Layers​
​
Contacted Gate Pitch​
Interconnect Pitch (M1P)​
SRAM bit cell

Intel		IBM		AMD		DEC		Fujitsu		IDT		NEC		TI		Motorola		Hitachi
P854						CMOS-6		CS-60								HiPerMOS 2
1994		1994		1997		1995		1996		1996		1995		1997		1996
4		5		5		6		5		3		4		5
Value	500 nm Δ	Value	500 nm Δ	Value	500 nm Δ	Value	500 nm Δ	Value	500 nm Δ	Value	500 nm Δ	Value	500 nm Δ	Value	500 nm Δ	Value	500 nm Δ	Value	500 nm Δ
550 nm	?x	? nm	?x	? nm	?x	? nm	?x	? nm	?x	? nm	?x	? nm	?x	? nm	?x	? nm	?x	? nm	?x
880 nm	?x	? nm	?x	? nm	?x	? nm	?x	? nm	?x	? nm	?x	? nm	?x	? nm	?x	? nm	?x	? nm	?x
18.1 µm2	0.41x	? µm2	?x	? µm2	?x	? µm2	?x	? µm2	?x	? µm2	?x	? µm2	?x	? µm2	?x	? µm2	?x	21.67 µm2	?x

Design Rules

Intel 0.350 micron Design Rules
Layer	Pitch	Thick
Isolation	? nm	? nm
Polysilicon	? nm	? nm
Metal 1	880 nm	600 nm
Metal 2	1.16 µm	800 nm
Metal 3	1.16 µm	800 nm
Metal 4	1.70 µm	1.70 µm

350 nm Microprocessors

• Intel
  • Pentium
  • Pentium MMX
  • Pentium OverDrive MMX
  • Pentium II
  • Mobile Pentium II
• AMD
  • Enhanced Am486
  • K6
• DEC
  • Alpha 21164A
  • Alpha 21264
• HAL
  • SPARC64 II
• Fujitsu
  • TurboSPARC
• IBM
  • PowerPC 603ev
  • PowerPC 604
  • PowerPC 604e
  • PowerPC RS64-II
• Cyrix
  • 6x86
• MIPS
  • R5000
  • R10000
  • R4400
• Sun
  • UltraSPARC II
  • UltraSPARC IIi
• NEC
  • VR4300
• Parallax
  • Propeller 1

This list is incomplete; you can help by expanding it.

350 nm Microarchitectures

This list is incomplete; you can help by expanding it.