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Difference between revisions of "55 nm lithography process"

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{{lithography processes}}
 
{{lithography processes}}
The '''55 nm lithography process''' is a [[technology node#half node|half-node]] semiconductor manufacturing process used as a stopgap between the [[65 nm lithography process|65 nm]] and [[45 nm lithography process|45 nm]] processes. Commercial [[integrated circuit]] manufacturing using 55 nm process began in late 2006 by companies such as [[TSMC]] and [[NEC]]. This technology superseded by commercial [[45 nm lithography process|45 nm process]].
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The '''55 nanometer (55 nm) lithography process''' is a [[technology node#half node|half-node]] semiconductor manufacturing process used as a stopgap between the [[65 nm lithography process|65 nm]] and [[45 nm lithography process|45 nm]] processes. Commercial [[integrated circuit]] manufacturing using 55 nm process began in late 2006 by companies such as [[TSMC]] and [[NEC]]. This technology superseded by commercial [[45 nm lithography process|45 nm process]].
  
 
== 55 nm Microprocessors==
 
== 55 nm Microprocessors==
 
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Revision as of 04:55, 24 May 2016

The 55 nanometer (55 nm) lithography process is a half-node semiconductor manufacturing process used as a stopgap between the 65 nm and 45 nm processes. Commercial integrated circuit manufacturing using 55 nm process began in late 2006 by companies such as TSMC and NEC. This technology superseded by commercial 45 nm process.

55 nm Microprocessors

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