90 nm lithography process

Semiconductor lithography processes technology

1 nm • 18A
2 nm • 3 nm
5 nm • 7 nm
10 nm • 12 nm
14 nm • 16 nm
20 nm • 22 nm
28 nm • 32 nm
40 nm • 45 nm
55 nm • 65 nm
80 nm • 90 nm
110 nm • 130 nm
150 nm • 180 nm
220 nm • 240 nm
250 nm • 280 nm
350 nm • 500 nm
600 nm • 650 nm
700 nm • 750 nm
800 nm
1 µm • 1.2 µm
1.3 µm • 1.5 µm
2 µm • 2.5 µm
3 µm • 3.5 µm
5 µm • 6 µm
7 µm • 8 µm
10 µm • 16 µm
20 µm • 50 µm

The 90 nm lithography process is a full node semiconductor manufacturing process following the 110 nm process stopgap. Commercial integrated circuit manufacturing using 90 nm process began in 2004. This technology was superseded by the 80 nm process (HN) / 65 nm process (FN) in 2006.

Industry

Fab
Type

Contacted Gate Pitch
Interconnect Pitch (M1P)
SRAM bit cell

Intel		TSMC		Samsung		Fujitsu		IBM / Toshiba / Sony / AMD / Chartered
Bulk								PDSOI
Value	130 nm Δ	Value	130 nm Δ	Value	130 nm Δ	Value	130 nm Δ	Value	130 nm Δ
260 nm	0.82x	240 nm	0.77x	245 nm	0.70x	? nm	?x	? nm	?x
220 nm	0.63x	240 nm	0.71x	245 nm	0.70x	? nm	?x	? nm	?x
1.0 µm²	0.50x	0.999 µm²	?x	0.999 µm²	?x	1.07 µm²	0.54x	0.999 µm²	?x

90 nm Microprocessors

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90 nm System on Chips

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90 nm Microarchitectures

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WikiChip

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Social Media

Companies

Microarchitectures

Technology Nodes

Intel

AMD

ARM

Cavium

Samsung

Intel

AMD

Ampere

Apple

Cavium

HiSilicon

MediaTek

NXP

Qualcomm

Renesas

Samsung

Contents

Industry

90 nm Microprocessors

90 nm System on Chips

90 nm Microarchitectures