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Difference between revisions of "10 µm lithography process"
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Revision as of 07:34, 27 April 2016
The 10 µm lithography process was the semiconductor process technology used by the major semiconductor companies during the years of 1967 and 1973. The typical wafer size for this process at companies such as Fairchild and TI were 1.5 inch (38 mm).
Industry
Fab |
---|
Process Name |
1st Production |
Contacted Gate Pitch |
Interconnect Pitch |
Metal Layers |
Technology |
Wafer |
Intel | TI | RCA | Fairchild | National |
---|---|---|---|---|
1970 | 1969 | 1969 | ||
? nm | ? nm | ? nm | ? nm | ? nm |
? nm | ? nm | ? nm | ? nm | ? nm |
2 | 2 | 2 | 2 | |
PMOS | PMOS | CMOS | PMOS | PMOS |
51 mm |
10 µm Microprocessors
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Click to browse all 10 µm models
10 µm Chips
- Intel
- RCA
This list is incomplete; you can help by expanding it.
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