The 2 µm lithography process was the semiconductor process technology used by the some semiconductor companies in the mid to late 1980s. By the mid 80s this process was replaced by 1.5 µm, 1.3 µm, and 1.2 µm processes.

Industry

Fab
Process Name​
1st Production​
Voltage​
​
Gate Length​
Interconnect Pitch (M1P)​
SRAM bit cell

Intel	Intel	Toshiba	STMicro	Motorola	TI	AMD	Hitachi
P414.1 (HMOS-II)	P421.X (HMOS-E)		BCD-Offline				Hi-CMOS II
1980	1980	1986	1992				1982
							5 V
Value	Value	Value	Value	Value	Value	Value	Value	3 µm Δ
? µm	? µm	? µm	? µm	? µm	? µm	? µm	2 µm	0.67x
? µm	? µm	? µm	? µm	? µm	? µm	? µm	3 µm	1.00x
? µm²	? µm²	? µm²	? µm²	? µm²	? µm²	? µm²	303.8 µm²	0.34x

Microprocessors

• Motorola
  • 68020
• MIPS
  • R2000
• DEC
  • CVAX
• TI
  • SBR9000
• AMD
  • Am29100
  • Am29500

This list is incomplete; you can help by expanding it.

References

• Minato, O., et al. "A Hi-CMOSII 8Kx8 bit static RAM." IEEE Journal of Solid-State Circuits 17.5 (1982): 793-798.
• Meguro, S., et al. "Hi-CMOS III technology." Electron Devices Meeting, 1984 International. IEEE, 1984.