The 45 nm lithography process is a full node semiconductor manufacturing process following the 55 nm process stopgap. Commercial integrated circuit manufacturing using 45 nm process began in 2007. This technology was superseded by the 40 nm process (HN) / 32 nm process (FN) in 2010.

Industry

Fab
Process Name​
1st Production​
Type​
Wafer​
​
Contacted Gate Pitch​
Interconnect Pitch (M1P)​
SRAM bit cell (HD)​
SRAM bit cell (LP)​
DRAM bit cell

Intel		Fujitsu		TI		Toshiba / Sony / NEC		IBM / Toshiba / Sony / AMD
P1266		CS-300
2007		2008		2008		2006		2007
Bulk								PDSOI
300mm
Value	65 nm Δ	Value	65 nm Δ	Value	65 nm Δ	Value	65 nm Δ	Value	65 nm Δ
180 nm	0.82x	190 nm	?x	? nm	?x	180 nm	?x	190 nm	0.76x
160 nm	0.76x	? nm	?x	? nm	?x	? nm	?x	? nm	?x
0.346 µm2	0.61x	0.225 µm2	?x	0.255 µm2	?x	0.248 µm2	?x	0.370 µm2	0.57x
								0.067 µm2	0.53x

Design Rules

Design Rules
Layer	Pitch	Thick	Aspect Ratio
Isolation	200 nm	200 nm	-
Contacted Gate	180 nm	60 nm	--
Metal 1	160 nm	144 nm	1.8
Metal 2	160 nm	144 nm	1.8
Metal 3	160 nm	144 nm	1.8
Metal 4	240 nm	216 nm	1.8
Metal 5	280 nm	252 nm	1.8
Metal 6	360 nm	324 nm	1.8
Metal 7	560 nm	504 nm	1.7
Metal 8	810 nm	720 nm	1.8
Metal 9	30.5 µm	7 µm	0.4

45 nm Microprocessors

• AMD
  • Athlon II
  • Opteron
  • Phenom II
• IBM
  • Power7
• Intel
  • Atom
  • Celeron
  • Core 2 Duo
  • Core 2 Extreme
  • Core 2 Quad
  • Core 2 Quad Extreme
  • Core 2 Solo
  • Core i3
  • Core i5
  • Core i7
  • Core i7EE
  • Pentium Dual-Core
  • Pentium
  • Xeon

This list is incomplete; you can help by expanding it.

45 nm System on Chips

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45 nm Microarchitectures

• Intel:
  • Bonnell
  • Nehalem
  • Penryn

This list is incomplete; you can help by expanding it.